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Shaanxi KeGu New Material Technology Co., Ltd

  • China,Tongchuan ,Shaanxi
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China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength
China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength

  1. China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength
  2. China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength
  3. China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength
  4. China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength
  5. China High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength

High Thermal Conductivity Ceramic Substrates with Exceptional Bending Strength

  1. MOQ:
  2. Price: 200-500 yuan/kg
  3. Get Latest Price
Material SiC
Composition:SiC >85%
Color Black
Density ≥3.65g/cm3
Max. Service Temp 1380℃
Flexural Strength 250MPa
Hardness ≥84HRA
Water Absorption ≤0.2%
Abrasion < 0.02%
Bending strength ≥290MPa
Payment Terms L/C,D/A,D/P,T/T,,
Supply Ability 2,000 pcs/month
Packaging Details Strong wooden box for Global shipping
Brand Name KEGU
Place of Origin China
Model Number Customizable

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  1. Product Details
  2. Company Details

Product Specification

Material SiC Composition:SiC >85%
Color Black Density ≥3.65g/cm3
Max. Service Temp 1380℃ Flexural Strength 250MPa
Hardness ≥84HRA Water Absorption ≤0.2%
Abrasion < 0.02% Bending strength ≥290MPa
Payment Terms L/C,D/A,D/P,T/T,, Supply Ability 2,000 pcs/month
Packaging Details Strong wooden box for Global shipping Brand Name KEGU
Place of Origin China Model Number Customizable
High Light Alumina Ceramic SubstratesAluminum Nitride Aln SubstratesSilicon Nitride Ceramic Substrates
Advanced Ceramic Substrates: Alumina (Al₂O₃), Aluminum Nitride (AlN) & Silicon Nitride (Si₃N₄) for Electronics
Engineered ceramic substrates form the foundation of modern electronic systems. Alumina (Al₂O₃), Aluminum Nitride (AlN), and Silicon Nitride (Si₃N₄) offer unique combinations of thermal, mechanical, and electrical properties, making them indispensable across power electronics, RF/microwave, and LED applications.
Material Property Comparison
Property Al₂O₃ 96% Al₂O₃ 99.6% AlN Si₃N₄
Apparent Density (g/cm³) 3.7-3.8 3.8-3.9 3.3 3.5
Vickers Hardness (GPa) 16 21 11 15
Bending Strength (MPa) 500 400 320 750
Elastic Modulus (GPa) 340 350 320 300
Thermal Conductivity (W/m*K) 24 28 180 55
CTE (10⁻⁶/K) 6.8-8.0 6.8-8.5 4.7-5.6 2.7
Dielectric Strength (kV/mm) 15 10 16 36
Volume Resistivity (Ω*m) >10¹² >10¹² >10¹² >10¹²
Dielectric Constant 9.8 9.9 8.9 8.5
Material Selection Guide
1. Alumina (Al₂O₃) Substrates - The Cost-Effective Standard
Alumina provides the optimal balance of performance and affordability, making it the most widely used ceramic substrate material.
  • Key Advantages:
    • Excellent cost-to-performance ratio
    • High mechanical strength and electrical insulation
    • Good thermal stability and chemical resistance
  • Typical Applications:
    • Standard thick-film and thin-film circuits
    • Heater elements, sensors, and resistor bases
    • RF shielding and general-purpose insulating components
  • Customization: Available in 96% to 99.7% purity; thickness from 0.25mm; surfaces from ground to polished; full metallization and complex shaping capabilities.
2. Aluminum Nitride (AlN) Substrates - High Thermal Performance
Aluminum Nitride is the premier choice for thermal management in high-power density applications, offering thermal conductivity rivaling beryllium oxide without associated toxicity concerns.
  • Key Advantages:
    • Very high thermal conductivity (180 W/m*K)
    • Excellent electrical insulation properties
    • Low coefficient of thermal expansion matching silicon
  • Critical Applications:
    • High-power LED arrays and laser diode carriers
    • Insulated Gate Bipolar Transistor (IGBT) modules
    • Microwave integrated circuits and high-frequency packages
  • Processing: Compatible with thick-film and thin-film metallization; available with polished surfaces for fine-line patterning.
3. Silicon Nitride (Si₃N₄) Substrates - Extreme Mechanical Reliability
Silicon Nitride excels in applications demanding exceptional fracture resistance, thermal shock survival, and long-term mechanical stability under harsh conditions.
  • Key Advantages:
    • Exceptional bending strength (750 MPa)
    • Superior resistance to thermal shock
    • Outstanding fracture toughness and wear resistance
  • Demanding Applications:
    • Automotive and aerospace power modules
    • Components for deep vacuum and high-vibration environments
    • Ultra-thin substrates (down to 0.3mm) requiring high structural integrity
Find the Right Substrate for Your Application
  • Prioritizing Thermal Management? → Select Aluminum Nitride (AlN)
  • Balancing Performance and Budget? → Choose Alumina (Al₂O₃)
  • Requiring Maximum Mechanical Durability? → Specify Silicon Nitride (Si₃N₄)
Need technical consultation? Our engineering team can help you select the ideal ceramic substrate material and processing options for your specific electronic circuit, thermal management, or high-reliability application.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company

  • Year Established:

    2017

  • Ecer Certification:

    Verified Supplier

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  • Shaanxi KeGu New Material Technology Co., Ltd
  • No. 2 Workshop, Zone B, Dongyuan Ceramic Industrial Park, Wangyi District, Tongchuan, Shaanxi 727000, China
  • https://www.hitech-ceram.com/

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