Shaanxi KeGu New Material Technology Co., Ltd
| Material | Silicon Nitride |
| Composition:SiC | ＞85% |
| Color | Black |
| Density | 3.20-3.26g/cm3 |
| Max. Service Temp | 1450℃ |
| Flexural Strength | 250MPa |
| Sample | Customizable |
| Chemical Stability | High |
| Apparent Porosity | 0-0.1% |
| Elastic Modulus | 300-320GPa |
| Compression Strength | >1500MPa |
| Vickers Hardness(HV0.5) | 15-16GPa |
| Thermal Conductivity | 20-25W/(m.k) |
| Specific Resistivity | 10^14Ω·cm |
| Payment Terms | L/C,D/A,D/P,T/T,, |
| Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping |
| Brand Name | KEGU |
| Place of Origin | China |
| Model Number | Customizable |
View Detail Information
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Product Specification
| Material | Silicon Nitride | Composition:SiC | ＞85% |
| Color | Black | Density | 3.20-3.26g/cm3 |
| Max. Service Temp | 1450℃ | Flexural Strength | 250MPa |
| Sample | Customizable | Chemical Stability | High |
| Apparent Porosity | 0-0.1% | Elastic Modulus | 300-320GPa |
| Compression Strength | >1500MPa | Vickers Hardness(HV0.5) | 15-16GPa |
| Thermal Conductivity | 20-25W/(m.k) | Specific Resistivity | 10^14Ω·cm |
| Payment Terms | L/C,D/A,D/P,T/T,, | Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping | Brand Name | KEGU |
| Place of Origin | China | Model Number | Customizable |
| High Light | Si3N4 Pouring Spoon ，Silicon Nitride Pouring Spoon ，Aluminum Industry Silicon Nitride Crucible | ||
| Category | Property | Unit | 99% Al₂O₃ | S-SiC | ZrO₂ | Si₃N₄ |
|---|---|---|---|---|---|---|
| Physical | Density | g/cm³ | 3.9 | 3.1 | 6.0 | 3.2 |
| Water Absorption | % | 0 | 0.1 | 0 | 0.1 | |
| Sintering Temperature | °C | 1700 | 2200 | 1500 | 1800 | |
| Mechanical | Hardness (HV) | HV | 1700 | 2200 | 1300 | 1400 |
| Flexural Strength | MPa (kgf/mm²) | ~343 (3500) | ~392 (4000) | ~882 (9000) | ~686 (7000) | |
| Compressive Strength | MPa (kgf/mm²) | ~2942 (30000) | ~1961 (20000) | ~1961 (20000) | ~2255 (23000) | |
| Thermal | Max Working Temperature | °C | 1500 | 1600 | 1300 | 1400 |
| Thermal Expansion Coefficient (0-1000°C) | 10⁻⁶/°C | 8.0 | 4.1 (0-500°C) | 9.5 | 2.0 (0-500°C) | |
| 5.2 (500-1000°C) | 4.0 (500-1000°C) | |||||
| Thermal Shock Resistance | ΔT (°C) | 200 | 250 | 300 | 400-500 | |
| Thermal Conductivity (25°C) | W/m*K | 31 | 100 | 3 | 25 | |
| Thermal Conductivity (300°C) | W/m*K | 16 | 100 | 3 | 25 | |
| Electrical | Volume Resistivity (20°C) | Ω*cm | >10¹² | 10⁶-10⁸ | >10¹⁰ | >10¹¹ |
| Volume Resistivity (100°C) | Ω*cm | 10¹²-10¹³ | - | - | >10¹¹ | |
| Volume Resistivity (300°C) | Ω*cm | >10¹² | - | - | >10¹¹ | |
| Dielectric Strength | kV/mm | 18 | Semiconductor | 9 | 17.7 | |
| Dielectric Constant (1 MHz) | ε | 10 | - | 29 | 7 | |
| Dielectric Loss Tangent | tan δ | 0.4 × 10⁻³ | - | - | - |
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
2017
Ecer Certification：
Verified Supplier
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