RT/duroid 5880 + PP + TG170 FR-4 Hybrid PCB multi 3-Layer with ENIG and double

Product Specification

3-Layer Hybrid PCB: RT/duroid 5880 and FR-4

The three-layer hybrid PCB is a high-performance solution designed for RF and microwave applications, combining RT/duroid 5880, PP (prepreg), and TG170 FR-4 materials. This design ensures excellent electrical performance, mechanical reliability, and thermal stability.

1. PCB Specifications

This PCB design prioritizes high-frequency performance and precision, making it ideal for demanding applications like radar systems, antennas, and communication devices.

2. Further Information

2.1 Introduction to RT/duroid 5880

RT/duroid 5880 by Rogers Corporation is a high-frequency laminate specifically designed for RF and microwave applications. Its unique composition of PTFE reinforced with glass microfibers offers exceptional electrical, thermal, and mechanical performance.

Key Properties of RT/duroid 5880

Applications of RT/duroid 5880

• Antennas: Radar, satellite, and communication antennas.
• Microwave Circuits: High-frequency transmission lines, amplifiers, and filters.
• Aerospace and Defense: Guidance systems, radar, and advanced communication systems.
• Medical Devices: Imaging systems and diagnostic equipment.
• The material's low dielectric constant and minimal dissipation factor make it ideal for ensuring signal integrity in high-frequency environments.

2.2 What is a Hybrid PCB?

A hybrid PCB combines multiple materials, like RT/duroid 5880 and FR-4, to optimize the board's electrical, thermal, and mechanical properties. Each material contributes specific strengths, enabling the PCB to meet challenging design requirements.

Structure of the 3-Layer Hybrid PCB

Top Layer: RT/duroid 5880 for high-frequency performance.

Middle Layer: PP (prepreg) for bonding and insulation.

Bottom Layer: TG170 FR-4 (0.5mm) for structural support and thermal stability.

Advantages of Hybrid PCBs

Enhanced High-Frequency Performance: RT/duroid 5880 ensures low-loss signal transmission.

Thermal Stability: High Tg FR-4 supports reliable operation in high-temperature environments.

Cost-Effectiveness: Using FR-4 reduces overall costs compared to a pure PTFE-based PCB.

Design Flexibility: Combines the strengths of multiple materials to meet diverse application needs.

Applications of Hybrid PCBs

Telecommunications: Antennas, RF modules, and microwave circuits.

Aerospace and Defense: Radar systems, satellites, and guidance equipment.

Automotive: ADAS (Advanced Driver-Assistance Systems) and vehicle radar.

Medical: Imaging systems, RF therapy devices, and diagnostic systems.

3. Summary of Benefits

This hybrid PCB design leverages the unique properties of RT/duroid 5880 and FR-4, making it highly versatile. The stepped shape and 2.3mm lamination thickness allow for precise integration into advanced systems.

Why Choose Hybrid PCBs with RT/duroid 5880?

• Low Dielectric Constant: Ensures high signal integrity and minimal loss at high frequencies.
• Thermal Stability: Operates reliably in extreme environments.
• Cost-Efficiency: Combining FR-4 and RT/duroid reduces costs without sacrificing performance.
• Durability: Withstands mechanical and thermal stresses, ensuring long-term reliability.

Conclusion

The 3-layer hybrid PCB is a cutting-edge solution for RF and microwave applications. By combining RT/duroid 5880, PP, and TG170 FR-4, it achieves a perfect balance of performance, reliability, and cost-efficiency. Its stepped shape, immersion gold finish, and high-frequency properties make it ideal for telecommunications, aerospace, automotive, and medical industries.

Choose this hybrid PCB to ensure unmatched performance in your next high-frequency project!