Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0

Product Specification

2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish

Product Introduction

We present our 2-Layer RT/duroid 6002 PCB – a premium high-frequency circuit board engineered for demanding microwave and RF applications. Fabricated with Rogers RT/duroid 6002 ceramic-filled PTFE laminate and finished with Immersion Silver, this 0.8mm (30mil) board delivers ultra-low loss (Df 0.0012 @ 10 GHz), exceptional dielectric constant stability (Dk 2.94 ±0.04), and outstanding dimensional stability. The absence of solder mask and silkscreen, combined with the Immersion Silver finish, provides a pure, low-loss RF path ideal for phased array antennas, radar systems, and space-grade electronics.

Key Specifications

PCB Stackup (2-Layer Rigid)

Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.

PCB Statistics

Dimensions: 156 mm × 87.9 mm (1 piece)

Components: 94

Total Pads: 241 (196 thru-hole, 45 SMT on top, 0 on bottom)

Vias: 126

Nets: 2 (Simple, high-performance RF signal paths)

Why RT/duroid 6002?

RT/duroid 6002 is a ceramic-filled PTFE composite engineered for complex microwave structures requiring a low dielectric constant and ultra-low loss. Unlike standard RF laminates, it offers a remarkably low thermal coefficient of Dk (12 ppm/°C), ensuring stable performance across wide temperature swings. With a decomposition temperature (Td) of 500°C and low out-gassing characteristics, it is ideally suited for space applications and other mission-critical environments.

Key Features of RT/duroid 6002

Benefits of This RT/duroid 6002 PCB

Ultra-Low Loss: Df of 0.0012 at 10 GHz minimizes insertion loss – ideal for long RF traces and high-sensitivity receivers.

Tight Dk Control: ±0.04 tolerance ensures predictable impedance and phase matching for phased array and beamforming networks.

Temperature Stable: Low thermal coefficient of Dk (12 ppm/°C) maintains consistent performance across operating temperature ranges.

Copper-Matched CTE: In-plane expansion coefficient matched to copper – excellent dimensional stability for temperature-sensitive applications.

Low Out-Gassing: Ideal for space applications, satellite communications, and vacuum environments.

Immersion Silver Finish: Provides a flat, solderable, low-loss surface with excellent conductivity and RF transparency. No solder mask or silkscreen eliminates dielectric interference on RF traces.

Multi-Layer Ready: Excellent mechanical and electrical properties support reliable multi-layer board constructions.

Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

ISO 9001 certified production

Typical Applications

Phased Array Antennas (military, commercial, 5G)

Ground-Based & Airborne Radar Systems

Global Positioning System (GPS) Antennas

Power Backplanes (high-frequency, low-loss)

Commercial Airline Collision Avoidance Systems (TCAS)

Beam Forming Networks

Satellite Communication Payloads

Space-Grade RF Electronics

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.

Contact us for:

Impedance control reports

Phase matching verification

Out-gassing test data (for space applications)

Volume pricing and lead times