Rogers RO4003C LoPro 2-Layer 16.7mil laminate PCB with ENEPIG Finish manufacture

Product Specification

16.7mil RO4003C LoPro 2-Layer PCB with ENEPIG Finish

The 16.7mil RO4003C Low Profile (LoPro) 2-Layer PCB is a high-performance printed circuit board specifically designed for applications requiring superior signal integrity, low insertion loss, and high thermal stability. Constructed from Rogers RO4003C LoPro laminates, this PCB provides excellent high-frequency performance while maintaining compatibility with standard FR-4 manufacturing processes. The ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finish ensures exceptional solderability, wire bonding capability, and corrosion resistance, making it ideal for RF, microwave, and high-frequency digital applications.

PCB Construction Details

PCB Stackup

PCB Statistics

The PCB is manufactured using Gerber RS-274-X artwork, ensuring precise and accurate fabrication for modern production requirements.

Material Overview: Rogers RO4003C LoPro

Rogers RO4003C LoPro laminates utilize a hydrocarbon ceramic system with reverse-treated copper foil, which reduces conductor loss and improves insertion loss while retaining the benefits of standard RO4003C laminates. These laminates offer a dielectric constant (Dk) of 3.38 ± 0.05 and a low dissipation factor (Df) of 0.0027 at 10GHz, making them ideal for high-frequency and high-speed digital applications.

The low Z-axis CTE ensures plated-through-hole reliability, and the high thermal conductivity supports efficient heat dissipation, making this material suitable for demanding thermal and electrical environments.

Key Features:

1. Dielectric Constant (Dk): 3.38 ± 0.05 for predictable and consistent signal integrity.
2. Low Dissipation Factor (Df): 0.0027 at 10GHz for minimal signal loss in high-frequency applications.
3. Thermal Stability: High Tg (>280°C) and low Z-axis CTE (46ppm/°C) ensure reliable performance under thermal stress.
4. Conductor Loss Reduction: LoPro technology improves insertion loss and signal integrity.
5. ENEPIG Surface Finish: Provides excellent solderability, corrosion resistance, and compatibility with wire bonding.

Key Benefits:

Improved Signal Integrity: Lower insertion loss allows for higher operating frequencies (>40GHz).

Cost-Effective Fabrication: Compatible with standard FR-4 processes, eliminating the need for specialized manufacturing steps.

Enhanced Thermal Performance: High thermal conductivity and low CTE improve durability in high-frequency and high-power applications.

Environmentally Friendly: Lead-free and RoHS compliant.

High Reliability: CAF resistance and high temperature processing ensure long-term durability.

Applications

Cellular base station antennas, power amplifiers

Low Noise Block (LNB) for direct broadcast satellites

Servers, routers, and high-speed backplanes

RF Identification Tags

Smart devices and wireless communication

Conclusion

The 16.7mil RO4003C LoPro 2-Layer PCB with ENEPIG Finish is a high-performance solution for RF, microwave, and high-speed digital designs. Utilizing Rogers’ LoPro laminates, this PCB delivers low insertion loss, exceptional signal integrity, and superior thermal stability. Its ENEPIG surface finish ensures excellent solderability and long-term durability, making it ideal for demanding applications such as telecommunications, aerospace, and IoT. With worldwide availability and compliance with IPC-Class-2 standards, this PCB is a reliable and efficient choice for engineers seeking to optimize performance and reduce costs in high-frequency applications.