Fabricated with TF600 DK6.0 modified PTFE/ceramic composite laminate 0.7mm

Product Specification

Payment Terms	T/T, Paypal	Supply Ability	50000pcs
Delivery Time	2-10 working days	Packaging Details	Packing
Model Number	TF600	Certification	ISO9001
Place of Origin	China

2-Layer TF600 High-Frequency PCB – 25mil (0.7mm) with ENIG Finish & Copper-Filled Vias

 

 

Product Introduction

We present our 2-Layer TF600 PCB – a high-performance, thermosetting RF circuit board engineered for applications demanding ultra-low dielectric loss, stable Dk, and reliable thermal performance. Fabricated with TF600 modified PTFE/ceramic composite laminate and finished with ENIG (Electroless Nickel Immersion Gold) , this 0.7mm (25mil) board delivers a stable dielectric constant (Dk 6.0 ±0.15 @ 10 GHz) and low dissipation factor (Df 0.0025). The glass-fiber-free construction ensures uniform electrical properties, while copper-filled vias on designated IC pads provide enhanced thermal and electrical conductivity for power-intensive RF components.

 

 

Key Specifications

Parameter	Details
Base Material	TF600 (Modified PTFE + ceramic fillers, no glass fiber cloth)
Layer Count	2 Layers (Double-sided)
Finished Thickness	0.7 mm (25 mil)
Copper Weight	1 oz (35 μm) on both outer layers
Min Trace/Space	5 / 6 mils
Min Hole Size	0.35 mm (Mechanical drilling)
Via Plating Thickness	20 μm
Surface Finish	ENIG
Solder Mask	None (Top & Bottom)
Silkscreen	Top: Black / Bottom: None
Special Feature	Copper-filled vias on designated IC pads
Electrical Test	100% prior to shipment
Artwork Format	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

 

 

PCB Stackup (2-Layer Rigid)

Layer	Material	Thickness
Top Copper	1 oz (35 μm)	–
Substrate	TF600 (Ceramic-filled modified PTFE)	0.635 mm (25 mil)
Bottom Copper	1 oz (35 μm)	–

 

 

PCB Statistics

 

Dimensions: 78 mm × 65 mm ±0.15 mm (1 piece)

Components: 43

Total Pads: 61 (32 thru-hole, 29 SMT on top, 0 on bottom)

Vias: 34

Nets: 2

 

Key Features of TF600

Parameter	Value
Dielectric Constant (Dk)	6.0 ±0.15 @ 10 GHz
Dissipation Factor (Df)	0.0025 @ 10 GHz
Tg (DSC)	>280°C
Thermal Resistance (T260)	>60 minutes
Thermal Resistance (T288)	>20 minutes
Peel Strength (1 oz ED copper)	≥0.80 N/mm (~9.2 lbs/inch)
CTE – X axis	14–16 ppm/°C
CTE – Y axis	12–14 ppm/°C
CTE – Z axis	40–45 ppm/°C
Moisture Absorption (Max.)	0.06%
Thermal Conductivity	0.60 W/m·K
Flammability Rating	UL 94-V0
CAF Resistance	High
Glass Fiber Cloth	None

 

 

Quality Assurance

100% electrical testing prior to shipment

Copper-filled vias on designated IC pads for enhanced thermal/electrical performance

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

 

 

Typical Applications

Microwave/RF Transceivers

5G/6G Massive MIMO Antennas

Radar Systems (Automotive ADAS, Aerospace)

Satellite Communication Payloads

High-Power RF Amplifiers

Test & Measurement Equipment (Vector Network Analyzers)

 

 

Explanation of TF600 Substrate

 

What is TF600?

TF600 is a thermosetting high-frequency laminate composed of modified PTFE resin combined with micron-sized ceramic fillers. Unlike traditional PTFE-based RF materials (such as Rogers RT/duroid series), TF600 uses a thermoset resin system modified with PTFE, offering a unique balance of high-frequency performance and manufacturability.

 

 

Key Characteristics That Define TF600

1. Ceramic-Filled, No Glass Fiber Cloth

Most RF laminates (e.g., standard PTFE/woven-glass) use fiberglass cloth for reinforcement. TF600 contains no glass fiber cloth. Instead, it uses micron-sized ceramic particles as the filler. This eliminates glass weave effects – a common cause of Dk variation and impedance mismatch in long differential pairs or phase-sensitive circuits. The result is uniform electrical properties across the entire panel.

 

2. Thermosetting (Not Thermoplastic)

Traditional PTFE (e.g., RT/duroid 5870/5880) is a thermoplastic – it softens with heat and requires specialized sodium-based treatment for plating. TF600 is a thermoset – it cures permanently and does not re-soften under heat. This provides:

• Better dimensional stability during soldering
• No special pre-plating treatment (unlike PTFE)
• Compatibility with standard FR4 fabrication processes (drilling, plating, lamination)

 

 

3. High Dk (6.0) for Miniaturization

With a Dk of 6.0 ±0.15, TF600 sits in the mid-to-high Dk range (compared to ~2.2–3.5 for low-Dk RF materials). This allows:

• Circuit miniaturization – shorter wavelengths in the material mean smaller passive components (filters, couplers, antennas)
• Controlled impedance with wider trace widths (easier to manufacture)
• Effective for patch antennas and resonators

 

 

4. Ultra-Low Loss (Df 0.0025)

A dissipation factor of 0.0025 at 10 GHz is exceptionally low for a thermosetting material. This means:

• Minimal signal insertion loss
• High Q-factor for resonant structures
• Suitable for high-power RF amplifiers (less heat generated in the dielectric)

 

 

5. High Thermal Stability (Tg >280°C)

With a glass transition temperature exceeding 280°C, TF600 withstands:

• Lead-free assembly (260°C reflow)
• Multiple soldering cycles without degradation
• T260 >60 minutes and T288 >20 minutes – excellent thermal resistance for thick boards or high-power designs

 

 

6. Copper-Matched CTE

The X/Y CTE (14–16 / 12–14 ppm/°C) is well-matched to copper (~17 ppm/°C), ensuring:

• Reliable plated through-hole (PTH) integrity
• Reduced stress on solder joints during thermal cycling
• Excellent dimensional stability

 

 

7. Low Moisture Absorption (0.06%)

Unlike some PTFE materials that can absorb moisture and shift Dk, TF600's 0.06% absorption ensures stable electrical performance in humid environments – critical for outdoor radar, automotive, and satellite applications.

 

 

8. FR4-Compatible Processing – The Key Advantage

Process	Traditional PTFE (e.g., RT/duroid)	TF600
Drilling	Requires sharp bits, special parameters	Standard FR4 parameters
Plating	Requires sodium napthanate treatment	No special treatment required
Lamination	High temperature, specialized process	Standard FR4 lamination
Handling	Soft, easily damaged	Rigid, robust

 

 

This means TF600 can be fabricated on standard FR4 production lines – reducing lead times and cost compared to exotic PTFE materials.

How TF600 Compares to Other Materials

Property	TF600	Rogers RO4350B	Rogers RT/duroid 6002	Standard FR4
Dk @ 10 GHz	6	3.48	2.94	~4.2 (not stable)
Df @ 10 GHz	0.0025	0.0037	0.0012	0.02+
Tg	>280°C	>280°C	500°C (Td)	135–170°C
Processing	FR4-compatible	FR4-compatible	PTFE-specialized	Standard
Glass-Free	Yes	No (woven glass)	Yes (ceramic-filled PTFE)	No
Cost	Mid-range	Mid-range	High	Low

 

 

When to Choose TF600

Choose TF600 when you need:

 

A stable Dk around 6.0 for circuit miniaturization

Ultra-low loss (Df 0.0025) without moving to expensive PTFE

FR4-compatible processing to reduce cost and lead time

High thermal reliability (Tg >280°C) for lead-free assembly and high-power RF

No glass weave effects – ideal for phase-sensitive arrays

Low moisture absorption for outdoor/harsh environments

 

 

Consider alternatives when:

You need Dk < 3.0 (look at RT/duroid 5870/5880 or RO3003)

You need Df < 0.0015 (look at RT/duroid 5880 or Teflon-based materials)

Your design is extremely cost-sensitive and frequencies are low (<1 GHz) – standard FR4 may suffice

 

 

Summary

TF600 is a modern, thermosetting, ceramic-filled RF laminate that bridges the gap between high-cost PTFE materials and lossy FR4. It offers stable Dk of 6.0, ultra-low loss of 0.0025, excellent thermal stability (Tg >280°C) , and – most importantly – FR4-compatible processing. The absence of glass fiber cloth eliminates Dk variation, making it ideal for 5G/6G antennas, automotive radar, satellite communications, and high-power RF amplifiers where signal integrity, miniaturization, and manufacturability are equally critical.