SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4 Weeks |
| Place of Origin | SHANGHAI,CHINA |
| Brand Name | ZMSH |
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Product Specification
| Payment Terms | T/T | Delivery Time | 2-4 Weeks |
| Place of Origin | SHANGHAI,CHINA | Brand Name | ZMSH |
| High Light | 8-inch borosilicate glass wafer semiconductor ，12-inch fused silica wafer MEMS ，sapphire wafer semiconductor applications | ||
Our 8-inch to 12-inch glass wafers are high-quality wafer materials designed for semiconductor, MEMS, optical, microfluidic, sensor, display, and research applications. We provide different glass wafer materials, including borosilicate glass wafers and fused silica / fused quartz wafers, to meet various requirements for thermal stability, optical transmission, chemical resistance, dielectric performance, and surface quality.
With precise wafer processing, polishing, cleaning, and inspection capabilities, our glass wafers can be customized according to customer requirements, including diameter, thickness, surface finish, TTV, flatness, edge processing, and special specifications.
Glass wafers are widely used as carrier wafers, substrate materials, optical windows, bonding substrates, MEMS substrates, and insulating wafers in advanced manufacturing and research fields.
Compared with silicon wafers, glass wafers offer excellent electrical insulation, optical transparency, chemical stability, and customizable thermal expansion properties. They are especially suitable for applications requiring transparent substrates, low dielectric loss, high surface flatness, or wafer-level bonding compatibility.
We supply glass wafers from 8 inch to 12 inch, including:
Borosilicate glass wafers are commonly used in MEMS, sensors, microfluidic chips, wafer bonding, carrier wafers, and electronic applications. They provide good thermal shock resistance, chemical durability, mechanical stability, and process compatibility.
Borosilicate glass is a practical choice for customers who need a cost-effective glass substrate with stable performance and good dimensional control.
Typical applications include:
Fused silica and fused quartz wafers are high-purity glass wafers with excellent optical transmission, low thermal expansion, high temperature resistance, and strong chemical stability.
They are especially suitable for optical, UV, semiconductor, photonics, and high-precision applications where low impurity content, high transparency, and excellent thermal stability are required.
Typical applications include:
We can provide customized glass wafers according to your project requirements.
Common customizable parameters include:
If you have drawings, technical specifications, or target applications, our team can help evaluate the most suitable glass wafer solution for your project.
Our 8-inch to 12-inch glass wafers are suitable for a wide range of advanced manufacturing and research applications, including:
We focus on supplying reliable wafer materials and customized substrate solutions for global customers. Our glass wafers are processed with strict control of thickness, flatness, surface quality, and cleanliness to support demanding applications in semiconductor, optical, and advanced manufacturing fields.
Whether you need borosilicate glass wafers for MEMS and bonding applications, or fused silica / fused quartz wafers for optical and high-temperature applications, we can provide flexible customization and professional technical support.
1.Q: What are the main types of glass used?
A: Borosilicate (e.g., Borofloat): Highly affordable, mechanically robust, and provides excellent thermal stability.
Quartz / Fused Silica: Extremely resistant to thermal shock, chemically inert, and offers excellent optical transmission.
2.Q: Why are glass wafers preferred over silicon?
A: Optical Transparency: Allows for through-glass laser debonding and integration with optical sensors.
Electrical Insulation: Glass is an excellent natural dielectric, preventing electrical cross-talk in dense integrated circuits.
Matched Thermal Expansion: Can be engineered to match the Coefficient of Thermal Expansion (CTE) of silicon, enabling strong anodic bonding.
3. Q: What are their key applications?
A: Wafer-Level Packaging & Carriers: Act as temporary or permanent substrates to support ultra-thin silicon wafers during fan-out and 3D IC packaging.
MEMS: Used as transparent protective windows and hermetic caps for sensors (e.g., pressure and acceleration sensors).
Microfluidics: Used to build lab-on-a-chip diagnostic tools due to their high optical clarity and chemical resistance.
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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