| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | RT/duroid 5870 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | RT/duroid 5870 |
| Certification | ISO9001 | Place of Origin | China |
2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) with ENIG Finish
Product Introduction
We present our 2-Layer RT/duroid 5870 PCB – an ultra-thin, high-performance circuit board engineered for demanding stripline, microstrip, and millimeter-wave applications. Fabricated with Rogers RT/duroid 5870 glass microfiber-reinforced PTFE laminate and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.3mm (10mil) board delivers an exceptionally low and stable dielectric constant (Dk 2.33 ±0.02 @ 10 GHz) and ultra-low dissipation factor (Df 0.0012). The randomly oriented glass microfibers ensure isotropic electrical properties and uniform Dk from panel to panel – critical for phase-sensitive designs up to Ku-band and beyond.
Key Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 5870 (Glass microfiber-reinforced PTFE) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.3 mm (10 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 5 / 6 mils |
| Min Hole Size | 0.4 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | None (Top & Bottom) |
| Silkscreen | None (Top & Bottom) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | Rogers RT/duroid 5870 | 0.254 mm (10 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.
PCB Statistics
Dimensions: 85 mm × 36 mm ±0.15 mm (1 piece)
Components: 36
Total Pads: 56 (32 thru-hole, 24 SMT on top, 0 on bottom)
Vias: 28
Nets: 2
Why RT/duroid 5870?
RT/duroid 5870 is a glass microfiber-reinforced PTFE composite designed for exacting high-frequency circuits. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency. With the lowest electrical loss of any reinforced PTFE material, RT/duroid 5870 extends its usefulness to Ku-band, K-band, and millimeter-wave frequencies while remaining easily machinable using standard PTFE fabrication methods.
Key Features of RT/duroid 5870
| Parameter | Value |
| Dielectric Constant (Dk) | 2.33 ±0.02 @ 10 GHz |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz |
| Temperature Coefficient of Dk (TCDk) | -115 ppm/°C |
| Moisture Absorption | 0.02% (ultra-low) |
| CTE – X axis | 22 ppm/°C |
| CTE – Y axis | 28 ppm/°C |
| CTE – Z axis | 173 ppm/°C |
| Isotropic | Yes (random microfiber reinforcement) |
Benefits of This 10mil RT/duroid 5870 PCB
Ultra-Low & Stable Dk (2.33 ±0.02): Tight tolerance ensures predictable impedance and phase matching – critical for phased arrays and beamforming networks.
Lowest Loss Reinforced PTFE: Df of 0.0012 at 10 GHz – extends performance to Ku-band and millimeter-wave (up to 100 GHz+).
No Glass Weave Effect: Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE – ideal for long differential pairs and phase-sensitive circuits.
Uniform Panel-to-Panel: Consistent electrical properties simplify high-volume production without per-panel tuning.
Ultra-Thin 10mil Profile: Enables compact, low-profile designs and controlled impedance with narrow trace widths.
Process-Friendly: Easily cut, sheared, and machined to shape. Resistant to all solvents and reagents used in etching or plating edges and holes.
ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top pads). No solder mask preserves RF performance on exposed traces.
High Moisture Resistance: 0.02% moisture absorption ensures stable electrical performance in humid environments.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Typical Applications
Commercial Airline Broadband Antennas (In-Flight Connectivity)
Microstrip & Stripline Circuits (High-frequency filters, couplers, power dividers)
Millimeter-Wave Applications (5G NR FR2, E-band, V-band)
Radar Systems (Automotive, defense, weather)
Guidance Systems (Missile, drone, navigation)
Point-to-Point Digital Radio Antennas (Backhaul, microwave links)
Satellite Communication Downconverters
Test & Measurement Fixtures (Up to 100 GHz)
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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