Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Taconic |
| Model Number | RF-30A |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Taconic | Model Number | RF-30A |
| Certification | ISO9001 | Place of Origin | China |
2-Layer RF-30A High-Frequency PCB – 20mil (0.6mm) with ENIG Finish
Product Introduction
We present our 2-Layer RF-30A PCB – a high-performance, thin-profile circuit board engineered for demanding RF and microwave applications. Fabricated with RF-30A laminate (Dk 3.0, Df 0.003 @ 10 GHz) and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.6mm (20mil) board delivers excellent signal integrity, low insertion loss, and superior environmental stability. The thin dielectric profile minimizes parasitic effects, making it ideal for compact, high-frequency wireless and radar systems.
Key Specifications
| Parameter | Details |
| Base Material | RF-30A (High-performance RF-grade laminate) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.6 mm (20 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 4 / 6 mils |
| Min Hole Size | 0.25 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Top: Green / Bottom: None |
| Silkscreen | Top: White / Bottom: None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | RF-30A Laminate | 0.508 mm (20 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole, simplifying fabrication and reducing cost.
PCB Statistics
Dimensions: 85.6 mm × 99.8 mm (1 piece)
Components: 54
Total Pads: 43 (19 thru-hole, 24 SMT on top, 0 on bottom)
Vias: 36
Nets: 2 (Simple, high-speed RF signal paths)
Why RF-30A?
RF-30A is a next-generation RF laminate featuring an advanced resin system and optimized glass fabric reinforcement. Unlike conventional PTFE-based materials, RF-30A processes like standard FR4 – no special handling required – while delivering exceptional high-frequency performance. With a Tg >180°C, it fully supports 260°C lead-free assembly and offers outstanding thermal and chemical resistance for harsh operating environments.
Key Features of RF-30A
| Parameter | Value |
| Dielectric Constant (Dk) | 3.0 @ 10 GHz |
| Dissipation Factor (Df) | 0.003 @ 10 GHz |
| Tg (Glass Transition Temp.) | >180°C |
| Thermal Resistance (T260) | >90 minutes |
| Thermal Resistance (T288) | >30 minutes |
| Peel Strength (1 oz ED copper) | ≥9 lbs/inch |
| CTE – X axis | 9–11 ppm/°C |
| CTE – Y axis | 11–13 ppm/°C |
| CTE – Z axis | 38 ppm/°C |
| Moisture Absorption | 0.08% (ultra-low) |
| Thermal Conductivity | High (efficient heat dissipation) |
| Flammability Rating | UL 94-V0 |
| CAF Resistance | Excellent |
| Chemical Resistance | Excellent |
Benefits of This 20mil RF-30A PCB
Ultra-Low Loss: Df of 0.003 at 10 GHz minimizes signal attenuation for long RF traces.
Stable Dk: Consistent dielectric constant across frequency and temperature ensures predictable impedance control.
Thin Profile (20mil): Reduces parasitic capacitance and inductance, ideal for compact RF modules and portable devices.
Lead-Free Assembly Ready: Withstands 260°C reflow (T260 >90 min, T288 >30 min).
CTE Matched to Copper: X/Y CTE (9–13 ppm/°C) closely matches copper, reducing stress on plated vias and improving solder joint reliability.
ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top SMT pads).
Process-Friendly: No PTFE-specific handling – compatible with standard FR4 fabrication lines, reducing lead times and cost.
Reliable in Harsh Environments: Ultra-low moisture absorption (0.08%) and excellent CAF/chemical resistance ensure long-term field performance.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance (artwork supplied)
ISO 9001 certified production
Typical Applications
RF/Microwave Communication Devices
5G/6G Base Stations & Antennas
Radar Systems (automotive, defense, weather)
Satellite Communication Equipment
RF Power Amplifiers & Transceivers
Aerospace & Defense Electronics
High-Frequency Test Instruments
Automotive RF Components (V2X, radar, telematics)
Ordering Information
Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for lead times, impedance control reports, and volume pricing.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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