F4BME233 High-Frequency Copper Clad Laminate Description 0.254mm, 0.508mm, 0

Product Specification

F4BME233 High-Frequency Copper Clad Laminate Description

The F4BME233 is a specialized, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate engineered for demanding microwave and radio frequency (RF) applications where a balance of low loss, moderate dielectric constant, and superior signal integrity is paramount. Manufactured by Taizhou Wangling Insulation Material Factory, this material belongs to the enhanced "E" series, distinguished by its use of low-profile copper foil to meet stringent Passive Intermodulation (PIM) requirements.

Core Technology and Composition
The substrate is formulated from a precise blend of woven glass fiber cloth and PTFE resin, ensuring excellent dimensional stability and electrical performance. The key differentiator of the F4BME series is its lamination with reverse-treated foil (RTF) copper. This specific foil type is critical for achieving superior high-frequency performance, offering excellent PIM characteristics (≤-159 dBc), enabling more precise etching for fine-line circuits, and minimizing conductor loss, which is essential for sensitive RF components.

Key Electrical Specifications
The F4BME233 offers a well-balanced and stable electrical profile:

Dielectric Constant (Dk): A nominal value of 2.33 at 10 GHz, with a controlled tolerance of ±0.04. This value provides a good compromise between circuit miniaturization and low dispersion.

Dissipation Factor (Df): Features a very low loss tangent of 0.0011 at 10 GHz and 0.0015 at 20 GHz, ensuring efficient signal transmission with minimal attenuation.

Dielectric Constant Temperature Coefficient (TcDk): -130 ppm/°C over a range of -55°C to +150°C, indicating reliable electrical performance across operational temperature variations.

Core Characteristics & Standard Specifications

Standard Product Specifications

Copper Foil: Standard offering is with 1 oz (0.035mm) Reverse Treated Foil (RTF). A 0.5 oz (0.018mm) RTF option is also available.

Standard Thickness: Available in various total (copper+dielectric) or dielectric-only thicknesses. For the F4BME233 (Dk ≤ 2.65), the minimum achievable dielectric core thickness is 0.1mm. Common thicknesses include 0.254mm, 0.508mm, 0.762mm, 1.524mm, etc., with corresponding tight tolerances (e.g., 0.508mm ±0.04mm).

Standard Panel Sizes: Includes standard sizes such as 460mm x 610mm, 500mm x 600mm, and 914mm x 1220mm for efficient panelization. Custom sizes are available upon request.

Mechanical & Thermal Performance:

Peel Strength: >1.6 N/mm (with 1 oz RTF copper).

Coefficient of Thermal Expansion (CTE): XY-direction: 22-30 ppm/°C; Z-direction: 205 ppm/°C (-55°C to 288°C).

Thermal Conductivity (Z-direction): 0.28 W/(m·K).

Max Operating Temperature: -55°C to +260°C.

Flammability Rating: UL 94 V-0.

Other Critical Properties:

• Volume & Surface Resistivity: ≥6x10⁶ MΩ·cm and ≥1x10⁶ MΩ, respectively, ensuring excellent insulation.
• Moisture Absorption: ≤0.08%, contributing to stable performance in humid environments.
• Thermal Stress Reliability: Passes 3 cycles of 10 seconds at 260°C solder dip without delamination, confirming robust process compatibility.
• Electrical Strength (Z-direction): >23 kV/mm.
• Breakdown Voltage (XY-direction): >32 kV.

Typical Applications
The F4BME233 is ideally suited for medium-to-high frequency circuits where consistent performance is critical. Its balanced Dk and low loss make it an excellent choice for:

Medium-Frequency Power Dividers, Couplers, and Combiners

Feed Networks for Antenna Arrays

Filters and other Passive Microwave Components

Communication System Substrates (e.g., for certain satellite and base station applications)

In summary, the F4BME233 is a high-reliability laminate that provides a stable dielectric constant of 2.33, very low loss, and guaranteed low PIM performance due to its RTF copper construction. It represents a cost-effective, commercially available solution for RF designers seeking a balance of performance, reliability, and manufacturability.