Fabricated microwave material Dk (12.85) 150mil 2-Layer TMM13i High-Frequency

Product Specification

Payment Terms	T/T, Paypal	Supply Ability	50000pcs
Delivery Time	2-10 working days	Packaging Details	Packing
Brand Name	Rogers	Model Number	TMM13i
Certification	ISO9001	Place of Origin	China

2-Layer TMM13i High-Frequency PCB – 150mil (3.9mm) with OSP Finish

 

 

Product Introduction

We present our 2-Layer TMM13i PCB – a high-performance, thick-substrate circuit board engineered for demanding RF and microwave applications requiring a high dielectric constant. Fabricated with Rogers TMM13i isotropic thermoset microwave material and finished with OSP (Organic Solderability Preservative) , this 3.9mm (150mil) board delivers a stable, isotropic Dk of 12.85 ±0.35, ultra-low dissipation factor (Df 0.0019 @ 10 GHz), and exceptional mechanical robustness. The thermoset resin sysatem resists creep and cold flow, withstands harsh process chemicals, and requires no sodium napthanate treatment prior to electroless plating – simplifying fabrication while ensuring reliable plated through-hole (PTH) performance for thick-board designs.

 

 

Key Specifications

Parameter	Details
Base Material	Rogers TMM13i (Isotropic thermoset microwave composite)
Layer Count	2 Layers (Double-sided)
Finished Thickness	3.9 mm (150 mil)
Copper Weight	1 oz (35 μm) on both outer layers
Min Trace/Space	4 / 5 mils
Min Hole Size	0.25 mm (Mechanical drilling)
Via Plating Thickness	20 μm
Surface Finish	OSP (Organic Solderability Preservative)
Solder Mask	None (Top & Bottom)
Silkscreen	None (Top & Bottom)
Electrical Test	100% prior to shipment
Artwork Format	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

 

 

PCB Stackup (2-Layer Rigid)

Layer	Material	Thickness
Top Copper	1 oz (35 μm)	–
Substrate	Rogers TMM13i	3.81 mm (150 mil)
Bottom Copper	1 oz (35 μm)	–

 

 

Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.

 

 

PCB Statistics

Dimensions: 76.8 mm × 97 mm (1 piece)

Components: 29

Total Pads: 47 (19 thru-hole, 28 SMT on top, 0 on bottom)

Vias: 26

Nets: 2

 

 

Why TMM13i?

TMM13i is a ceramic-thermoset polymer composite that combines the high-frequency performance of ceramic and PTFE substrates with the processing convenience of soft substrates. Unlike PTFE-based materials, TMM13i is a thermoset resin system that:

 

Resists creep and cold flow under mechanical stress

 

Withstands harsh process chemicals without damage

 

Requires no sodium napthanate treatment prior to electroless plating

 

Enables reliable wire-bonding for chip-and-wire assemblies

 

The isotropic dielectric constant (same Dk in all directions) simplifies design for complex 3D electromagnetic structures such as lenses, polarizers, and dielectric resonators.

 

 

Key Features of TMM13i

Parameter	Value
Dielectric Constant (Dk)	12.85 ±0.35 (Isotropic)
Dissipation Factor (Df)	0.0019 @ 10 GHz
Thermal Coefficient of Dk	-70 ppm/°K
CTE – X axis	19 ppm/°C (-55 to 288°C)
CTE – Y axis	19 ppm/°C (-55 to 288°C)
CTE – Z direction	20 ppm/°C (-55 to 288°C)
Flammability Rating	UL 94V-0
Lead-Free Process Compatible	Yes

 

 

Benefits of This 150mil TMM13i PCB

 

High & Stable Dk (12.85): Enables significant circuit miniaturization – ideal for dielectric resonators, filters, and compact antennas. ±0.35 tolerance ensures predictable performance.

 

Ultra-Low Loss: Df of 0.0019 at 10 GHz minimizes signal attenuation for high-sensitivity receivers and low-noise applications.

 

Isotropic Dk: Same dielectric constant in X, Y, and Z directions – simplifies design for 3D electromagnetic structures like lenses and polarizers.

 

Copper-Matched CTE: X/Y CTE of 19 ppm/°C closely matches copper, ensuring excellent PTH reliability even in this thick 150mil (3.9mm) board.

 

Exceptional Z-Axis Stability: Z-direction CTE of only 20 ppm/°C – remarkably low for a 3.9mm thick substrate – minimizes via barrel stress during thermal cycling.

 

Thermoset Robustness: Resists creep, cold flow, and process chemicals. No sodium napthanate treatment required – simplifies plating and reduces fabrication costs.

 

OSP Finish: Provides a flat, copper-preserving surface for SMT assembly (28 top pads). Ideal for applications requiring minimal surface finish interference with RF performance.

 

Wire-Bond Ready: Thermoset resin enables reliable gold wire bonding for chip-on-board (COB) assemblies.

 

 

Quality Assurance

 

100% electrical testing prior to shipment

 

IPC-Class-2 compliance

 

Full Gerber RS-274-X acceptance

 

ISO 9001 certified production

 

 

Typical Applications

 

Chip Testers & RF Socket Interfaces (high Dk for controlled impedance)

 

Dielectric Polarizers & Lenses (isotropic Dk enables uniform phase response)

 

Filters & Couplers (high Dk miniaturizes resonant structures)

 

RF & Microwave Circuitry (strip-line, micro-strip, and grounded coplanar waveguide)

 

Satellite Communication Systems (low loss, high stability, low out-gassing)

 

Dielectric Resonator Oscillators (DROs)

 

Patch Antennas (high Dk reduces footprint)

 

 

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.

 

Contact us for:

Impedance control reports

 

Dk/Df verification test data

 

PTH reliability test reports (thermal shock, solder float)

 

Volume pricing and lead times