SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4 weeks |
| Packaging Details | package in 100-grade cleaning room |
| Coefficient of Thermal Expansion | < 3.5 × 10⁻⁶/°C |
| Elastic Modulus | > 300 GPa |
| Bulk Density | > 3.1 g/cm³ |
| Surface Flatness | ≤ 1 μm |
| Surface Roughness (Ra) | ≤ 0.01 μm |
| Adsorption Groove Accuracy | ± 5 μm |
| Brand Name | ZMSH |
| Model Number | SiC Ceramic Vacuum Chuck |
| Certification | rohs |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Delivery Time | 2-4 weeks |
| Packaging Details | package in 100-grade cleaning room | Coefficient of Thermal Expansion | < 3.5 × 10⁻⁶/°C |
| Elastic Modulus | > 300 GPa | Bulk Density | > 3.1 g/cm³ |
| Surface Flatness | ≤ 1 μm | Surface Roughness (Ra) | ≤ 0.01 μm |
| Adsorption Groove Accuracy | ± 5 μm | Brand Name | ZMSH |
| Model Number | SiC Ceramic Vacuum Chuck | Certification | rohs |
| Place of Origin | CHINA |
A Flip-Chip Bonding Vacuum Chuck is a high-precision vacuum adsorption component specifically designed for Flip-Chip Bonding processes in semiconductor manufacturing. Its core function is to stably adsorb and secure wafers or dies during bonding, ensuring micrometer or even sub-micrometer-level alignment and interconnection with the substrate. Typically fabricated from ultra-high-purity silicon (Si), silicon carbide (SiC), or specialty ceramics, it features internally precision-machined air channels and adsorption grooves. When connected to a negative pressure source, it generates a uniform negative pressure field, enabling non-contact or low-contact-stress adsorption of wafers to avoid damaging sensitive circuit patterns.
| Parameter Name | Typical Value/Range |
| Coefficient of Thermal Expansion | < 3.5 × 10⁻⁶/°C |
| Elastic Modulus | > 300 GPa |
| Bulk Density | > 3.1 g/cm³ |
| Surface Flatness | ≤ 1 μm |
| Surface Roughness (Ra) | ≤ 0.01 μm |
| Adsorption Groove Accuracy | ± 5 μm |
1. Precision Air Channel Machining: Utilizes micro-machining technologies (e.g., micro-milling, laser processing) to create complex and uniform air networks, ensuring highly consistent adsorption force distribution and preventing wafer warping or slippage.
2. Mirror Polishing: The working surface undergoes nanoscale polishing, achieving extremely low roughness (Ra ≤ 0.01μm), effectively reducing particulate contamination and electrostatic discharge (ESD) risks, and protecting wafer backside quality.
3. Ultra-Low Thermal Expansion Coefficient: The material’s CTE closely matches silicon wafers (typically < 4.5×10⁻⁶/℃), maintaining exceptional dimensional stability and alignment accuracy during thermal cycles (e.g., heating-bonding-cooling) in bonding processes.
4. High Stiffness: The material’s high elastic modulus (> 300 GPa) and optimized structural design minimize deformation under bonding pressure, ensuring chip coplanarity and uniform bonding.
5. High Density: The substrate exhibits very low porosity (typically < 0.5%), is non-porous, avoids gas retention and contaminant ingress, and meets the stringent requirements for ultra-high vacuum and cleanliness in semiconductor processes.
6. Exceptional Flatness and Parallelism: The overall flatness and parallelism to the mounting reference surface can reach within 1 micrometer (1μm), providing an absolute flat reference for chips, which is fundamental for ultra-precision bonding.
1. Customized SiC Boats Vertical & Horizontal Wafer Carriers
2. Customized SiC Ceramic Suction Cups for Lithography Applications
Q1: What is the primary function of a flip-chip bonding vacuum chuck?
A1: It is designed to stably adsorb and secure wafers or dies during flip-chip bonding processes, ensuring micrometer or sub-micrometer-level alignment between chips and substrates through vacuum force, which is critical for high-precision semiconductor packaging .
Q2: Why are materials like silicon carbide (SiC) preferred for flip-chip bonding vacuum chucks?
A2: Silicon carbide is chosen for its extremely low thermal expansion coefficient (~4.5×10⁻⁶/°C), high stiffness (>300 GPa), and exceptional chemical inertness, which ensure dimensional stability under high temperatures, prevent deformation during bonding, and resist corrosion from process gases like acids or plasmas .
Tags: # SiC Ceramic Vacuum Chuck, #Flip-Chip Bonding, #High-Purity, #Customized, #SiC Ceramics, #Mirror Polishing, #High-Stiffness
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...
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