SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4WEEKS |
| Maximum Workpiece Size | ∅310*500mm |
| Main Roller Coating Diameter | ∅350*510mm (Dual Conical Design) |
| Diamond Wire Diameter | 0.1-0.5mm |
| Diamond Wire Speed | 2500 meters per minute (Max) |
| Cutting Thickness Range | 0.1mm - 20mm |
| Cutting Accuracy | 0.01mm |
| Cutting Method | Material swings and descends from top to bottom, while diamond wire remains stationary |
| Cutting Fluid | High-efficiency anti-rust cutting fluid |
| Max Cutting Tension | 0-80N (Adjustable in 0.1N increments) |
| Swing Angle | ±8° |
| Brand Name | ZMSH |
| Place of Origin | SHANGHAI,CHINA |
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Product Specification
| Payment Terms | T/T | Delivery Time | 2-4WEEKS |
| Maximum Workpiece Size | ∅310*500mm | Main Roller Coating Diameter | ∅350*510mm (Dual Conical Design) |
| Diamond Wire Diameter | 0.1-0.5mm | Diamond Wire Speed | 2500 meters per minute (Max) |
| Cutting Thickness Range | 0.1mm - 20mm | Cutting Accuracy | 0.01mm |
| Cutting Method | Material swings and descends from top to bottom, while diamond wire remains stationary | Cutting Fluid | High-efficiency anti-rust cutting fluid |
| Max Cutting Tension | 0-80N (Adjustable in 0.1N increments) | Swing Angle | ±8° |
| Brand Name | ZMSH | Place of Origin | SHANGHAI,CHINA |
| High Light | 12-inch sapphire cutting machine ，multi wire cutter for SiC ，ceramic wire cutting equipment | ||
12-Inch High-Speed Diamond Wire Cutting Machine for Sapphire, SiC, Ceramics, and More
Product Overview:
The Machine is a high-speed, high-precision diamond wire multi-wire cutting machine developed for cutting 12-inch semiconductor sapphire substrates. It is widely applicable for large-sized and ultra-thin cutting of materials such as silicon carbide (SiC), sapphire, ceramics, precious metals, quartz, and optical glass. This cutting-edge equipment is designed to deliver exceptional precision, speed, and efficiency, making it ideal for industries such as semiconductor, optics, electronics, and other high-precision manufacturing fields.
Key Features:
Maximum Cutting Size: Capable of cutting up to 12 inches (∅310*500mm) of material.
High Speed and Precision: The diamond wire operates at a maximum speed of 2500 meters per minute, with a cutting accuracy of 0.01mm, ensuring high efficiency and precision for advanced manufacturing.
Swinging Cutting Method: The material swings and descends from top to bottom while the diamond wire remains stationary, providing smooth and accurate cuts.
Multi-Wire Cutting: The machine supports multi-wire cutting technology, significantly enhancing production efficiency.
Wide Cutting Thickness Range: The cutting thickness ranges from 0.1mm to 20mm, making it versatile for a wide range of applications.
Technical Specifications:
| Item | Parameter |
|---|---|
| Maximum Workpiece Size | ∅310*500mm |
| Main Roller Coating Diameter | ∅350*510mm (Dual Conical Design) |
| Diamond Wire Diameter | 0.1-0.5mm |
| Diamond Wire Speed | 2500 meters per minute (Max) |
| Cutting Thickness Range | 0.1mm - 20mm |
| Cutting Accuracy | 0.01mm |
| Cutting Method | Material swings and descends from top to bottom, while diamond wire remains stationary |
| Cutting Fluid | High-efficiency anti-rust cutting fluid |
| Max Cutting Tension | 0-80N (Adjustable in 0.1N increments) |
| Swing Angle | ±8° |
| Swing Speed | 0.83°/s |
| Cutting Feed Speed | 0.01-10mm/min |
| Water Tank Capacity | 300L |
| Workstation Vertical Stroke | 350mm |
| Power Supply | Three-phase five-wire AC380V/50Hz |
| Total Power | ≤113kW |
| Main Motor (Water Cooling) | 32*2KW |
| Wire Release Motor | 2KW |
| Workstation Lifting Motor | 0.4KW |
| Tension Control Motor (Water Cooling) | 5.5*2KW |
| Wire Storage and Collection Motor | 15*2KW |
| External Dimensions (Excluding Rocker Arm Box) | 2700 x 1650 x 3050mm |
| External Dimensions (Including Rocker Arm Box) | 2950 x 1650 x 3104mm |
| Machine Weight | 8200kg |
Applications:
The Machine is designed for high-precision cutting in industries such as semiconductors, optics, and precious metal processing. It is ideal for large-scale, ultra-thin cutting of hard and brittle materials such as sapphire and silicon carbide (SiC), offering both precision and efficiency for advanced manufacturing needs. This cutting machine provides excellent performance in both research and high-volume production environments.
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Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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