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HACC102S100V301 1000pF 100V MOS Capacitor Advanced Dielectric Passivation Step Edge Geometry Moisture Resistant Single Layer Chip
The HACC102S100V301 is a 1000pF ±10% single-layer MOS capacitor rated at 100V DC, fabricated on float-zone silicon (>1000 Ω·cm) with an amorphous thermal SiO2 dielectric and TiW-Au / TiW-Pt-Au metallization. Standard chip dimensions are 0.75mm × 0.75mm × 0.20mm (±25µm), with custom capacitance, voltage rating, die geometry (aspect ratio up to 4:1), and backside metallization available on request. It is engineered for hybrid microcircuits where humidity exposure, high DC bias, and reduced-pressure operation demand more from a chip capacitor than standard devices can deliver.
Advanced Dielectric Passivation for Moisture Resistance
The exposed thermal SiO2 surface of a bare MOS capacitor is hydrophilic and can adsorb moisture and ionic contamination during assembly, which creates a surface leakage path and shifts the effective capacitance of the device. The HACC102S100V301 applies an advanced dielectric passivation layer over the full dielectric surface to suppress moisture adsorption and keep the device electrically stable:
Moisture sensitivity MSL 1: Rated unlimited floor life per J-STD-020. The passivated surface removes the need for dry-bake before die attach or wire bonding in hybrid assembly lines.
Surface leakage suppression: The passivation blocks water film formation and ionic contamination (flux residue, handling residue) on the dielectric, maintaining stable insulation resistance in humid production environments.
Stable leakage current: Leakage current is <10nA at 25°C and <500nA at 200°C at 100V DC, with insulation resistance ≥10⁴ MΩ at rated voltage, 25°C.
Thermal cycling robustness: The passivation layer and TiW adhesion base are matched to the silicon substrate, remaining intact through repeated -55°C to +200°C thermal cycles without cracking or delamination.
Electrical Characteristics and Reliability
Capacitance: 1000pF ±10% (±5% available on custom orders)
Temperature coefficient (TCC): +35 ppm/°C over -55°C to +200°C
Q factor: >2000 at 1MHz, >200 at 1GHz
Dissipation factor: ≤0.15% at 1kHz, 1.0Vrms
ESR at 1GHz: <0.1Ω
Intrinsic chip ESL: <0.05nH (de-embedded); chip-level SRF >1.5GHz; system SRF >600MHz with 0.5mm Au bond wire
ESD tolerance: >2kV HBM (Class 2 per JESD22-A114)
Wire bond pull strength: >6gf for 25µm Au wire (MIL-STD-883 Method 2011.7)
Operating temperature: -55°C to +200°C; storage: -65°C to +150°C
Reliability: 100% production tested (capacitance, DF, leakage, DWV), KGD wafer map per lot, SPC-controlled per wafer lot
Typical Applications
High-voltage DC bias networks and decoupling in RF power amplifiers, DC blocking in microwave modules, satellite and space payload electronics, defense hybrid microcircuits, high-altitude avionics, and harsh-environment industrial controls where moisture, temperature extremes, and high bias voltage are present.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
50%-60%
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification:
Verified Supplier
Xi'an Hoan Microwave Co., Ltd. was established in 2005. The company is located in the High-tech Zone of Xi'an. The company covers an area of 800 square meters, including 500 square meters of production area and 300 square meters of office area. It is a professional enterprise specializing in t... Xi'an Hoan Microwave Co., Ltd. was established in 2005. The company is located in the High-tech Zone of Xi'an. The company covers an area of 800 square meters, including 500 square meters of production area and 300 square meters of office area. It is a professional enterprise specializing in t...