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China MT29C2G48MAKLCJI-6IT-ND IC RAM High Speed Flash Memory Chip 2G PARALLEL 166MHZ
China MT29C2G48MAKLCJI-6IT-ND IC RAM High Speed Flash Memory Chip 2G PARALLEL 166MHZ

  1. China MT29C2G48MAKLCJI-6IT-ND IC RAM High Speed Flash Memory Chip 2G PARALLEL 166MHZ

MT29C2G48MAKLCJI-6IT-ND IC RAM High Speed Flash Memory Chip 2G PARALLEL 166MHZ

  1. MOQ: 1000PCS
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, PayPal, Western Union, Escrow and others
Supply Ability 10k per month
Delivery Time 3-5 work days
Packaging Details TRAY,10cm X 10cm X 5cm
Item numbe MT29C2G48MAKLCJI-6IT
Denisty 2Gb (128M x 16)
Products Category FLASH,RAM
Clock Frequency 166MHz
Temp. -40°C ~ 85°C(TA)
Technology FLASH - NAND
Voltage 1.7 V ~ 1.95 V
Package 168-VFBGA
Model Number MT29C2G48MAKLCJI-6IT
Certification Original Parts

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, PayPal, Western Union, Escrow and others Supply Ability 10k per month
Delivery Time 3-5 work days Packaging Details TRAY,10cm X 10cm X 5cm
Item numbe MT29C2G48MAKLCJI-6IT Denisty 2Gb (128M x 16)
Products Category FLASH,RAM Clock Frequency 166MHz
Temp. -40°C ~ 85°C(TA) Technology FLASH - NAND
Voltage 1.7 V ~ 1.95 V Package 168-VFBGA
Model Number MT29C2G48MAKLCJI-6IT Certification Original Parts
High Light flash memory ic chipflash memory controller chip

Flash Memory Chip MT29C2G48MAKLCJI-6IT-ND IC FLASH RAM 2G PARALLEL

166MHZ

 

 

Part MT29C2G48MAKLCJI-6 IT
Category Integrated Circuits (ICs)
Title Memory Integrated Circuit (ics) FLASH - NAND, Mobile LPDRAM Tray 1.7 V ~ 1.95 V
Description  
Company Micron Technology, Inc
Specifications  
Memory Type FLASH - NAND, Mobile LPDRAM
Memory Size 2G (128M x 16)(NAND), 1G (32M x 32)(LPDRAM)
Speed 166MHz
Interface Parallel (Byte-wide)
Package / Case 168-VFBGA
Packaging Tray
Voltage - Supply 1.7 V ~ 1.95 V
Operating Temperature -40°C ~ 85°C
Format - Memory FLASH
Lead Free Status Lead Free
RoHS Status RoHS Complian
Features, Applications

152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Features
152-Ball Package-on-Package (PoP) Combination Memory (TI OMAPTM) MT29C Family
Current production part numbers: See Table 1 on page 3
Features

Micron® NAND Flash and Mobile LPDRAM components RoHS-compliant, "green" package Separate NAND Flash and Mobile LPDRAM interfaces Space-saving package-on-package combination Low-voltage operation (1.70­1.95V) Industrial temperature range: to +85°C

Organization ­ Page size x8: 2112 bytes + 64 bytes) x16: 1056 words + 32 words) ­ Block size: 64 pages + 4K bytes)

No external voltage reference required No minimum clock rate requirement 1.8V LVCMOS-compatible inputs Programmable burst lengths Partial-array self refresh (PASR) Deep power-down (DPD) mode Selectable output drive strength STATUS REGISTER READ (SRR) supported1

Options
Notes: 1. Contact factory for remapped SRR output. CL = CAS (READ) latency.

Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2008 Micron Technology, Inc. All rights reserved.

Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.

152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Part Numbering Information ­ 152-Ball PoP

Micron NAND Flash and LPDRAM devices are available in different configurations and densities. Figure 2: 152-Ball Part Number Chart

Blank = Production ES = Engineering sample MS = Mechanical sample
Type Width Density Generation CE#, CS# Chip Count
1 NAND, 1 DRAM 2 NAND, 1 DRAM 1 NAND, 2 DRAM 2 NAND, 2 DRAM
Not all possible combinations are available. Contact factory for availability.
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Device Marking

NAND Product MT46H16M32LFCM-6 IT LPDDR Product MT29F1G08ABCHC-ET MT29F1G16ABCHC-ET Physical Part Marking JW375 JW374

Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting a 5-digit alphanumeric code is used. The abbreviated device marks are cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder. To view the location of the abbreviated mark on the device, refer to customer service note CSN-11, "Product Mark/Label," at www.micron.com/csn.

 

 

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Company Details

Bronze Gleitlager

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Bronze Sleeve Bushings

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Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Distributor/Wholesaler,Agent,Importer,Exporter,Trading Company,Seller

  • Year Established:

    2009

  • Total Annual:

    5000000-10000000

  • Employee Number:

    100~120

  • Ecer Certification:

    Verified Supplier

Beijing Silk Road Enterprise Management Services Co.,LTD was founded in 2000, it is a distributor for the computer CPU, Server CPU, IPC CPU, GPU. CHIPSET and Memory chip of the famous brand in the world. The brand include INTEL, AMD, NVIDIA, ATI, SAMSUNG, MICRON,, SKHYNIX,.etc.     &nbs... Beijing Silk Road Enterprise Management Services Co.,LTD was founded in 2000, it is a distributor for the computer CPU, Server CPU, IPC CPU, GPU. CHIPSET and Memory chip of the famous brand in the world. The brand include INTEL, AMD, NVIDIA, ATI, SAMSUNG, MICRON,, SKHYNIX,.etc.     &nbs...

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