Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | Wangling |
| Model Number | F4BTMS294 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Wangling | Model Number | F4BTMS294 |
| Certification | ISO9001 | Place of Origin | China |
F4BTMS294 High-Reliability Copper Clad Laminate Description
The F4BTMS294 is an ultra-stable, ceramic-reinforced PTFE (Polytetrafluoroethylene) laminate engineered for the most demanding high-frequency and aerospace applications. As part of the advanced F4BTMS series from Taizhou Wangling Insulation Material Factory, it incorporates a high density of ceramic filler within a PTFE matrix and utilizes ultra-fine glass fabric to deliver exceptional electrical stability, low thermal expansion, and outstanding reliability. This material is designed as a direct, high-performance replacement for imported aerospace-grade substrates.
Core Technology and Composition
This material is formulated by blending PTFE resin with a significant load of specialized ceramic particles and minimal ultra-thin glass fabric. This composition drastically reduces the fiber-weave effect, minimizes anisotropy, and yields extremely low dielectric loss. A key feature of the F4BTMS294 is its capability to be supplied with 50Ω buried resistor foil, allowing the integration of thin-film resistor layers directly into the substrate for compact circuit designs. It is standardly clad with 1 oz (0.035mm) RTF (Reverse Treated Foil) low-profile copper to ensure superior high-frequency performance, excellent etchability for fine-line circuits, and robust peel strength.
F4BTMS294 Data Sheet
| Product Technical Parameters | Product Models & Data Sheet | ||||||||||||
| Product Features | Test Conditions | Unit | F4BTMS220 | F4BTMS233 | F4BTMS255 | F4BTMS265 | F4BTMS294 | F4BTMS300 | F4BTMS350 | F4BTMS430 | F4BTMS450 | F4BTMS615 | F4BTMS1000 |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.00 | 3.50 | 4.30 | 4.50 | 6.15 | 10.20 |
| Dielectric Constant Tolerance | / | / | ±0.02 | ±0.03 | ±0.04 | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.09 | ±0.09 | ±0.12 | ±0.2 |
| Dielectric Constant (Design) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.0 | 3.50 | 4.3 | 4.5 | 6.15 | 10.2 |
| Loss Tangent (Typical) | 10GHz | / | 0.0009 | 0.0010 | 0.0012 | 0.0012 | 0.0012 | 0.0013 | 0.0016 | 0.0015 | 0.0015 | 0.0020 | 0.0020 |
| 20GHz | / | 0.0010 | 0.0011 | 0.0013 | 0.0014 | 0.0014 | 0.0015 | 0.0019 | 0.0019 | 0.0019 | 0.0023 | 0.0023 | |
| 40GHz | / | 0.0013 | 0.0015 | 0.0016 | 0.0018 | 0.0018 | 0.0019 | 0.0024 | 0.0024 | 0.0024 | / | / | |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -130 | -122 | -92 | -88 | -20 | -20 | -39 | -60 | -58 | -96 | -320 |
| Peel Strength | 1 OZ RTF copper | N/mm | >2.4 | >2.4 | >1.8 | >1.8 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >34 | >40 | >40 | >42 | >44 | >45 | >48 | >23 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 | >38 | >40 | >42 | >48 | >52 | >55 | >52 | >54 | >55 | >42 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 40, 50 | 35, 40 | 15, 20 | 15, 20 | 10, 12 | 10, 11 | 10, 12 | 13, 12 | 12, 12 | 10, 12 | 16, 18 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 290 | 220 | 80 | 72 | 22 | 22 | 20 | 47 | 45 | 40 | 32 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 | 0.02 | 0.025 | 0.025 | 0.02 | 0.025 | 0.03 | 0.08 | 0.08 | 0.1 | 0.03 |
| Density | Room Temperature | g/cm3 | 2.18 | 2.22 | 2.26 | 2.26 | 2.25 | 2.28 | 2.3 | 2.51 | 2.53 | 2.75 | 3.2 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.26 | 0.28 | 0.31 | 0.36 | 0.58 | 0.58 | 0.6 | 0.63 | 0.64 | 0.67 | 0.81 |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. | |||||||||
Key Electrical Specifications
The F4BTMS294 is characterized by its exceptionally stable and predictable electrical behavior:
Dielectric Constant (Dk): A nominal value of 2.94 at 10 GHz, with a controlled tolerance of ±0.04.
Dissipation Factor (Df): Maintains very low loss across a broad frequency range: 0.0012 at 10 GHz, 0.0014 at 20 GHz, and 0.0018 at 40 GHz.
Dielectric Constant Temperature Coefficient (TcDk): An outstandingly low -20 ppm/°C over -55°C to +150°C, indicating near-perfect electrical stability across extreme temperature variations, which is critical for phase-sensitive applications.
Standard Product Specifications
Copper Foil: Standard offering uses 1 oz RTF copper foil.
Special Option: Can be supplied with 50Ω buried resistor foil (Nickel-Phosphorus alloy, 50±5 Ω/sq).
Standard Thickness: Available in dielectric thicknesses based on 0.127mm (5 mil) multiples, with a minimum achievable thickness of 0.127mm. Common thicknesses include 0.254mm, 0.508mm, 1.016mm, etc., with precise tolerances (e.g., 1.524mm ±0.06mm).
Standard Panel Sizes: Standard sizes include 460mm x 610mm (18"x24") and 610mm x 920mm (24"x36").
Mechanical & Thermal Performance:
Peel Strength: >1.2 N/mm (with 1 oz RTF copper).
Coefficient of Thermal Expansion (CTE): Features an extremely low and matched CTE: XY-direction: 10-12 ppm/°C; Z-direction: 22 ppm/°C (-55°C to +288°C). This ensures unparalleled dimensional stability and plated-through-hole reliability under thermal cycling.
Thermal Conductivity (Z-direction): 0.58 W/(m·K), offering superior heat dissipation compared to standard PTFE laminates.
Max Operating Temperature: -55°C to +260°C.
Flammability Rating: UL 94 V-0.
Other Critical Properties:
Volume & Surface Resistivity: ≥1x10⁸ MΩ·cm and ≥1x10⁸ MΩ, respectively.
Moisture Absorption: Only 0.02%, ensuring performance stability in humid or vacuum environments (low outgassing).
Thermal Stress Reliability: Passes 3 cycles of 10 seconds at 260°C solder dip without delamination.
Electrical Strength (Z-direction): >40 kV/mm.
Breakdown Voltage (XY-direction): >48 kV.
Density: 2.25 g/cm³.
Typical Applications
Phased Array Antennas and Phase-Sensitive Components
Aerospace, Satellite, and Spacecraft Communication Systems
High-Frequency Radar and Electronics
Complex Multilayer and Backplane Structures
Circuits requiring integrated thin-film resistors
In summary, the F4BTMS294 is a premium aerospace-grade laminate that delivers a stable Dk of 2.94, ultra-low loss up to 40 GHz, and industry-leading thermal and dimensional stability. Its excellent thermal conductivity, extremely low moisture absorption, and optional buried resistor capability make it an indispensable, high-reliability solution for next-generation RF, microwave, and space electronics.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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