Coraynic Technology Limited
Products
Manufacturer of a wide range of products which include HIGH TEMPERATURE CO-FIRED CERAMIC (HTCC) for IC package,microwave device package,SMT Microwave Device Packages,,,etc
MOQ: 50 pcs
Price: US$5
| Payment Terms | L/C, T/T, Western Union |
| Supply Ability | 3000pcs per month |
| Delivery Time | 3 weeks |
| Packaging Details | reel package,sealed bag packing |
| Plate size | Max:85*85mm |
| Substrate thickness | 0.3~3.5mm |
| Cavity layer thickness | 60% of substrate thickness (0.18~2.1) |
| Bore hole to Edge | 2 times of hole dia |
| Via hole diameter | 0.12 & 0.16 |
| Via to via centerline | 3 times of hole dia |
| HTCC-CQFN pakcgae | Lead pitch: 0.5m、0.635m； |
| Frequency | DC 30G |
| Application 1 | For MIC &RF HMIC |
| Application 2 | Optoelctronic Device Packages |
| Application 3 | MCP、SiP package |
| Brand Name | Coraynic |
| Model Number | HTCC |
| Certification | CE |
| Place of Origin | China |
Explore more categories
Get in touch with us
Leave a Message, we will call you back quickly!
