| Storage Capacity | 4/8/16GB |
| PE | 30000 |
| Product name | eMMC 5.1 Embedded Storage |
| Supply Ability | 100K a month |
| Chips | hynix V7 |
| Packaging | BGA 153 |
| Delivery Time | 10 to 15 days |
| Payment Terms | L/C,T/T |
| Use for | Smart TV |
| Condition | new |
| Factory | yes |
| Model Number | G2504GPLCB/G2508GPLCB/G2516PLCB |
| Brand Name | NUW |
| Place of Origin | Shenzhen, China |
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Product Specification
| Storage Capacity | 4/8/16GB | PE | 30000 |
| Product name | eMMC 5.1 Embedded Storage | Supply Ability | 100K a month |
| Chips | hynix V7 | Packaging | BGA 153 |
| Delivery Time | 10 to 15 days | Payment Terms | L/C,T/T |
| Use for | Smart TV | Condition | new |
| Factory | yes | Model Number | G2504GPLCB/G2508GPLCB/G2516PLCB |
| Brand Name | NUW | Place of Origin | Shenzhen, China |
| High Light | eMMC 5.1 storage chip for Smart TV ,8GB 16GB eMMC BGA 153 IC ,Smart TV embedded storage with warranty | ||
PSLC (Pseudo Single-Level Cell) eMMC 5.1 and TLC (Triple-Level Cell) eMMC 5.1 differ significantly in storage architecture and endurance. PSLC stores only 1 bit of data per memory cell, combining the high reliability of SLC with the cost advantages of MLC/TLC. In contrast, TLC stores 3 bits per cell to increase capacity, but sacrifices durability. The most obvious difference is reflected in the PE (Program/Erase) cycle life: consumer-grade PSLC eMMC can reach up to 30,000 cycles, meeting the demands of frequent read/write operations in devices such as smart speakers, Smart TVs, tablets, and gaming consoles; while TLC eMMC has a PE of approximately 3,000 cycles, making it more suitable for low-write, capacity-focused consumer applications.
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| Model | G2504GPLCB | G2508GPLCB | G2516PLCB |
|---|---|---|---|
| NAND Flash | PSLC | PSLC | PSLC |
| Capacity | 4GB | 8GB | 16GB |
| Warranty | 1 Year | 1 Year | 1 Year |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature0 | 0℃~70℃ | 0℃~70℃ | 0℃~70℃ |
| EP | ≥30000 | ≥30000 | ≥30000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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