Microwave Absorbent Conical Inductors Precision Stripping Custom Inductor

Product Specification

Custom Conical Inductor Microwave Absorbent Encapsulation Stress Relief Micro Leads Precision Stripping Support

HACC-CUSTOM-AB: Microwave-Absorbent Encapsulated Conical Inductor with Stress-Relief Micro-Leads & Precision Stripping

Custom Integrated Microwave-Absorbent Encapsulation

Conical inductors operating in dense RF modules are susceptible to cavity resonances — electromagnetic standing waves between the inductor body and nearby metallic structures (module lids, ground planes, adjacent components) that create unwanted coupling and frequency-dependent impedance anomalies. The HACC-CUSTOM-AB solves this with a custom microwave-absorbent encapsulation coating applied conformally over the entire conical winding. The customer selects the absorber material: broadband lossy dielectric (carbonyl iron-loaded epoxy, µ' >1 from 1–40 GHz), narrowband resonant absorber for specific cavity mode suppression, or a dual-layer hybrid combining a broadband base with a tuned surface layer. Encapsulation thickness is controlled from 0.1 mm to 0.5 mm, cured below 150°C to prevent inductance shift from thermal stress. Performance is validated: cavity resonance suppression exceeds 10 dB across 1–40 GHz with no degradation to the inductor Q factor at the operating frequency — the encapsulation absorbs parasitic fields without loading the desired signal path.

Stress-Relief Micro-Leads & Precision Stripping Support

Fine-wire conical inductors (0.025–0.05 mm diameter) present two assembly challenges: lead breakage during handling and inconsistent stripping that damages the wire. The HACC-CUSTOM-AB addresses both. Stress-relief micro-leads incorporate a controlled bend radius loop (0.5–1.5 mm relief zone) that decouples handling stress from the winding termination — the strain-relief loop absorbs mechanical displacement, protecting the delicate winding-wire junction. Lead diameter is selectable from 0.025 mm to 0.05 mm in gold-plated copper, bare copper, or solid gold wire per the customer assembly specification.

Precision laser stripping achieves ±0.1 mm tolerance on insulation removal length (0.3–1.0 mm customer spec), with uniform stripping edge verified by microscope inspection — no nicking, no wire thinning, and no insulation residue that would compromise bond quality or introduce corrosion sites. This level of stripping precision is essential for automated wire bonding and high-reliability hybrid circuit assembly where every bond must meet pull-strength specifications.

Resonance-Free Dynamic Bandwidth

The HACC-CUSTOM-AB retains the custom non-uniform pitch profile capability — eliminating parasitic series resonances for flat impedance response from 100 MHz to 40 GHz. Combined with the absorbent encapsulation that suppresses cavity-mode coupling, the result is a conical inductor that is resonance-free from both internal pitch-related mechanisms and external cavity-related mechanisms — achieving the cleanest possible broadband impedance profile for the most demanding RF applications.

Key Specifications

Applications

• Dense RF Module Integration — Cavity resonance suppression >10 dB, absorbent encapsulation for lid-proximity immunity
• Automated Hybrid Circuit Assembly — ±0.1 mm laser-stripped leads, stress-relief loop for pick-and-place handling, microscope verified strip quality
• Phased Array Beamformer Bias Injection — Resonance-free 100 MHz–40 GHz, cavity-mode suppressed for tightly packed multi-channel arrays
• High-Reliability Spaceborne RF — Stress-relief micro-leads prevent wire breakage during vibration and thermal cycling, Au wire option for corrosion resistance

Contact us with your inductance, encapsulation material, and stripping requirements. Microwave-absorbent encapsulated conical inductors with stress-relief leads ship in 5–7 business days.