SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4 WEEKS |
| Maximum Workpiece Size | Ø204*500mm |
| Main Roller Coating Diameter | Ø240*510mm (Two main rollers) |
| Wire Running Speed | 2000 (MAX) m/min |
| Diamond Wire Diameter | 0.1-0.5mm |
| Line Storage Capacity | 20km (0.25mm wire) |
| Cutting Thickness Range | 0.1-20mm |
| Cutting Accuracy | 0.01mm |
| Workstation Lifting Stroke | 250mm |
| Cutting Method | Swing Cutting |
| Cutting Feed Speed | 0-10mm/min |
| Water Tank Capacity | 300L |
| Max Cutting Tension | 10-60N |
| Swing Angle | ±8° |
| Swing Speed | 0.83°/s |
| Brand Name | ZMSH |
| Place of Origin | SHANGHAI,CHINA |
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Product Specification
| Payment Terms | T/T | Delivery Time | 2-4 WEEKS |
| Maximum Workpiece Size | Ø204*500mm | Main Roller Coating Diameter | Ø240*510mm (Two main rollers) |
| Wire Running Speed | 2000 (MAX) m/min | Diamond Wire Diameter | 0.1-0.5mm |
| Line Storage Capacity | 20km (0.25mm wire) | Cutting Thickness Range | 0.1-20mm |
| Cutting Accuracy | 0.01mm | Workstation Lifting Stroke | 250mm |
| Cutting Method | Swing Cutting | Cutting Feed Speed | 0-10mm/min |
| Water Tank Capacity | 300L | Max Cutting Tension | 10-60N |
| Swing Angle | ±8° | Swing Speed | 0.83°/s |
| Brand Name | ZMSH | Place of Origin | SHANGHAI,CHINA |
| High Light | Diamond wire cutting machine for hard materials ，High-speed diamond wire cutter ，Semiconductor wire cutting machine with warranty | ||
Diamond Wire Cutting Machine – High-Speed for Hard Materials Diamond Wire Cutting Machine is specifically designed to meet the multi-wire slicing needs for hard and brittle materials. This advanced cutting solution is widely applicable for the cutting of large-sized and ultra-thin slices of materials such as silicon carbide, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, and laminated glass.
It features a swinging downward cutting mechanism, where the material sways from top to bottom while the diamond wire remains stationary. This design enhances the precision and stability of the cutting process. It is equipped with a fully servo motor system and stable tension control, ensuring high operational accuracy and stability. The diamond wire can operate at speeds of up to 2000 meters per minute, ensuring efficient cutting and significantly boosting production capacity.
The cutting thickness range is from 0.1mm to 20mm, making it suitable for a wide variety of applications across different industries. With its high-speed, high-precision capabilities, the TJ2000 is a versatile and robust cutting machine, providing optimal performance for both large-scale and ultra-thin cutting tasks.
Cutting Method: Swinging downward cutting (diamond wire remains stationary).
High-Speed Operation: Maximum diamond wire speed of 2000 meters per minute.
Cutting Thickness Range: From 0.1mm to 20mm, suitable for a variety of materials.
Precision and Stability: Fully servo motor system with stable tension control, ensuring high cutting accuracy.
Wide Application: Ideal for cutting silicon carbide, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, and laminated glass.
High Production Capacity: Efficient cutting process that significantly increases throughput and production capacity.
| Parameter | Value |
|---|---|
| Maximum Workpiece Size | Ø204*500mm |
| Main Roller Coating Diameter | Ø240*510mm (Two main rollers) |
| Wire Running Speed | 2000 (MAX) m/min |
| Diamond Wire Diameter | 0.1-0.5mm |
| Line Storage Capacity | 20km (0.25mm wire) |
| Cutting Thickness Range | 0.1-20mm |
| Cutting Accuracy | 0.01mm |
| Workstation Lifting Stroke | 250mm |
| Cutting Method | Swing Cutting |
| Cutting Feed Speed | 0-10mm/min |
| Water Tank Capacity | 300L |
| Max Cutting Tension | 10-60N |
| Swing Angle | ±8° |
| Swing Speed | 0.83°/s |
| Power Supply | Three-phase AC 380V/50Hz ≤92kW |
| Main Motor Power | 22kW*2 |
| Wire Motor Power | 1.5kW*1 |
| Workstation Motor Power | 0.4kW*1 |
| Tension Control Motor Power | 5.5kW*2 |
| Dimensions (Excluding Rocker Arm) | 2660*1320*2660mm |
| Dimensions (Including Rocker Arm) | 2850*1320*3000mm |
| Machine Weight | 8000kg |
Semiconductor Manufacturing: High-precision slicing of silicon wafers.
Solar Cell Production: Ideal for slicing silicon wafers in photovoltaic cells.
Material Processing: Suitable for cutting other materials such as ceramics, precious metals, and optical glass.
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Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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