| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | AGC |
| Model Number | TLX-8 |
| Certification | ISO9001 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | AGC | Model Number | TLX-8 |
| Certification | ISO9001 | Place of Origin | China |
TLX-8 Copper Clad Laminate: The Workhorse for High-Volume Microwave Applications
AGC introduces the TLX-8, a high-volume fiberglass reinforced PTFE microwave substrate engineered for reliability across a wide range of RF applications. With a proven space heritage and exceptional performance characteristics, TLX-8 has earned its reputation as a workhorse in the RF microwave substrate world—ideal for applications where mechanical reinforcement, environmental resistance, and consistent electrical performance are critical.
Electrical Performance
The TLX-8 features a dielectric constant (Dk) of 2.55 ±0.04 at 10 GHz, offering tight control that enables precise impedance matching and repeatable circuit performance. The dissipation factor (Df) is 0.0018 at 10 GHz, ensuring low signal loss for efficient power transmission.
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
Key electrical highlights include:
Excellent PIM Performance: Measured at lower than -160 dBc (tested with 20 watts per channel at 800 and 1800 MHz), making TLX-8 ideal for passive components and antenna systems
Environmental Resilience
TLX-8 is designed to withstand severe environments where many substrates would fail:
Thermal Performance:
Mechanical Properties:
Peel Strength: 2.63 N/mm (15 lbs/in) for 1 oz ED copper; 2.98 N/mm (17 lbs/in) for 1 oz RTF copper
Young's Modulus: 6,757 N/mm² (MD) and 8,274 N/mm² (CD) per ASTM D902
Dimensional Stability: 0.06-0.10 mm/m after thermal stress testing
Flammability Rating: UL 94 V-0
Versatile Applications For TLX-8
Antennas (including phased array and warship antennas)
Mixers, splitters, filters, and combiners
Passive components
Radar systems
Mobile communication systems
Microwave test equipment and transmission devices
Low layer count microwave designs
Processing and Fabrication
As a woven fiberglass reinforced PTFE laminate, TLX-8 offers excellent processability:
Standard PTFE Processing: Compatible with conventional fabrication techniques
Mechanical Processing: Easily sheared, drilled, and milled
Plated Through-Holes: Reliable via processing with standard methods
Dimensional Stability: Excellent stability throughout fabrication
Copper Options: Available with electrodeposited (ED), reverse treated (RTF), and rolled copper foils
Dielectric Thickness:
Range: 0.0025" to 0.250" (0.064mm to 6.35mm)
Available in 0.005" (0.125mm) increments
Standard Panel Sizes:
12" × 18" (305mm × 457mm)
16" × 18" (406mm × 457mm)
18" × 24" (457mm × 610mm) — standard size
16" × 36" (406mm × 914mm)
24" × 36" (610mm × 914mm)
18" × 48" (457mm × 1,220mm)
36" × 48" (914mm × 1,220mm)
Copper Cladding Options:
Electrodeposited (ED) copper: ½ oz. and 1 oz.
Reverse treated (RTF) copper: 1 oz.
Rolled copper: 1 oz.
Production Capabilities and Supply Chain
High-Volume Production: Scalable manufacturing for both prototype and high-volume requirements
Precision Manufacturing: Advanced PTFE processing technologies with tight process control
Quality Assurance: All test data provided as typical values; critical specifications available upon request
Custom Configurations: Additional thicknesses, panel sizes, and claddings available—contact AGC for details
Storage Requirements:
Transportation:
Why Choose TLX-8?
With its proven space heritage, exceptional environmental resilience, excellent PIM performance, and wide range of available configurations, TLX-8 is the reliable choice for engineers seeking a high-volume microwave substrate that performs consistently across demanding applications. Its combination of mechanical reinforcement, thermal stability, and electrical precision makes it a true workhorse in the RF industry.
Contact us today to discuss how TLX-8 can meet your specific high-frequency design requirements.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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