HIGH TEMPERATURE CO-FIRED CERAMIC (HTCC) for IC package,microwave device package

Product Specification

High-Temperature Co-fired Ceramic (HTCC) is a popular material choice for hermetic packaging due to its desirable electrical properties, high mechanical strength, and good thermal conductivity.

Coraynic Ceramics manufactures its proprietary HTCC blend which allows for hermetic straight-through vias and dense metal interconnects. Coraynic Technology Ceramics' HTCC packages are most commonly used in military, aerospace, medical device, and high-temperature applications.

Co-fired ceramic packages are fabricated through four distinct processing stages that include material preparation, green processing, sintering, and post-fire processing. Material preparation consists of milling raw materials into a dielectric "green tape" as well as conductive inks. Green processing consists of punching cavities, via punch, via fill, screen printing, and lamination. Once the green process is complete, the ceramic/metal composite is "co-fired" in a carefully controlled atmosphere. Post-fire processing consists of additional printing, sawing, machining, and brazing. Almost all packages are plated with Ni and Au for solder and wire-bond applications. We offer both electroless and electrolytic plating options, as well as a variety of thin filmed variations.

Please see below for additional material specifications and download the Design and Capabilities Guideline for layout-specific design rules.

 HTCC Products

• Amplifier Housings
• Ceramic/Metal Packages
• Crystal/Oscillator/SAW Packages
• Custom Pin Grid Arrays (PGA)
• High-Frequency Feedthroughs
• Hybrid Packages
• Leadless Chip Carriers (CLCC)
• Multichip Modules (MCM)
• Optical Packages
• Pad Array Carriers (BGA)
• Power Dissipation Packages
• Quad Flatpacks (QFP)
• Quad No-Lead (QFN)
• Sensor Packages

Model NUM:   KCH95     KCH90
Dielectric Constant:   9.8      9.0
Dielectric LOS: 0.2%     0.3%
Insulation Resistance: ＞1×014Ω•cm ＞1×014Ω•cm
Breakdown Voltage:＞10V/mil    ＞10V/mil
Bendig Strength: 40MPa 40MPa
TCE(pm/℃): 7.0 7.0
Thickness(μm): 10 10
Density(g/cm3): 3.70 3.75
Surface Roughness: ＜10μm ＜10μm
Warp Degre: ＜50μm ＜50μm
Shrinkage(X/Y,Z): X/Y16.8%±0.3%； Z23.0±.5%； X/Y16.8%±0.3%； Z23.0±.5 %；
Color:  White   Black

Advantages of HTCC Packages Cost-Effective
Design Flexibility
Environmental Resistance
Hermeticity
Mechanical Rigidity
Resistance to Mechanical and Thermal Shock
Surface Flatness
Thermal Dissipation

HTCC CQFN Package

 Lead pitch: 0.5m,0.635m；
 Dimensions:3m×3m, 4m×4m, 5m×5m and so on；
 Lead num.:1216202432364856472；
 Frequency : DC-30G

HTCC IC package

HTCC production line