TP960 PCB high frequency 2-Layer 35um copper weight built on 19.6mil thick

Product Specification

Custom 2-Layer 19.6mil TP960 PCB with ENIG Finish

Introducing the 2-layer 19.6mil PCB using TP960 laminate, designed for high-frequency, thermally stable, and low-loss applications. The TP960 material, with its ceramic/PPO-based thermoplastic composition, delivers high dielectric strength, low dissipation, and dimensional stability. The ENIG (Electroless Nickel Immersion Gold) finish ensures excellent solderability, corrosion resistance, and durability, making this PCB ideal for satellite navigation systems, missile applications, and miniaturized antennas. Manufactured to IPC-Class-2 standards, this PCB guarantees precision and reliability for critical applications.

PCB Construction Details

PCB Stackup

This 2-layer rigid PCB stackup is optimized for low loss, high-frequency stability, and dimensional reliability. The stackup details are:

PCB Statistics

This PCB is optimized for applications requiring compact and reliable designs:

About TP960 Laminate

The TP960 laminate is a high-frequency thermoplastic material combining ceramics and polyphenylene oxide (PPO) resin. Its unique composition eliminates fiberglass reinforcement, reducing negative impacts on electromagnetic wave propagation while maintaining dimensional stability and low dielectric loss. This material is ideal for miniaturized, high-frequency applications requiring exceptional reliability.

Key Features of TP960:

• Dielectric Constant (Dk): 9.6 ± 0.19 at 10GHz, providing precise impedance control.
• Dissipation Factor (Df): 0.0012 at 10GHz, ensuring minimal signal loss.
• CTE (Coefficient of Thermal Expansion): X-axis: 40 ppm/°C, Y-axis: 40 ppm/°C, Z-axis: 55 ppm/°C
• Thermal Coefficient of Dk: -40 ppm/°C, ensuring stable performance across -55°C to 150°C.
• Thermal Conductivity: 0.65 W/mK, enabling efficient heat dissipation.
• Moisture Absorption: 0.01%, ensuring stability in humid environments.
• Flammability: UL 94-V0, meeting safety standards.

TP960 laminates allow for dielectric constants ranging from 3 to 25, tailored to circuit requirements, and maintain stability across a wide frequency range.

Benefits of TP960-Based PCBs

The low dissipation factor (Df) and stable dielectric constant (Dk) ensure minimal signal distortion and high-frequency reliability.

With low TCDk (-40 ppm/°C) and high thermal conductivity (0.65 W/mK), the PCB provides consistent performance even in extreme temperature environments.

The material's low moisture absorption (0.01%) ensures dimensional stability, even in humid or harsh environments.

The ENIG surface finish enhances solderability, corrosion resistance, and wire-bonding compatibility, making it suitable for critical applications.

The ability to select dielectric constants between 3 and 25 makes TP960 versatile for a wide range of high-frequency applications.

TP960 laminates' dimensional stability and smooth surface simplify fabrication while ensuring consistent results.

Application Scenarios

Global Satellite Navigation Systems

Missile-Borne Systems

Fuze Technology

Miniaturized Antennas

Aerospace Applications

Conclusion

The 2-layer 19.6mil TP960 PCB with ENIG finish is a high-performance solution for high-frequency, high-reliability applications requiring dimensional stability, low loss, and thermal performance. Its advanced ceramic/PPO composition, precise dielectric properties, and moisture resistance make it an excellent choice for satellite navigation, missile systems, and miniaturized antennas. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is manufactured to meet the most demanding requirements.

For inquiries or custom requirements, contact us today to bring your high-frequency designs to life!