Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | 5880 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | 5880 |
| Certification | ISO9001 | Place of Origin | China |
4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)
We present our 4-Layer RT/duroid 5880 + FR4 Hybrid PCB – a high-performance, ultra-low-loss circuit board engineered for demanding millimeter-wave, Ku-band, and aerospace applications. The top RF section utilizes Rogers RT/duroid 5880 glass microfiber-reinforced PTFE laminate (Dk 2.20 ±0.02, Df 0.0009 @ 10 GHz), while the bottom layers use High Tg FR4 for mechanical support and cost optimization. This hybrid construction features a 6-layer copper structure (4-layer PCB with additional copper planes), finished with Immersion Gold (2µ") , blue solder mask, and white silkscreen. The board includes controlled depth trenches and meets IPC-6012 Class 3 reliability standards, with 25µm copper plating in each via.
Key Specifications
| Parameter | Details |
| Product Type | 4-Layer Hybrid High-Frequency PCB (6-Layer Copper Structure) |
| Base Materials | RT/duroid 5880 (Top RF section) + High Tg FR4 (Bottom section) |
| Finished Board Thickness | 1.0 mm |
| Board Dimensions | 90 mm × 80 mm = 1 piece |
| Inner Layer Copper Weight | 0.5 oz (17.5 μm) |
| Outer Layer Copper Weight | 1 oz (35 μm) finished |
| Total Copper Layers | 6 (including internal ground/power planes) |
| Solder Mask | Blue (Top & Bottom) |
| Silkscreen | White (Top) |
| Surface Finish | Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness |
| Via Plating Thickness | 25 μm (1 mil) minimum in each hole |
| Special Features | Controlled depth trench (routed cavity / channel) |
| Quality Standard | IPC-6012 Class 3 (High Reliability) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
PCB Stackup (4-Layer with 6-Layer Copper Structure)
What is RT/duroid 5880?
RT/duroid® 5880 is a glass microfiber-reinforced PTFE composite from Rogers Corporation, designed for exacting stripline and microstrip circuit applications. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency.
With the lowest dissipation factor (0.0009 @ 10 GHz) of any reinforced PTFE material, RT/duroid 5880 extends its usefulness to Ku-band, K-band, Ka-band, and millimeter-wave frequencies (up to 100 GHz+). It is easily cut, sheared, and machined to shape, and resistant to all solvents and reagents used in etching printed circuits or plating edges and holes.
Key Properties of RT/duroid 5880
| Property | Typical Value | Condition | Test Method |
| Dielectric Constant (Dk) – Process | 2.20 ±0.02 | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dielectric Constant (Dk) – Design | 2.2 | 8–40 GHz | Differential Phase Length Method |
| Dissipation Factor (Df) | 0.0009 | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.0004 | 1 MHz / 23°C | IPC-TM-650 2.5.5.3 |
| Thermal Coefficient of Dk (TCDk) | -125 ppm/°C | -50 to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 × 10⁷ MΩ·cm | C96/35/90 | ASTM D257 |
| Surface Resistivity | 3 × 10⁷ MΩ | C96/35/90 | ASTM D257 |
| Specific Heat | 0.96 J/g/K (0.23 cal/g/°C) | – | Calculated |
| Tensile Modulus (X @ 23°C) | 1,070 MPa (156 kpsi) | A | ASTM D638 |
| Tensile Modulus (Y @ 23°C) | 860 MPa (125 kpsi) | A | ASTM D638 |
| Tensile Strength (X @ 23°C) | 29 MPa (4.2 kpsi) | A | ASTM D638 |
| Tensile Strength (Y @ 23°C) | 27 MPa (3.9 kpsi) | A | ASTM D638 |
| Ultimate Strain (X @ 23°C) | 6.00% | A | ASTM D638 |
| Ultimate Strain (Y @ 23°C) | 4.90% | A | ASTM D638 |
| Compressive Modulus (Z @ 23°C) | 940 MPa (136 kpsi) | A | ASTM D695 |
| Moisture Absorption | 0.02% | 0.062" (1.6mm), D48/50 | ASTM D570 |
| Thermal Conductivity | 0.20 W/m/K | 80°C | ASTM C518 |
| CTE – X axis | 31 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| CTE – Y axis | 48 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| CTE – Z axis | 237 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| Td (Decomposition Temp.) | 500°C | TGA | ASTM D3850 |
| Density | 2.2 g/cm³ | – | ASTM D792 |
| Copper Peel Strength | 31.2 N/mm (5.5 pli) | After solder float, 1 oz EDC | IPC-TM-650 2.4.8 |
| Flammability | V-0 | – | UL 94 |
| Lead-Free Process Compatible | Yes | – | – |
Standard Thicknesses Available for RT/duroid 5880
| Thickness (inches) | Thickness (mm) | Tolerance |
| 0.005" | 0.127 mm | ±0.0005" |
| 0.010" | 0.254 mm | ±0.0007" |
| 0.020" | 0.508 mm | ±0.0015" |
| 0.031" | 0.787 mm | ±0.0020" |
| 0.062" | 1.575 mm | ±0.0030" |
Additional thicknesses available from 0.0035" to 0.375" in varying increments.
Key Advantages of RT/duroid 5880
| Advantage | Description |
| Ultra-Low Loss (Df 0.0009 @ 10 GHz) | Lowest loss of any reinforced PTFE material – ideal for millimeter-wave (up to 100 GHz+) |
| Tight Dk Tolerance (±0.02) | Predictable impedance and phase matching – critical for phased arrays |
| No Glass Weave Effect | Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE |
| Uniform Panel-to-Panel | Consistent electrical properties simplify high-volume production |
| Wide Frequency Stability | Dk constant from 500 MHz to 40 GHz+ |
| Low Moisture Absorption (0.02%) | Stable electrical performance in humid environments |
| Process-Friendly | Easily cut, sheared, and machined; resistant to solvents and reagents |
| Low Out-Gassing | Ideal for space and satellite applications |
Typical Applications of RT/duroid 5880
Millimeter-Wave Radar (Automotive, defense, weather)
Phased Array Antennas (5G/6G, satellite, defense)
Commercial Airline Broadband Antennas (In-Flight Connectivity)
Microstrip & Stripline Circuits (Filters, couplers, power dividers)
Satellite Communication Systems (Low out-gassing required)
Point-to-Point Digital Radio Antennas (Backhaul, microwave links)
Guidance Systems (Missile, drone, navigation)
Test & Measurement Fixtures (Up to 100 GHz)
Space-Grade RF Electronics
What is a Controlled Depth Trench?
A Controlled Depth Trench (also known as controlled depth routing, cavity routing, or pocket milling) is a precision machining process that removes material from specific layers of a PCB to a controlled and precise depth, without cutting through the entire board.
In this product, the controlled depth trench is machined into the RT/duroid 5880 section or specific FR4 layers to create:
Key Characteristics
| Parameter | Description |
| Process | CNC routing with depth control (Z-axis precision) |
| Depth Tolerance | Typically ±0.05 mm to ±0.10 mm depending on material |
| Minimum Trench Width | Typically ≥0.8 mm (depending on router bit diameter) |
| Trench Bottom Finish | Can stop on copper layer, prepreg, or within dielectric |
| Inspection Method | Optical or laser depth measurement |
Types of Controlled Depth Trenches
| Type | Description | Typical Application |
| Blind Trench | Stops within dielectric layer | Component cavity, air gap |
| Copper-Bottomed Trench | Stops on a copper layer | Thermal pad, grounding cavity |
| Through Trench (routed slot) | Cuts through entire board | Mechanical clearance, shielding |
| Step Trench | Multiple depths in one cavity | Multi-height component embedding |
Applications of Controlled Depth Trenches in RF PCBs
| Application | Benefit |
| Embedded Passives | Components recessed below surface – reduces height, improves RF performance |
| Air Cavities for RF MEMS | Provides free space around moving structures |
| Antenna Isolation Trenches | Reduces coupling between adjacent radiators |
| Heat Sink Access | Direct thermal path from component to heat sink |
| Wire Bond Pockets | Recessed area for IC wire bonding with short wire lengths |
| Shielding Can Seats | Precise recess for EMI shield placement |
| Dielectric Constant Tuning | Removing material locally changes effective Dk |
Design Considerations for Controlled Depth Trenches
| Consideration | Recommendation |
| Minimum Trench Width | ≥0.8 mm (larger for thicker boards) |
| Corner Radius | ≥0.4 mm (router bit diameter / 2) |
| Depth Tolerance | Specify ±0.05 mm minimum |
| Layer Registration | Critical for trenches stopping on copper layers |
| Fiberglass Fuzzing | PTFE materials (RT/5880) may require post-trench deburring |
| Inspection | Request depth measurement on first article |
Advantages of Controlled Depth Trenches
| Advantage | Description |
| Component Height Reduction | Embed components to reduce overall profile |
| Improved RF Performance | Air cavities reduce losses and parasitic effects |
| Thermal Management | Direct contact between component and heat sink |
| Shielding Integration | Precise seats for EMI shields |
| Design Flexibility | Enable hybrid assembly techniques |
Challenges & Mitigations
| Challenge | Mitigation |
| Depth Control Precision | Use CNC router with Z-axis feedback; specify tolerances |
| Burrs / Fuzzing (PTFE) | Use sharp tools; post-process with vapor honing or manual deburring |
| Layer Registration | Include fiducials; specify trench-to-feature tolerances |
| Increased Fabrication Cost | Balance complexity vs. performance benefit |
We support prototype to volume production with global shipping. Contact us for:
Trench depth measurement reports
Impedance control test coupons
Phase matching verification
Volume pricing and lead times
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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