​​6Inch JGS2 Wafer Quartz Substrate DSP 1mmt Fused Silica for High-Performance

Product Specification

6inch JGS2 Wafer DSP 1mmt Product Display

6-inch JGS2 Quartz wafer Overview​

The 6-inch JGS2 DSP (Double-Side Polished) wafer substrate with a thickness of 1 mm is a high-precision base material fabricated from ​​UV-grade fused silica (JGS2)​​. Its core value lies in the exceptional optical transmittance of JGS2 across a ​​broad spectral range of 220 nm to 2500 nm​​ (particularly suitable for UV to near-infrared wavelengths). Furthermore, owing to its ​​extremely low coefficient of thermal expansion (approximately 5.8×10⁻⁷/K)​​ and ​​high Mohs hardness (approximately grade 7)​​, it maintains outstanding dimensional stability and physical strength under harsh conditions such as high temperatures and corrosive environments. This substrate undergoes double-side polishing, achieving nanoscale surface roughness. It is primarily used in high-end fields including ​​semiconductor photolithography, high-performance optical filter substrates, photonic communication devices (e.g., DWDM filter chips), and MEMS sensors​​, providing a reliable material foundation for precision optical systems. 

Key Parameters​ of 6inch JGS2 Quartz Substrate

Material Characteristics: JGS2 Fused Silica​​

JGS2 is a ​​UV optical quartz glass​​ produced via hydrogen-oxygen flame fusion. Its core characteristics include: 

• Excellent Optical Performance​​: JGS2 exhibits high transmittance across a ​​broad spectral range from 220 nm to 2500 nm​​, meaning it allows light from ultraviolet to near-infrared to pass through effectively. This makes it an ideal material for manufacturing optical windows, lens substrates, and other components.
• ​​Outstanding Thermal Stability​​: Its ​​extremely low coefficient of thermal expansion​​ enables it to withstand drastic temperature changes without cracking or deforming, ensuring dimensional stability in high-temperature process environments.
• Good Mechanical Strength and Chemical Inertia​​: The high hardness and Young's Modulus provide sufficient mechanical strength, while its resistance to various chemicals (except hydrofluoric acid and hot phosphoric acid) meets the demands of stringent industrial environments.

6inch JGS2 Wafer Primary Application Scenarios

1. Based on the above properties, this product is primarily applied in: 
2. ​​Semiconductor Processes​​: Used as a mask plate substrate or carrier wafer in processes such as photolithography and etching, where its high purity and thermal stability are crucial.
3. ​​Optical Component Manufacturing​​: Serves as a base material for high-performance windows, prisms, and filters, especially suitable for optical systems requiring UV transmission.
   ​​Photonic Communication Devices​​: Used in making filter substrates for Dense Wavelength Division Multiplexing (DWDM) systems, where optical homogeneity and low loss are key.

Q&A of 6inch JGS2 Wafer

Q1: What are the key advantages of using a 6-inch JGS2 DSP wafer substrate with 1 mm thickness for UV optical applications?​​
​​A1:​​ Its primary advantage lies in the exceptional UV transmittance (down to 220 nm) and extremely low thermal expansion coefficient (~5.5×10⁻⁷/°C), ensuring minimal thermal distortion under high-power UV exposure and stable performance in demanding environments like semiconductor lithography or laser systems.

​​Q2: How does the 1 mm thickness contribute to the substrate's performance in high-precision systems?​​
​​A2:​​ The 1 mm thickness provides an optimal balance between mechanical strength (resisting handling stress) and optical flatness, which is critical for maintaining beam coherence and reducing wavefront distortion in precision optics and photolithography tools.

Tags: #6Inch, #JGS2 Wafer, #Quartz Substrate, #DSP, #1mmt thickness, #Fused Silica, #High-Performance Window

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