6-inch Silicon Carbide Ingot with High Breakdown Field, Thermal Conductivity,

Product Specification

6inch Silicon carbide ingot's Product description:

Our 6 inch diameter Silicon Carbide ingot is a premium semiconductor-grade substrate material engineered for high-power and high-frequency electronic applications. Sourced through strategic factory partnerships, our ingots are grown using the Physical Vapor Transport (PVT) method, ensuring exceptional crystalline quality and minimal defect density (Low EPD/MPD).

Available for power devices or Semi-Insulating for RF applications, this 150mm boule offers superior thermal conductivity and a wide bandgap. Each ingot is characterized by high resistivity uniformity and precise orientation (4.0 degree off-axis or custom). Designed to meet the rigorous demands of EV inverters, 5G infrastructure, and AI power modules, our SiC ingots provide the reliable foundational "soil" needed for high-yield wafer slicing and epi-ready processing at competitive price points.

Features:

1. Our 6-inch (150mm) Silicon Carbide (SiC) Ingots represent the pinnacle of wide-bandgap material science, serving as the essential foundation for next-generation electronics. Grown using industry-leading Physical Vapor Transport (PVT) techniques, these ingots feature exceptional crystalline integrity and ultra-low defect densities. By prioritizing high-purity raw materials, we ensure superior thermal management and high breakdown voltages across all supplied grades.

2. We provide a versatile range of crystal structures and doping profiles tailored to your specific project needs. Whether your application requires N-type conductivity for high-efficiency power modules or Semi-Insulating properties for advanced RF and 5G telecommunications, our ingots deliver high resistivity uniformity.

3. Our specialized production channels allow us to offer custom-oriented, large-diameter SiC boules that maximize wafer yield. These ingots are compatible with standard slicing and polishing equipment, providing a cost-effective solution for Tier-1 semiconductor fabs and research institutions worldwide.

Applications:

Silicon carbide (SiC) ingots are the foundation for high-performance semiconductors that are revolutionizing the automotive industry. Unlike traditional silicon, SiC can handle significantly higher voltages and temperatures, making it the gold standard for EV invertors and onboard chargers. By using SiC-based power modules, manufacturers can reduce the weight of the cooling system and increase battery range, as these components are far more efficient at converting power with minimal energy loss.

In the realm of green energy, SiC ingots are sliced into wafers to create high-efficiency solar invertors and power invertors. These devices are responsible for converting the DC electricity generated by solar panels into the AC electricity used by the grid. Because SiC can operate at higher switching frequencies, the associated passive components—like inductors and capacitors—can be made much smaller. This results in more compact, durable, and cost-effective energy storage systems and power grids.

Beyond consumer tech, SiC ingots are critical for heavy industrial and aerospace parts. Their inherent "wide bandgap" property allows electronics to function reliably in extreme environments where standard silicon would fail, such as near jet engines or in deep-well drilling equipment. Additionally, its high thermal conductivity makes it ideal for RF devices and 5G base stations, where managing heat is essential for maintaining high-speed data transmission without signal degradation.

Technical Parameters:

Customization:

We provide versatile geometric tailoring. We can adjust wafer thickness and offer various off-cut orientations—ranging from standard 4° tilts to on-axis cuts—to match your epitaxial growth recipe. We also offer different doping options, adjusting resistivity levels to support both N-type conductivity for EV power modules and Semi-Insulating structures for high-frequency RF applications. By fine-tuning our growth cycles, we focus on providing the electrical consistency required for stable, high-performance devices.

FAQs:

Q:Does "Research Grade" (R-Grade) mean the wafer is broken?

A: No. An R-Grade wafer is physically intact and structurally 4H-SiC. However, it typically has a higher micropipe density or slightly more surface "pits" than Prime Grade. While it is not reliable for mass-producing high-voltage commercial chips, it is a cost-effective choice for university testing, polishing trials, or equipment calibration where 100% chip yield is not required.

Q: Why is Silicon Carbide so much more expensive than regular Silicon?

A: It mostly comes down to how hard it is to "grow" and "cut." While Silicon crystals can be grown into huge 12-inch ingots in a couple of days, SiC crystals take nearly two weeks to grow and result in much smaller sizes. Because SiC is almost as hard as diamond, slicing and polishing it requires specialized, expensive diamond-tipped tools and high-pressure processes. You are paying for a material that survives much higher heat and voltage than regular Silicon can handle.

Q: Do I need to polish the wafers again before using them?

A: No, if you order "epi-ready" wafers. These have already undergone chemical mechanical polishing, meaning the surface is atomically smooth and ready for your next production step. If you buy MP or "Dummy" wafers, they will have microscopic scratches and will require further professional polishing before you can build any working chips on them.

Related product:

SIlicon Carbide Wafer 4inch dia x 350um 4H-N type P/R/D grade MOSEFTs/SBD/JBS