| Payment Terms | L/C,D/A,D/P,T/T,, |
| Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping |
| Material | Silicon Nitride |
| Composition:SiC | >85% |
| Color | Black |
| Density | 3.20-3.26g/cm3 |
| Max. Service Temp | 1450℃ |
| Flexural Strength | 250MPa |
| Sample | Customizable |
| Chemical Stability | High |
| Apparent Porosity | 0-0.1% |
| Elastic Modulus | 300-320GPa |
| Compression Strength | >1500MPa |
| Vickers Hardness(HV0.5) | 15-16GPa |
| Thermal Conductivity | 20-25W/(m.k) |
| Specific Resistivity | 10^14Ω·cm |
| Brand Name | KEGU |
| Model Number | Customizable |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,, | Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping | Material | Silicon Nitride |
| Composition:SiC | >85% | Color | Black |
| Density | 3.20-3.26g/cm3 | Max. Service Temp | 1450℃ |
| Flexural Strength | 250MPa | Sample | Customizable |
| Chemical Stability | High | Apparent Porosity | 0-0.1% |
| Elastic Modulus | 300-320GPa | Compression Strength | >1500MPa |
| Vickers Hardness(HV0.5) | 15-16GPa | Thermal Conductivity | 20-25W/(m.k) |
| Specific Resistivity | 10^14Ω·cm | Brand Name | KEGU |
| Model Number | Customizable | Place of Origin | China |
| High Light | Non Standard Silicon Nitride Ceramic ,High Thermal Conductivity Si3N4 Ceramic ,High Temperature Resistant Structural Ceramic | ||
| Main component | 99%Al2O3 | S-SiC | ZrO2 | Si3N4 |
|---|---|---|---|---|
| Physical Properties | ||||
| Density | 3.9 g/cm³ | 3.1 g/cm³ | 6 g/cm³ | 3.2 g/cm³ |
| Water Absorption | 0% | 0.1% | 0% | 0.1% |
| Sinter Temperature | 1700°C | 2200°C | 1500°C | 1800°C |
| Mechanical Properties | ||||
| Rockwell Hardness | 1700 HV | 2200 HV | 1300 HV | 1400 HV |
| Bend Strength | 3500 kgf/mm² | 4000 kgf/mm² | 9000 kgf/mm² | 7000 kgf/mm² |
| Compression Intensity | 30000 kgf/mm² | 20000 kgf/mm² | 20000 kgf/mm² | 23000 kgf/mm² |
| Thermal Properties | ||||
| Maximum working temperature | 1500°C | 1600°C | 1300°C | 1400°C |
| Thermal expansion coefficient (0-1000°C) | 8.0×10⁻⁶/°C | 4.1×10⁻⁶/°C (0-500°C) 5.2×10⁻⁶/°C (500-1000°C) |
9.5×10⁻⁶/°C | 2.0×10⁻⁶/°C (0-500°C) 4.0×10⁻⁶/°C (500-1000°C) |
| Thermal Shock resistance | 200°C | 250°C | 300°C | 400-500°C |
| Thermal Conductivity | 31 W/m·K (25°C) 16 W/m·K (300°C) |
100 W/m·K (25°C) 100 W/m·K (300°C) |
3 W/m·K (25°C) 3 W/m·K (300°C) |
25 W/m·K (25°C) 25 W/m·K (300°C) |
| Electrical Properties | ||||
| Resistivity (Volume) | >10¹² Ω·cm (20°C) 10¹²-10¹³ Ω·cm (100°C) >10¹² Ω·cm (300°C) |
10⁶-10⁸ Ω·cm (20°C) | >10¹⁰ Ω·cm (20°C) | >10¹¹ Ω·cm (20°C) >10¹¹ Ω·cm (100°C) >10¹¹ Ω·cm (300°C) |
| Insulation Breakdown Intensity | 18 kV/mm | semiconductor | 9 kV/mm | 17.7 kV/mm |
| Dielectric Constant (1 MHz) | 10 (E) | - | 29 | 7 |
| Dielectric Dissipation | 0.4×10⁻³ (tg o) | - | - | - |
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
2017
Ecer Certification:
Verified Supplier
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