SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months |
| Packaging Details | package in 100-grade cleaning room |
| Project | Multi-line wire saw with workbench on top |
| Diamond wire diameter | 0.1-0.5mm |
| Wire running speed | 2000 (MIX) m/min |
| Vertical lifting stroke of workstation | 250mm |
| Water tank | 300L |
| Total power of machine tool | ≤92kW |
| Cutting method | The material sways and descends from top to bottom, while the position of the diamond line remains unchanged |
| Brand Name | ZMSH |
| Model Number | Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine |
| Certification | rohs |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months | Packaging Details | package in 100-grade cleaning room |
| Project | Multi-line wire saw with workbench on top | Diamond wire diameter | 0.1-0.5mm |
| Wire running speed | 2000 (MIX) m/min | Vertical lifting stroke of workstation | 250mm |
| Water tank | 300L | Total power of machine tool | ≤92kW |
| Cutting method | The material sways and descends from top to bottom, while the position of the diamond line remains unchanged | Brand Name | ZMSH |
| Model Number | Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine | Certification | rohs |
| Place of Origin | CHINA | ||
| High Light | Hard Brittle Materials Semiconductor Equipment ，High-Speed Semiconductor Equipment | ||
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials
The diamond wire single/multi-wire high-speed high-precision descending/swinging cutting machine is a composite processing equipment for hard and brittle materials. By combining dynamic grinding of diamond wire (steel wire coated with silicon carbide/aluminum oxide particles) and multi-axis coordinated control, it achieves high-precision cutting of ultra-hard materials. Key design features include:
This equipment is widely used in semiconductors, photovoltaics, ceramics, gemstones, and medical fields, particularly for cutting silicon carbide (SiC), sapphire, monocrystalline silicon, and quartz glass.
| Parameter | Specification |
| Project | Multi-line wire saw with workbench on top |
| Maximum workpiece size | ø 204*500mm |
| Main roller coating diameter (Fixed at both ends) | ø 240*510mm (two main rollers) |
| Wire running speed | 2000 (MIX) m/min |
| Diamond wire diameter | 0.1-0.5mm |
| Line storage capacity of supply wheel | 20 (0.25 Diamond wire diameter) km |
| Cutting thickness range | 0.1-1.0mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 250mm |
| Cutting method | The material sways and descends from top to bottom, while the position of the diamond line remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Water tank | 300L |
| Cutting fluid | Anti-rust high-efficiency cutting fluid |
| Swing speed | 0.83°/s |
| Air pump pressure | 0.3-3MPa |
| Swing angle | ±8° |
| Maximum cutting tension | 10N-60N (Set minimum unit 0.1N) |
| Cutting depth | 500mm |
| Workstation | 1 |
| Power supply | Three-phase five-wire AC380V/50Hz |
| Total power of machine tool | ≤92kW |
| Main motor (Water circulation cooling) | 22*2kW |
| Wiring motor | 1*2kW |
| Workbench swing motor | 1.3*1kW |
| Tension control motor (Water circulation cooling) | 5.5*2kW |
| Wire release and collection motor | 15*2kW |
| External dimensions (excluding rocker arm box) | 1320*2644*2840mm |
| External dimensions (including rocker arm box) | 1780*2879*2840mm |
| Machine weight | 8000kg |
The machine operates on "dynamic grinding of diamond wire + multi-axis synchronization":
1. Diamond Wire Cycling:
2. Material Feeding:
3. Multi-wire Coordination:
| Feature
| Description
|
| High Efficiency
| Multi-wire parallel processing + 2400 m/min speed, 300% productivity gain
|
| Ultra-High Precision
| Servo/stepper motors + ball screws ensure ±0.01 mm accuracy
|
| Low Damage
| Descending feed + swinging motion minimize stress concentration, <5 μm edge chipping
|
| Intelligent Control
| PLC + touchscreen for program presetting, real-time monitoring, and break-resume
|
| Eco-Friendly
| Water-based cutting fluids reduce dust; noise <70 dB
|
| Material Compatibility
| Processes materials ≤Mohs 9.5 hardness (diamond wire: hardness 10)
|
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine application
1. Semiconductors & Photovoltaics:
2. Ceramics & Gemstones:
3. Quartz & Optical Glass:
4. Biomedical & Research:
5. Composites & Metals:
1. Q: What are the core advantages of diamond wire dual-station cutting machines?
A: High-speed dual-station design enables simultaneous processing of two workpieces, doubling efficiency while maintaining ±0.01 mm precision for materials like silicon wafers and ceramics.
2. Q: How does a diamond wire saw achieve "descending/swinging cutting"?
A: It combines vertical feed systems (descending motion) and oscillating worktables (±5°–8° swings) to reduce material stress and improve surface flatness, ideal for brittle materials like sapphire and SiC.
Tags: #Diamond Wire Cutting Machine, #Multi-Wire, #High-Speed, #High-Precision,#Descending, #Oscillatin, #Hard Brittle Materials
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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