Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Taconic |
| Model Number | TRF-45 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Taconic | Model Number | TRF-45 |
| Certification | ISO9001 | Place of Origin | China |
2-Layer TRF-45 High-Frequency PCB – 32mil (0.9mm) with Immersion Gold Finish
Product Introduction
We present our 2-Layer TRF-45 PCB – a high-performance, low-loss circuit board engineered for reliable RF and microwave applications. Fabricated with Taconic TRF-45 ceramic-filled PTFE laminate and finished with Immersion Gold (ENIG) , this 0.9mm (32mil) board delivers a stable dielectric constant (Dk 4.5 ±0.15 @ 10 GHz), low dissipation factor (Df 0.0035), and exceptional dimensional stability. The woven-glass reinforcement enables standard PTFE processing methods (shearing, drilling, plating), reducing lead times while maintaining high reliability for antenna and wireless communication systems.
Key Specifications
| Parameter | Details |
| Base Material | Taconic TRF-45 (Ceramic-filled, woven-glass reinforced PTFE) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.9 mm (32 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 4 / 6 mils |
| Min Hole Size | 0.25 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Top: Green / Bottom: None |
| Silkscreen | Top: White / Bottom: None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | Taconic TRF-45 Core | 0.813 mm (32 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole vias, simplifying fabrication and reducing cost.
PCB Statistics
Dimensions: 105 mm × 76 mm ±0.15 mm (1 piece)
Components: 42
Total Pads: 38 (25 thru-hole, 13 SMT on top, 0 on bottom)
Vias: 15
Nets: 2 (Simple, high-frequency signal paths)
Why TRF-45?
TRF-45 represents Taconic's next-generation low-loss, thermally stable laminate technology. As a ceramic-filled PTFE with woven-glass reinforcement, it offers superior dimensional stability compared to non-reinforced PTFE materials. The low and consistent Z-axis expansion across a wide temperature range (including lead-free soldering conditions) ensures reliable plated through-hole (PTH) integrity. Critically, TRF-45 can be sheared, drilled, and plated using standard PTFE woven fiberglass methods – no specialized processing required.
Key Features of TRF-45
| Parameter | Value |
| Dielectric Constant (Dk) | 4.5 ±0.15 @ 10 GHz (stable over temperature & frequency) |
| Dissipation Factor (Df) | 0.0035 @ 10 GHz |
| Moisture Absorption | 0.06% |
| CTE – X axis | 9 ppm/°C (50–150°C) |
| CTE – Y axis | 9 ppm/°C (50–150°C) |
| CTE – Z axis | 40 ppm/°C (50–150°C) |
| Thermal Conductivity | 0.43 W/m·K |
| Flammability Rating | UL 94-V0 |
Benefits of This 32mil TRF-45 PCB
Stable Dk Over Temperature: 4.5 ±0.15 ensures consistent impedance and phase response across operating conditions – critical for antenna and filter designs.
Low Loss Performance: Df of 0.0035 at 10 GHz minimizes signal attenuation for efficient RF transmission.
Dimensional Stability: Woven-glass reinforcement provides excellent X/Y stability with CTE of 9 ppm/°C – matched closely to copper.
Reliable PTH Integrity: Low and consistent Z-axis expansion (40 ppm/°C) reduces via cracking risk during soldering and thermal cycling.
Process-Friendly: Can be sheared, drilled, and plated using standard PTFE woven fiberglass methods – no exotic handling required.
Immersion Gold Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (13 top SMT pads). Green solder mask on top protects critical traces while leaving bottom exposed for optimal RF grounding.
Low Moisture Absorption: 0.06% ensures stable electrical performance in humid environments.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Typical Applications
Satellite Radio Antennas (SiriusXM, DAB)
RFID Antennas (UHF, microwave bands)
GPS Antennas (navigation, timing)
Patch Antennas for wireless communications
Low-Profile RF Modules
Automotive Telematics Antennas
Ordering Information
Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for:
Impedance control reports
Dk/Df test verification
Volume pricing and lead times
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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