SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months |
| Packaging Details | package in 100-grade cleaning room |
| Model | Three station diamond single line cutting machine |
| Wire running speed | 1000 (MIX) m/min |
| Diamond wire diameter | 0.25-0.48mm |
| Cutting accuracy | 0.01mm |
| Water tank | 150L |
| Swing angle | ±10° |
| Workstation | 3 |
| Brand Name | ZMSH |
| Model Number | Diamond Wire Triple-Station Single-Wire Cutting Machine |
| Certification | rohs |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months | Packaging Details | package in 100-grade cleaning room |
| Model | Three station diamond single line cutting machine | Wire running speed | 1000 (MIX) m/min |
| Diamond wire diameter | 0.25-0.48mm | Cutting accuracy | 0.01mm |
| Water tank | 150L | Swing angle | ±10° |
| Workstation | 3 | Brand Name | ZMSH |
| Model Number | Diamond Wire Triple-Station Single-Wire Cutting Machine | Certification | rohs |
| Place of Origin | CHINA | ||
| High Light | Sapphire Cutting Machine ，Triple-Station Cutting Machine ，Sapphire Triple-Station Cutting Machine | ||
Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC/Sapphire/Silicon Processing
The Diamond Wire Triple-Station Single-Wire Cutting Machine is a fully automated precision machining system specifically designed for processing highly complex hard and brittle materials. Featuring a modular design, it integrates three independent workstations for rough cutting, precision finishing, and polishing. Equipped with a high-rigidity gantry structure and nano-grade linear motor drive system (repeat positioning accuracy ±0.5μm), the machine utilizes a single diamond wire (diameter 0.1-0.3mm) to sequentially complete multi-process machining, enabling one-stop precision manufacturing from blank to finished product. It is particularly suitable for high-end process scenarios requiring special-shaped cutting, ultra-thin wafer processing, and low surface damage, comprehensively supporting precision machining needs for semiconductor and optoelectronic materials including silicon, silicon carbide (SiC), sapphire, and quartz.
| Model | Three station diamond single line cutting machine |
| Maximum workpiece size | 600*600mm |
| Wire running speed | 1000 (MIX) m/min |
| Diamond wire diameter | 0.25-0.48mm |
| Line storage capacity of supply wheel | 20km |
| Cutting thickness range | 0-600mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 800mm |
| Cutting method | The material is stationary, and the diamond wire sways and descends |
| Cutting feed speed | 0.01-10mm/min (According to the material and thickness) |
| Water tank | 150L |
| Cutting fluid | Anti rust high-efficiency cutting fluid |
| Swing angle | ±10° |
| Swing speed | 25°/s |
| Maximum cutting tension | 88.0N (Set minimum unit0.1n) |
| Cutting depth | 200~600mm |
| Make corresponding connecting plates according to the customer's cutting range | - |
| Workstation | 3 |
| Power supply | Three phase five wire AC380V/50Hz |
| Total power of machine tool | ≤32kw |
| Main motor | 1*2kw |
| Wiring motor | 1*2kw |
| Workbench swing motor | 0.4*6kw |
| Tension control motor | 4.4*2kw |
| Wire release and collection motor | 5.5*2kw |
| External dimensions (excluding rocker arm box) | 4859*2190*2184mm |
| External dimensions (including rocker arm box) | 4859*2190*2184mm |
| Machine weight | 3600ka |
1. Three-Station Collaborative Operation:
2. Intelligent Control System:
| Feature
| Description
| Material Characteristics
|
| Three-Process Integration
| Reduces workpiece handling, lowering contamination rate by 90%
| Silicon (ultra-thin wafers <50μm), SiC (high hardness)
|
| High-Precision Special-Shaped Cutting
| Supports complex shapes (arcs/bevels) with profile accuracy ±0.02mm
| Sapphire (optical grade), quartz (low thermal expansion)
|
| Adaptive Tension Control
| Real-time wire tension adjustment (20-50N) prevents breakage
| Ceramics (AlN/Al₂O₃), composite substrates
|
| Multi-Material Compatibility
| Quick parameter switching for different materials
| Special crystals (LiNbO₃), CVD diamond
|
Diamond Wire Triple-Station Single-Wire Cutting Machine core application areas
1. Semiconductor Power Device Manufacturing:
2. Consumer Electronics Optical Components:
3. Advanced Research & Special Engineering:
1. Q: What are the benefits of 3-station diamond wire cutting?
A: It combines rough cutting, precision finishing, and polishing in one system, reducing processing time by 40% and improving surface quality (Ra<0.2μm).
2. Q: Which materials can be processed with this machine?
A: Hard/brittle materials like SiC, sapphire, silicon, quartz, and ceramics with ±0.01mm precision.
Tags: #Diamond Wire Triple-Station Single-Wire Cutting Machine, #SiC/Sapphire/Silicon Processing
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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