Low Temperature Co-Fired Ceramic (LTCC) materials manufacturer for packaging

Product Specification

Low temperature co-fired ceramics (LTCC) and thick-film technologies have the potential to incorporate multilayer structures, enabling fabrication of specialized packaging systems. LTCC technology enables easy electrical or optical connections within and between layers in addition to enabling the use of integrated passive components, heaters, sensors, converters, etc.

LTCC is a multilayer ceramic technology with excellent dimensional accuracy, high density, high frequency and reliability offering excellent RF and microwave performance characteristics. Its low sintering temperature (approximately 900°C) allows co-firing with highly conductive metals such as silver and gold.

for moderate firing temperatures. The LTCC process is similar to the thick film
hybrid process employed for multilayer ceramic capacitor and chip inductors.
The moderate firing temperature level below 900 °C is achieved by mixing alumina
and glass as the main ingredients of the ceramic tape, the so-called green sheets.
This permits the co-firing with highly conductive material (silver) for the electrodes.
LTCC also support the creation of buried components and thus contribute to
miniaturization.

Production Process

Tape casting

LTCC producers usually use tapes shipped on a roll.

Slitting A tape is unrolled and cut into individual pieces. For this purpose,

Via holes punching (Punching machines)

Vias may be punched or drilled with a laser.

Via filling (P-series) in LTCC production

Vias can be filled with a conventional thick film screen printer or an extrusion via filler.

Conductive lines printing (P-series screen printer)

Cofireable conductors etc are printed on the green sheet using a thick film screen-printer. The screens are standard (250 – 400) emulsion or foil type thick film screens.
Stacking

Opposite to the process where each layer is placed in turns over tooling pins or where some processors use heat pliers to fix the sheets in turns one on top of the other,

For sensors and electronics that can work in harsh environments and at high temperatures. Applications include sensors and actuators for control in the petroleum and geothermal industry, process monitoring, and distributed control systems in the automotive and aerospace fields. Process development and packaging materials for electronic devices are closely connected to such packaging issues. In many cases, the package is as important as the device itself in meeting the application's needs.