Megtron6 (M6) R-5775: High-Speed, Low-Loss PCB Material for 5G, Automotive, and

Product Specification

Revolutionizing High-Frequency PCB Design with Megtron6 (M6) R-5775

In the era of 5G, IoT, and advanced computing, the demand for high-speed, low-loss printed circuit boards (PCBs) has never been greater. Enter Megtron6 (M6) R-5775, a cutting-edge multi-layer copper-clad laminate (CCL) designed to meet the rigorous demands of high-frequency, high-speed, and high-reliability applications. Whether it’s 5G communication, automotive radar, data centers, or aerospace systems, M6 R-5775 delivers unparalleled performance and reliability.

Why Choose Megtron6 (M6) R-5775?

’s M6 R-5775 is engineered to excel in high-frequency environments, offering a unique combination of low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability. These properties make it an ideal choice for applications requiring precise signal integrity and durability under extreme conditions.

Key Features:

• Low Dielectric Loss: With a dissipation factor (Df) of just 0.002 at 1GHz/23°C and 0.0037 at 13GHz, M6 R-5775 ensures minimal signal loss, even at high frequencies.
• Stable Dielectric Constant: A dielectric constant (Dk) of 3.4 at 1GHz/23°C and 3.34 at 13GHz guarantees consistent performance across a wide frequency range.
• Thermal Reliability: A high glass transition temperature (Tg) of >185°C (DSC method) and 210°C (DMA method), coupled with a thermal decomposition temperature (Td) of 410°C (TGA method), ensures stability in high-temperature environments.
• Compatibility: M6 R-5775 is compatible with traditional FR-4 processing technology, eliminating the need for specialized equipment and reducing production costs.
• Environmental Compliance: The material is RoHS-compliant and halogen-free, aligning with green manufacturing standards.

Technical Specifications

PCB Stackup: 16-Layer Rigid PCB

The M6 R-5775 supports complex multilayer designs, accommodating 4 to 30 layers. Below is an example of a 16-layer stackup:

Construction Details:

• Board Dimensions: 110 mm x 110 mm (±0.15 mm)
• Trace/Space: 3/4 mils (minimum)
• Hole Size: 0.2 mm (minimum)
• Finished Thickness: 2.0 mm
• Surface Finish: Electroless Nickel Immersion Gold (ENIG)
• Via Plating Thickness: 25 μm
• Impedance Control: Supports single-ended and differential impedance configurations, ensuring optimal signal integrity.

Applications of Megtron6 (M6) R-5775

M6 R-5775 is versatile and finds applications in a wide range of industries:

• 5G Communication:

Millimeter-wave antennas

Radio-frequency front-ends for Active Antenna Units (AAUs)

• Automotive Electronics:

77GHz millimeter-wave radar

Advanced Driver-Assistance Systems (ADAS)

• Data Centers:

High-speed server motherboards

400G/800G optical module PCBs

• Aerospace:

High-frequency circuit boards for satellite communication and radar systems

• Consumer Electronics:

Wi-Fi 6E/7 routers

AR/VR devices

Quality and Availability

’s M6 R-5775 adheres to IPC-Class-2 quality standards, ensuring reliability and performance. The material is available worldwide, making it accessible for global projects.

Conclusion

In a world where speed, reliability, and efficiency are paramount, Megtron6 (M6) R-5775 stands out as a game-changer for high-frequency PCB design. Its low dielectric loss, stable dielectric constant, and exceptional thermal properties make it the material of choice for industries pushing the boundaries of technology. Whether you’re designing for 5G, automotive, or aerospace, M6 R-5775 delivers the performance and reliability you need to stay ahead.