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SHANGHAI FAMOUS TRADE CO.,LTD

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Wire Saw Machine

Manufacturer of a wide range of products which include Square Silicon Wafer with Film-Laminated Carrier for Advanced IC, Semiconductor,Custom 4-Inch (100mm) Silicon Wafers: 350μm Thickness, Orientation, DSP/SSP, N,Diamond Wire Si...

Quality Square Silicon Wafer with Film-Laminated Carrier for Advanced IC, Semiconductor for sale

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Square Silicon Wafer with Film-Laminated Carrier for Advanced IC, Semiconductor

  1. MOQ: 10

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Payment Terms T/T
Delivery Time 2-4 Weeks
Material Prime Grade Monocrystalline Silicon
Wafer Type Square with Film-Laminated Carrier
Dimensions 2″ (50.8mm) standard; custom sizes available
Thickness Customizable up to 725 μm
Growth Method Czochralski (CZ)
TTV <0.3 μm
Surface Finish Single Side Polished (SSP) or Double Side Polished (DSP)
Carrier Film Protective laminated film, removable before processing
Brand Name ZMSH
Place of Origin SHANGHAI,CHINA

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Quality Custom 4-Inch (100mm) Silicon Wafers: 350μm Thickness, Orientation, DSP/SSP, N for sale

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Custom 4-Inch (100mm) Silicon Wafers: 350μm Thickness, Orientation, DSP/SSP, N

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Payment Terms T/T
Delivery Time 4-6 weeks
Material Si single crystal
Size 4 inch
Thickness 350 um
Crystal Orientation <100>
Density 2.4 g/cm3
Doping Type P type or N type
Brand Name ZMSH
Model Number Si wafer
Place of Origin China

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Quality Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic Material for sale

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Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic Material

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Swing angle 0~±12.5
Lift stroke(mm) 650(mm)
Lift speed(mm/min) 0~9.99
Diamond wire diameter(mm) φ0.12~φ0.45
Running speed (m/s) 1500m/min
Material Processing SiC/Sapphire/Quartz/Ceramic
Brand Name ZMSH
Model Number Diamond Wire Single-Line Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials for sale

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Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Lift speed 225mm
Running speed 1500m/min
Storage 300L
Main drive motor 17.8kw×2
Material Processing SiC/Sapphire/Ultra-Hard Brittle
Brand Name ZMSH
Model Number Multi-Wire Diamond Saw Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials for sale

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​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

  1. MOQ: 1

  2. Price: By case

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Main Motor Power 11KW – 75KW
Wire Speed 0 – 40(m/s)
Max. Wire Length​ 20 – 150m
Power Supply​ Standard: Three-phase, 380V, 50Hz
Walking Motor Power​ 0.75KW – 1.5KW
Rotation Angle​ 360°(Electric Control)
Control Automatic/manual operation. Some models adopt CNC or PLC control systems.
Allowed Working Temperature​​ -15℃ ~ +40℃
Brand Name ZMSH
Model Number Wire Saw Equipment
Certification rohs
Place of Origin CHINA

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Quality Small-Scale Multi-Wire Diamond Wire Cutting Machine for Stone for sale

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Small-Scale Multi-Wire Diamond Wire Cutting Machine for Stone

  1. MOQ: 1

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Maximum workpiece size Φ730×450 mm
Wire running speed 1200 (MAX) m/min
Diamond wire diameter 0.25–0.55 mm
Line storage capacity of supply wheel 15 km
Cutting thickness range 5–450 mm
Cutting accuracy 0.01 mm
Vertical lifting stroke of workstation 800 mm
Cutting depth 450 mm
Brand Name ZMSH
Model Number Diamond Multi-Wire Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality Multi-Wire Saw Cutting Machine for Natural Stone Processing for sale

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Multi-Wire Saw Cutting Machine for Natural Stone Processing

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Worktable vertical lift stroke 2500mm
Diamond wire diameter 0.45~0.55
Cutting thickness range 10~50mm
ire running speed (double cone) 1000(max)m/min
Applications Direct Quarry Mining,Large-Scale Slab Production
Brand Name ZMSH
Model Number Multi-Wire Saw Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing for sale

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Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Supply Ability 1000pcs per month
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Project single/multiple wire saw
Diamond wire diameter 0.2-0.37mm
Cutting thickness range 1.5-80mm
Cutting accuracy 0.01mm
Cutting method The workbench swings upwards, but the position of the diamond wire remains unchanged
Cutting feed speed 0.01-10mm/min
Workstation 2
Brand Name ZMSH
Model Number Diamond Wire Single/Multiple Wire Saw machine
Certification rohs
Place of Origin CHINA

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Quality Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine for sale

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Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Supply Ability 1000pcs per month
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Project Multi-line wire saw with workbench on top
Diamond wire diameter 0.1-0.5mm
Wire running speed 2000 (MIX) m/min
Vertical lifting stroke of workstation 250mm
Water tank 300L
Total power of machine tool ≤92kW
Cutting method The material sways and descends from top to bottom, while the position of the diamond line remains unchanged
Brand Name ZMSH
Model Number Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
Certification rohs
Place of Origin CHINA

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Quality Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC / Sapphire / Silicon Processing for sale

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Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC / Sapphire / Silicon Processing

  1. MOQ: 3

  2. Price: By case

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Payment Terms T/T
Supply Ability 1000pcs per month
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Model Three station diamond single line cutting machine
Wire running speed 1000 (MIX) m/min
Diamond wire diameter 0.25-0.48mm
Cutting accuracy 0.01mm
Water tank 150L
Swing angle ±10°
Workstation 3
Brand Name ZMSH
Model Number Diamond Wire Triple-Station Single-Wire Cutting Machine
Certification rohs
Place of Origin CHINA

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Get in touch with us

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  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
  • https://www.galliumnitridewafer.com/

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