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China Low Power Flash Memory Ic Chip 64Mx16 BGA84 W971GG6JB-18 IC SDRAM DDR2
China Low Power Flash Memory Ic Chip 64Mx16 BGA84 W971GG6JB-18 IC SDRAM DDR2

  1. China Low Power Flash Memory Ic Chip 64Mx16 BGA84 W971GG6JB-18 IC SDRAM DDR2

Low Power Flash Memory Ic Chip 64Mx16 BGA84 W971GG6JB-18 IC SDRAM DDR2

  1. MOQ: 1 packager
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, PayPal, Western Union, Escrow and others
Supply Ability 6000pcs per month
Delivery Time 3-5 work days
Packaging Details 10cm X 10cm X 5cm
Item numbe W971GG6JB-18
Products Category Memory & Flash Memory
Storage Capacity 1G-Bit( 64Mx16)
Frequency 200MHz
VOLT 1.8V
Technology SDRAM - DDR2
Temp. 0°C ~ 85°C(TC)
Package BGA84
Model Number W971GG6JB-18
Certification Original Parts

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  1. Product Details
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Product Specification

Payment Terms T/T, PayPal, Western Union, Escrow and others Supply Ability 6000pcs per month
Delivery Time 3-5 work days Packaging Details 10cm X 10cm X 5cm
Item numbe W971GG6JB-18 Products Category Memory & Flash Memory
Storage Capacity 1G-Bit( 64Mx16) Frequency 200MHz
VOLT 1.8V Technology SDRAM - DDR2
Temp. 0°C ~ 85°C(TC) Package BGA84
Model Number W971GG6JB-18 Certification Original Parts
High Light nand type flash memoryflash memory controller chip

Flash Memory Chip W971GG6JB-18 , IC SDRAM DDR2 64Mx16 Memory chip BGA84

 

Features
Type DDR2 SDRAM
Organisation x16
Speed 1066 MT/s
Voltage 1.8 V
Package WBGA-84

 

The W971GG6JB is a 1G bits DDR2 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for various applications. W971GG6JB is sorted into the following grade parts: -18, -25, 25L, 25I, 25A, 25K and -3. The -18 grade parts is compliant to the DDR2-1066 (6-6-6) specification. The -25/25L/25I/25A/25K grade parts are compliant to the DDR2-800 (5-5-5) specification (the 25L grade parts is guaranteed to support IDD2P = 7 mA and IDD6 = 4 mA at commercial temperature, the 25I industrial grade parts is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -3 grade parts is compliant to the DDR2-667 (5-5-5) specification.

 

The automotive grade parts temperature, if offered, has two simultaneous requirements: ambient temperature (TA) surrounding the device cannot be less than -40°C or greater than +95°C (for 25A), +105°C (for 25K), and the case temperature (TCASE) cannot be less than -40°C or greater than +95°C (for 25A), +105°C (for 25K). JEDEC specifications require the refresh rate to double when TCASE exceeds +85°C; this also requires use of the high-temperature self refresh option. Additionally, ODT resistance and the input/output impedance must be derated when TCASE is < 0°C or > +85°C.

 

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CLK rising and NOT CLK falling). All I/Os are synchronized with a single ended DQS or differential DQS- NOT DQS pair in a source synchronous fashion.

 

 

Feature:

 

Features

  • Power Supply: VDD, VDDQ = 1.8 V ± 0.1 V
  • Double Data Rate architecture: two data transfers per clock cycle
  • CAS Latency: 3, 4, 5, 6 and 7
  • Burst Length: 4 and 8
  • Bi-directional, differential data strobes (DQS and NOT DQS ) are transmitted / received with data
  • Edge-aligned with Read data and center-aligned with Write data
  • DLL aligns DQ and DQS transitions with clock
  • Differential clock inputs (CLK and NOT CLK )
  • Data masks (DM) for write data
  • Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
  • Posted NOT CAS programmable additive latency supported to make command and data bus efficiency
  • Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
  • Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
  • Auto-precharge operation for read and write bursts
  • Auto Refresh and Self Refresh modes
  • Precharged Power Down and Active Power Down
  • Write Data Mask
  • Write Latency = Read Latency - 1 (WL = RL - 1)
  • Interface: SSTL_18
  • Packaged in WBGA 84 Ball (8X12.5 mm²), using Lead free materials with RoHS compliant

 

 

 

 

 

 

 

Company Details

Bronze Gleitlager

,

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 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Distributor/Wholesaler,Agent,Importer,Exporter,Trading Company,Seller

  • Year Established:

    2009

  • Total Annual:

    5000000-10000000

  • Employee Number:

    100~120

  • Ecer Certification:

    Verified Supplier

Beijing Silk Road Enterprise Management Services Co.,LTD was founded in 2000, it is a distributor for the computer CPU, Server CPU, IPC CPU, GPU. CHIPSET and Memory chip of the famous brand in the world. The brand include INTEL, AMD, NVIDIA, ATI, SAMSUNG, MICRON,, SKHYNIX,.etc.     &nbs... Beijing Silk Road Enterprise Management Services Co.,LTD was founded in 2000, it is a distributor for the computer CPU, Server CPU, IPC CPU, GPU. CHIPSET and Memory chip of the famous brand in the world. The brand include INTEL, AMD, NVIDIA, ATI, SAMSUNG, MICRON,, SKHYNIX,.etc.     &nbs...

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