Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Rogers |
| Model Number | RO4003C |
| Certification | ISO9001 |
| Place of Origin | China |
View Detail Information
Explore similar products
Rogers RO4003C LoPro 20.7mil Double-Sided Copper Clad Laminate raw material
Fabricate 2-Layer TMM6 PCB built on 15mil laminate and double sided copper with
Rogers RO4835 2layer PCB built on 6.6mil laminate core with immersion Gold 1 oz
15mil TMM10 laminate 2-layer PCB with 1oz copper and EPIG Finish using in RF and
Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Rogers | Model Number | RO4003C |
| Certification | ISO9001 | Place of Origin | China |
8-Layer Multilayer PCB with RO4003C
This custom-engineered printed circuit board is designed for demanding high-frequency and high-speed digital applications. Featuring a robust multilayer stack-up of Rogers RO4003C laminates and RO4450F bondply, this board delivers exceptional signal integrity, thermal management, and mechanical stability.
Key Specifications
| Parameter | Details |
| Layer Count | 8 Layers |
| Material | RO4003C (Rogers Laminate) + RO4450F Prepreg |
| Core Build | 4 Core Boards: 1.524mm + 1.524mm + 0.762mm + 0.762mm |
| Lamination Thickness | 5.05 mm |
| Copper Weight | Outer: 1 oz / Inner: 0.5 oz |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Top: Green (No Legend) / Bottom: Green with White Lettering |
| Dimensions | 91 mm x 77 mm |
Material Advantage: RO4003C
The board utilizes RO4003C, a hydrocarbon ceramic laminate from Rogers Corporation. Unlike standard FR4, RO4003C offers:
Stable Dielectric Constant (Dk): 3.38 ± 0.05 for precise impedance control
Low Dissipation Factor (Df): 0.0027 @ 10 GHz minimizes signal loss
Excellent Thermal Conductivity: 0.71 W/m/K for efficient heat dissipation
Consistent Performance: Reliable across frequency and temperature variations
The RO4450F bondply ensures robust multilayer bonding and thermal stability throughout the stack.
Multilayer Board Fabrication Guide for RO4003C
Inner Layer Preparation
Surface Preparation: Chemical cleaning and micro-etching is recommended for thinner cores, while mechanical scrubbing is suitable for thicker laminates.
Oxide Treatment: RO4003C cores can be processed through standard copper oxide or alternative treatments to prepare for multilayer bonding.
Drilling Guidelines
| Parameter | Recommended Range |
| Surface Speed | 300-500 SFM (90-150 m/min) |
| Chip Load | 0.002"-0.004"/rev (0.05-0.10 mm) |
| Tool Type | Standard carbide drills |
| Tool Life | 2,000-3,000 hits |
Note: Drilling speeds above 500 SFM should be avoided. Expected hole wall roughness: 8-25 µm.
Plated Through-Hole (PTH) Processing
Desmear: Typically not required for double-sided boards. For multilayers, alkaline permanganate or plasma processes may be used.
Etchback: Not recommended as it may loosen filler particles.
Metallization: Compatible with standard electroless copper and direct deposition processes.
Routing Guidelines
| Tool Diameter | Spindle Speed | Feed Rate |
| 1/32" | 40k RPM | 50 IPM |
| 1/16" | 25k RPM | 31 IPM |
| 1/8" | 15k RPM | 25 IPM |
Use carbide multi-fluted spiral routers
Remove copper from routing path to prevent burring
Maximum stack height: 70% of flute length
Applications
This 8-layer RO4003C PCB is ideal for:
Telecommunications: 5G base stations, backhaul equipment
RF/Microwave Circuits: Power amplifiers, filters, low-noise amplifiers
High-Speed Digital: SerDes channels, high-layer count backplanes
Aerospace & Defense: Radar systems, high-reliability communications
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!