Ultra-Thin Free-Standing Diamond Film for Advanced Packaging and Thermal

Product Specification

Ultra-Thin Free-Standing Diamond Flexible Film is an advanced thermal management material engineered for next-generation semiconductor packaging and high-power electronic applications. Manufactured using proprietary MPCVD diamond growth technology, the film features a self-supporting structure with thicknesses ranging from 5 μm to 25 μm, eliminating the need for rigid carrier substrates or adhesive backing.

Combining the exceptional thermal conductivity of diamond with remarkable flexibility, the film can be customized into various shapes and sizes through precision laser cutting. Its ultra-thin profile enables seamless integration into advanced packaging architectures, including wafer-level packaging, 2.5D/3D integration, chiplet packaging, and heterogeneous integration platforms.

By efficiently dissipating heat while maintaining electrical insulation, the free-standing diamond film provides a breakthrough solution for overcoming thermal bottlenecks in modern semiconductor devices.

Key Features

Ultra-Thin Structure

Available in thicknesses from 5 μm to 25 μm, significantly thinner than conventional diamond substrates, enabling integration into space-constrained packaging environments.

Self-Supporting Design

No carrier wafer, adhesive tape, or rigid backing plate is required, reducing thermal resistance and simplifying package assembly.

High Thermal Conductivity

Diamond offers the highest thermal conductivity among known materials, allowing rapid heat extraction from high-power devices and densely integrated packages.

Flexible and Bendable

Unlike traditional thick diamond substrates, the ultra-thin film exhibits macroscopic flexibility, making it suitable for advanced packaging and flexible electronic systems.

Electrical Insulation

Provides excellent thermal conduction while maintaining electrical isolation, ideal for RF devices, power electronics, and photonic components.

Customizable Geometry

Supports laser cutting and custom dimensions to meet specific packaging, thermal interface, and device integration requirements.

Technical Specifications

Advantages Over Conventional Diamond Substrates

Applications

Advanced Semiconductor Packaging

Suitable for wafer-level packaging (WLP), fan-out packaging (FOPLP), chiplet integration, heterogeneous integration, and 3D IC architectures.

High-Power Semiconductor Devices

Provides efficient heat dissipation for SiC, GaN, IGBT, and power MOSFET devices operating under high thermal loads.

RF and Microwave Electronics

Ideal for RF front-end modules, power amplifiers, and high-frequency communication systems where thermal management directly impacts performance.

Optical and Photonic Devices

Serves as a high-performance thermal substrate for laser diodes, optical transceivers, photonic integrated circuits (PICs), and silicon photonics.

Flexible Electronics

Its unique flexibility enables thermal management solutions for emerging flexible and wearable electronic devices.

High-Performance Computing

Supports thermal control in AI accelerators, data center processors, advanced GPUs, and high-density computing platforms.

Manufacturing Capability

Our diamond technology platform enables:

• 5–10 μm free-standing diamond films
• 10–15 μm free-standing diamond films
• 20–25 μm free-standing diamond films
• Custom thickness development
• Precision laser cutting
• Custom dimensions and geometries
• Scalable production for industrial applications

Every film undergoes strict quality control to ensure uniform thickness, smooth surfaces, and reliable thermal performance.

Why Choose Our Free-Standing Diamond Flexible Film?

• Ultra-thin thickness down to 5 μm
• Self-supporting structure without carrier substrates
• Excellent flexibility and handling
• Ultra-high thermal conductivity
• Electrical insulation capability
• Compatible with advanced semiconductor packaging
• Customizable dimensions and shapes
• Suitable for next-generation thermal management solutions

FAQ

1: What makes free-standing diamond film different from traditional diamond substrates?

Traditional diamond substrates are rigid and relatively thick, while free-standing diamond films are ultra-thin, flexible, lightweight, and easier to integrate into advanced packaging structures.

2: Can the diamond film be customized into specific sizes and shapes?

Yes. The film supports precision laser cutting and can be customized according to customer requirements for size, shape, and thickness.

3: What are the main application areas?

The film is widely used in advanced semiconductor packaging, power electronics, RF devices, photonics, flexible electronics, and high-performance computing systems requiring superior thermal management.