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SHANGHAI FAMOUS TRADE CO.,LTD

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Sapphire Wafer

Manufacturer of a wide range of products which include Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic,Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle,4-inch C-Plane SSP Sapphire...

Quality Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic for sale

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Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Swing angle 0~±12.5
Lift stroke(mm) 650(mm)
Lift speed(mm/min) 0~9.99
Diamond wire diameter(mm) φ0.12~φ0.45
Running speed (m/s) 1500m/min
Material Processing SiC/Sapphire/Quartz/Ceramic
Brand Name ZMSH
Model Number Diamond Wire Single-Line Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle for sale

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Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Lift speed 225mm
Running speed 1500m/min
Storage 300L
Main drive motor 17.8kw×2
Material Processing SiC/Sapphire/Ultra-Hard Brittle
Brand Name ZMSH
Model Number Multi-Wire Diamond Saw Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality 4-inch C-Plane SSP Sapphire Substrate Al₂O₃ for LED & Optical Applications for sale

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4-inch C-Plane SSP Sapphire Substrate Al₂O₃ for LED & Optical Applications

  1. MOQ: 10

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Payment Terms T/T
Delivery Time 2-4 Weeks
Diameter 100 mm ± 0.3 mm (4 inch)
Orientation C-plane (0001), ±0.3°
Thickness 650 µm ± 15 µm
Bow <15 µm
Front Surface Single Side Polished (Ra < 0.2 nm)
Back Surface Fine Ground (Ra 0.8–1.2 µm)
TTV (Total Thickness Variation) ≤ 20 µm
LTV (Local Thickness Variation) ≤ 20 µm
Warp ≤ 20 µm
Material >99.99% high-purity Al₂O₃
Brand Name ZMSH
Place of Origin SHANGHAI,CHINA

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Quality Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications for sale

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Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications

  1. MOQ: 10

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Payment Terms T/T
Delivery Time 2-4 Weeks
Crystal Material Single Crystal Al₂O₃
Crystal Structure Trigonal (Hexagonal)
Orientation Options C-plane (0001), A-plane (11-20), R-plane (1-102), M-plane (10-10), Custom
Size Range (Square) 5 × 5 mm – 150 × 150 mm
Thickness Range 0.2–10 mm (as-cut)
Surface Condition As-Cut (Unpolished), optional Lapping/SSP/DSP
Surface Roughness (Ra) As-cut: 0.5–2.0 µm (dependent on slicing)
Hardness (Mohs) 9
Density 3.98 g/cm³
Young’s Modulus 345–400 GPa
Thermal Conductivity 25–35 W/m·K @ 20°C
Coefficient of Thermal Expansion 5.0–8.4 ×10⁻⁶ /K (orientation dependent)
Optical Transmission Range 0.15–5.5 μm
Dielectric Constant 9.4–11.5
Brand Name ZMSH
Place of Origin SHANGHAI,CHINA

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Quality 2Inch Sapphire Wafer Al2O3 Monocrystalline Dia 50.80mm Thickness 430um BOW <10  A-plane for sale

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2Inch Sapphire Wafer Al2O3 Monocrystalline Dia 50.80mm Thickness 430um BOW <10 A-plane

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Packaging Details
Delivery Time 2-4 weeks
Payment Terms T/T
Supply Ability
Material Al2O3 Monocrystalline
Diameter 50.80 mm
Thickness 430 um
Crystal Orientation A-plane
Surface Dsp
Bow ≤ 10 um
Brand Name ZMSH
Model Number Sapphire Wafer
Place of Origin CHINA
Certification

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Quality 2inch Sapphire Wafer With Hole C-Plane Al2O3 Monocrystalline 9.0 Hardness for sale

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2inch Sapphire Wafer With Hole C-Plane Al2O3 Monocrystalline 9.0 Hardness

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Material Al2O3 Singal Crystal
Diameter 50.80mm
Thickness 430 um
Crystal Orientation C-plane
Surface DSP
Hole Customized
Brand Name ZMSH
Model Number Sapphire wafer
Place of Origin China

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Quality C-Plane ( 0001 ) Double Side Polished SSP 8inch Sapphire Carrier Wafer for sale

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C-Plane ( 0001 ) Double Side Polished SSP 8inch Sapphire Carrier Wafer

  1. MOQ: 10pcs

  2. Price: By case

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Payment Terms Western Union, T/T, L/C
Supply Ability 100pcs
Delivery Time 3-4weeks
Packaging Details by substrates cassette box
material Al2O3 monocrystalline
orientation c-axis
surface dsp or ssp
thickness 13.0025um, 750.25um, or 1000.25um
ttv <15um
application1 semiconductor carrier plate/sos/ pss/optical
application2 ruby sapphire wafer, sapphire/ruby ball
Brand Name zmkj
Model Number 4.125/6.125/6inch/8inch
Certification Cz/ Rohs/ GSG
Place of Origin China

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Quality 8inch Dia 159mm Single Crystal Sapphire Wafer For Epi - Ready Carrier for sale

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8inch Dia 159mm Single Crystal Sapphire Wafer For Epi - Ready Carrier

  1. MOQ: 1pcs

  2. Price: By case

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Payment Terms Western Union, T/T, L/C
Supply Ability 100pcs
Delivery Time 3-4weeks
Packaging Details by substrates cassette box
material Al2O3 monocrystalline
orientation c-axis
surface dsp or ssp
thickness 13.0025um, 750.25um, or 1000.25um
ttv <15um
application1 semiconductor carrier plate/sos/ pss/optical
application2 ruby sapphire wafer, sapphire/ruby ball
application3 Semiconductor Etching Epitaxy Carrier
Brand Name zmkj
Model Number 4.125/6.125/6inch/8inch
Certification Cz/ Rohs/ GSG
Place of Origin China

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Quality 12inch dia300mm 0.7mm thickness Borosilicate33 substrate glass wafers BF33 Wafers for sale

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12inch dia300mm 0.7mm thickness Borosilicate33 substrate glass wafers BF33 Wafers

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material SiO2
Customized yes
thickness customized
surface roughness (Ra): < 1 nm
TTV < 10 um
Surface Finish S/D 40/20
Edge with Bevel, C shape CNC edge grounding
Squares and rectangles: All sizes and thicknesses
Chemical Properties Durability

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Get in touch with us

  • Reach Us
  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Room.1-1810,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
  • https://www.galliumnitridewafer.com/

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