Low Temperature Co-fired Ceramic LTCC for Microwave Filter

Product Specification

LTCC substrate is mainly used in areas of mobile communication products, notebook manufacturing, communication equipment.

LTCC is the technology that uses ceramic as the material for green sheet manufacturing. By mixing the ceramic powder into an organic binder, the pulp could be cut into green sheets by scrapers after dried up. Then, punch holes and print circuits on the sheet. Silver and gold are commonly used in making the electrodes. Applied with the blade coating method in parallel printing, the blended ceramic components are shaped after being sintered in a furnace under 850 ~ 900°C.

Since ceramic has similar properties that silicon possesses, it shows great advantage while applied to IC wafer products. What’s more, ceramic dielectric material endows LTCC with stable dielectric constant, and substrates can be stacked to more than 10 layers.

As a matter of fact, LTCC enjoys a variety of excellent properties such as good thermal conductivity, high insulation, and high-temperature resistance.

It’s worth mentioning that the line width distance of the circuit which is made by LTCC could be as small as 50 μm. Due to the tiny volume that LTCC gains, it is widely used as an indispensable component in making high-frequency modules, LED modules, ceramic antennas, and filters etc.

Accordingly, a boost of the market could be easily seen in those areas of mobile communication products, notebook manufacturing, communication types of equipment. For instance,

Bluetooth, WLAN, Wi-Max, Wi-Fi, GPS, and CDMA, ect

 LTCC project to customers. 

 LTCC sample to our customer 

LTCC (low temperature co-fired ceramics) represents a multilayer ceramic substrate that is co-fired with a low resistance internal circuit made of a metal such as Ag or Cu, at temperatures lower than the melting points of this metal (less than 1,000°C). It can be defined as a way to produce multilayer circuits with the help of single tapes, which are used to apply conductive, dielectric, and/or resistive pastes on.

LTCC is a multilayer ceramic technology with excellent dimensional accuracy, high density, high frequency and reliability offering excellent RF and microwave performance characteristics. Its low sintering temperature (approximately 900°C) allows co-firing with highly conductive metals such as silver and gold. for moderate firing temperatures. The LTCC process is similar to the thick film hybrid process employed for multilayer ceramic capacitors and chip inductors.The moderate firing temperature level below 900 °C is achieved by mixing alumina and glass as the main ingredients of the ceramic tape, the so-called green sheets.This permits the co-firing with highly conductive material (silver) for the electrodes.
LTCC also supports the creation of buried components and thus contributes to miniaturization.