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Shenzhen KHJ Technology Co., Ltd

  • China,Shenzhen
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China DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond
China DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond

  1. China DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond

DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond

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Model Number DTS640A
Brand Name KHJ
Certification ROHS、ISO9001
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Model Number DTS640A Brand Name KHJ
Certification ROHS、ISO9001 Place of Origin China

1. Product Description

 

DTS640A is a double-sided tape with good initial tack. One side features a foamed (thermally expandable) adhesive layer, while the other side is a conventional pressure-sensitive adhesive (PSA) layer. When heated at 150–160°C, the foamed adhesive layer gradually loses its tack and enables automatic detachment from the bonded substrate.

 

2. Product Structure

 

heat release tape

 

 

3. Product Features

✔ Initial heat resistance with no re-tack (no sticky residue after thermal debonding)

✔ Strong instant adhesion; components are easily removed without residue after thermal debonding

✔ ROHS compliant

4. Applications

This product is suitable for temporary fixing of various electronic components, ceramics, glass, metal plates, and other substrates. It is also used for specialty cutting protection across the electronics manufacturing industry.

5. Technical Specifications

 

Test Item Specification / Value Test Method
Total Tape Thickness (excl. liner) (μm) 150 ±5 Micrometer
Base Film Thickness (μm) 75 ±3 Micrometer
Foamed Adhesive Layer Thickness (μm) 55 ±5 Micrometer
Foamed Adhesive 180° Peel Strength (gf/25mm) 1,100 ± 300 Per GB/T 2792-2014
Foaming Start Temperature (°C) 120 T MA
Optimal Foaming Temperature (°C) 150–160 T MA
PSA Layer Thickness (μm) 20 ±5 Micrometer
PSA Layer 180° Peel Strength (gf/25mm) 200 ± 100

Per GB/T 2792-2014

 

 

6. Recommended Debonding Process

150–160°C × 4–15 min (duration may vary depending on the heating method, thermal conductivity of the substrate, and heat transfer uniformity)

 

7. Storage

 

Storage conditions: 10–30°C, 40–60% relative humidity

Shelf life: 6 months from date of manufacture under recommended storage conditions

 

8. Precautions

• Keep away from heat sources and open flames.

• Substrate surfaces must be clean, dry, and free from oil, grease, or other contamination.

• Do not use outdoors. Exposure to outdoor weather conditions may cause adhesive residue to remain on the substrate upon tape removal.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company,Seller

  • Year Established:

    1999

  • Total Annual:

    1800000-20000000

  • Employee Number:

    200~300

  • Ecer Certification:

    Site Member

Shenzhen KHJ Technology Co., Ltd was established in 1999 engaged in R&D, manufacturing and marketing of ESD adhesive products, with years experience in this field, KHJ has achieved a number of patents & core technology, we offer customized adhesive solution to meet customer's special req... Shenzhen KHJ Technology Co., Ltd was established in 1999 engaged in R&D, manufacturing and marketing of ESD adhesive products, with years experience in this field, KHJ has achieved a number of patents & core technology, we offer customized adhesive solution to meet customer's special req...

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Get in touch with us

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  • Shenzhen KHJ Technology Co., Ltd
  • KHJ Industrial park, Building 1,Chuangxin Industrial park, Xintian community, Guanlan, Longhua new district, Shenzhen,China 518110
  • https://www.khj.com.cn/

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