Versatile Lead Forming Air Core Inductor High Temp Insulation Custom Inductor

Product Specification

Custom Air Core Inductor Versatile Lead Formings Plating Premium Material High Temp Insulation Low MOQ Rapid Prototyping

HALA-CUSTOM-VL: Versatile Lead Forming & Premium Material Air Core Inductor Platform

When Standard Leads Limit Your Layout

PCB real estate in modern RF modules is measured in fractions of a millimeter. A 64-element phased-array beamformer, a hermetic TOSA optical module, or a drone-mounted SIGINT receiver each imposes radically different mechanical constraints on the same 7nH bias choke. Standard straight-lead inductors solve none of these layout challenges — they force the PCB designer to work around the component, rather than the component adapting to the design.

The HALA-CUSTOM-VL platform inverts this relationship. Building on the HALA precision automated winding platform, the CUSTOM-VL variant offers comprehensive lead forming, plating, and insulation customization — enabling the inductor to conform to your PCB layout, your assembly process, and your environmental requirements.

Versatile Lead Formings & Plating: Every Configuration, One Platform

Lead Forming Options

Lead Plating Options

Premium Material & High-Temperature Insulation

Not all enameled copper wire is created equal. The HALA-CUSTOM-VL offers two insulation grades to match your operating environment:

The wire itself is 99.9% pure oxygen-free high-conductivity (OFHC) copper — the same grade used in the entire field-proven HALA product family. For applications requiring the absolute lowest AC resistance at microwave frequencies, silver-plated copper wire is available, reducing skin-effect ESR by approximately 5–8% at 20GHz compared to bare copper of the same diameter.

Beyond the conductor, the materials system is deliberately simple: copper, tin, and polyurethane (or PTFE) enamel. This three-material bill of materials achieves full RoHS 2011/65/EU compliance, REACH SVHC-free status, halogen-free certification per IEC 61249-2-21, and conflict-mineral-free sourcing — all with per-lot documentation, not post-hoc declarations.

Low MOQ & Rapid Prototyping

Custom lead configurations do not require custom tooling. Because the HALA platform is a precision mandrel-based winding process — not a multi-layer ceramic fabrication requiring masks and sintering — changing lead bend angles, plating type, or wire insulation is a process parameter adjustment, not a new product development cycle. Custom lead configuration samples ship in 5–7 business days with MOQ starting at 10 pieces. The same part number, same package format, and same S2P characterization serve your prototype and production orders — no prototype-to-production discontinuity.

Key Specifications

Assembly Guidelines

• Automated Pick-and-Place (SMD Flat-Top): Standard 0402 chip shooter nozzles, placement force ≤2N. Coplanarity ≤±25µm ensures simultaneous pad contact — eliminating tombstoning. Pick-up reliability >99.9%.
• Ultrasonic Wedge Bonding: 25µm Al wire at room temperature, 20–30gf force. Tinned or gold-flash lead surface provides excellent bonding adhesion. Ideal for hermetic hybrid microcircuits where flux is prohibited.
• Micro-Soldering: SAC305 or Sn63/Pb37. Tip ≤260°C, ≤3s dwell. Control solder fillet height to prevent run-up onto active turns — the tinned-to-root lead finish requires disciplined fillet volume control.
• Perpendicular Mounting: Coil axis at 90° to RF trace. For multi-coil layouts, maintain ≥1.5mm center-to-center spacing for >30dB magnetic isolation at 28GHz.
• Post-Solder Fixation: After RF tuning, micro-droplet of low-dielectric adhesive (εᵣ < 3.0) immobilizes coil geometry against vibration and thermal cycling.
• Storage: 20–25°C, 40–60% RH in ESD-safe moisture-barrier packaging. Shelf life: 1 year from delivery. MSL 1 — unlimited floor life, no baking required.

FAQ

Q: Can I mix lead forming and plating options (e.g., SMD flat-top with gold flash)?
A: Yes. Lead configuration and plating type are independent options. An SMD flat-top coplanar lead with gold flash plating is a standard combination for hermetic hybrid modules requiring automated assembly with maximum corrosion resistance.

Q: Does changing lead configuration affect electrical performance?
A: Lead configuration does not change the coil inductance or Q factor — those are determined by coil geometry. However, lead length affects parasitic series inductance (~0.8–1.0nH/mm) and the SMD flat-top configuration adds minimal parasitic capacitance to ground compared to long axial leads. These effects are captured in the S2P Touchstone data for your specific configuration.

Q: What if my application requires operating temperatures beyond 200°C?
A: Contact our engineering team. The PTFE/polyimide insulation system is rated for 200°C continuous with 240°C peak. For specialized applications (e.g., downhole drilling instrumentation), alternative high-temperature insulation systems can be evaluated on request.

Applications

• Hermetic Hybrid Microcircuits (TOSA/ROSA): Gold-flash leads with ultrasonic wedge bonding compatibility. Zero outgassing meets <1% TML per MIL-STD-883 Method 5011.
• Automotive Radar & V2X (76–81GHz): PTFE high-temp insulation for under-hood environments. SMD flat-top packaging for automated high-volume assembly.
• Aerospace & Defense SATCOM: Silver-plated leads for lowest insertion loss at Ku/Ka-band. Class C insulation for extreme thermal environments.
• 5G mMIMO Base Station Bias Tees: SMD tape-and-reel packaging for high-volume SMT lines. Tin plating for standard SAC305 reflow processes.
• Downhole Drilling Instrumentation: Custom high-temp insulation for sustained operation above 200°C. Corrosion-resistant gold flash leads.

Contact us with your mechanical drawing, target specifications, and environmental requirements for a rapid feasibility assessment. Custom lead configurations ship in 5–7 business days with MOQ starting at 10 pieces.