Micro Packaging Air Wound Coil SiP Ready Air Core Coils Turn Consistency Mass

Product Specification

Custom Air Core Inductor Micro Packaging SiP Ready Flawless Turn Consistency Mass Production Drop In Replacement

HALA-CUSTOM-MP: Advanced Micro-Packaging & SiP-Ready Air Core Inductor Platform

When the Inductor Must Disappear into the System

System-in-Package (SiP) and advanced micro-packaging technologies — from fan-out wafer-level packaging (FOWLP) to embedded die substrates — impose mechanical constraints on passive components that conventional SMD packages cannot meet. A 7nH bias choke that measures 2.0mm * 1.2mm in 0402 SMD format is physically impossible to integrate inside a 500µm-thick interposer or alongside a flip-chip die in a molded underfill cavity. Yet the electrical function — clean DC bias injection with >30dB RF isolation at 28GHz — remains mandatory.

The HALA-CUSTOM-MP addresses this fundamental mismatch between electrical requirements and packaging constraints. Built on the HALA precision automated winding platform — the same technology producing the HALA060-HALA200 series — the CUSTOM-MP variant offers coil geometries explicitly engineered for micro-packaging integration: sub-0201 footprints, ultra-low profile heights, compatible termination metallurgies, and process-ready formats for automated die-attach and wire bonding.

Advanced Micro-Packaging & SiP Ready: Designed for Integration, Not Just Mounting

Unlike ferrite chip inductors that require keep-out zones for magnetic field containment and exhibit permeability drift under mechanical stress from mold compound cure shrinkage, the air-core HALA-CUSTOM-MP has zero magnetic material — eliminating both the keep-out zone requirement and the stress-dependent inductance drift. The μ₀ = 1.0 free-space permeability is immune to mold compound cure stress, thermal expansion, and humidity, making it the only inductor technology that is truly SiP-ready without performance compromises.

Flawless Turn-to-Turn Consistency for Mass Production

In a production line placing 1 million inductors per month, a 1% yield loss means 10,000 rejected parts — and in SiP applications where the inductor is embedded during substrate fabrication, a single inductor failure rejects the entire multi-die module. Turn-to-turn consistency is not a statistical comfort metric; it is a hard production economics requirement.

The HALA precision automated winding platform enforces consistency at every process step:

This process control architecture delivers the Cpk required for automotive IATF 16949 and aerospace AS9100 production qualification, with full lot traceability from raw wire spool to finished coil.

Strategic Cost-Reduction & Drop-In Replacement

Cost reduction in the RF supply chain rarely means negotiating a lower unit price on a BOM line item. It means eliminating an entire manufacturing step, a test insertion, or a qualification cycle. The HALA-CUSTOM-MP provides cost reduction by design:

Drop-In Replacement Path: Many ferrite chip inductors in bias tee and matching applications can be replaced with HALA air core equivalents — eliminating ferrite core cost, ferrite supply chain risk, and the temperature-dependent inductance derating that ferrite introduces. The cross-reference table maps common values to HALA platform equivalents:

Total Cost of Ownership Impact: By eliminating ferrite supply chain dependency (single-source ceramic materials from limited global suppliers), eliminating bias-dependent inductance derating verification in production test, and reducing PCB keep-out zones, the HALA-CUSTOM-MP reduces system-level cost even when unit price parity with ferrite alternatives is maintained.

Key Specifications

Integration Guidelines

• Embedded in Substrate: Place coil in laser-ablated cavity with ≥50µm clearance to cavity walls. Fill with low-dielectric underfill (εᵣ < 3.0, tan δ < 0.005). The air core eliminates magnetic interaction with copper-filled vias in adjacent layers — no keep-out zone required.
• Ultrasonic Wedge Bonding: 25µm Al wire, 20–30gf bonding force, room temperature. Gold flash pad surface provides immediate bonding adhesion. Post-bond pull test >8gf per ASTM E595 Method 2011.
• Transfer Molding: Standard epoxy mold compound (EMC) with <50µm filler particle size. Fill velocity <5mm/s to prevent wire sweep. Post-mold cure at 175°C for 4 hours — no parametric shift in inductance or Q.
• Fluxless Assembly: Entirely compatible with fluxless processes — ultrasonic bonding, AuSn eutectic, and thermocompression all eliminate flux residue that would degrade Q above 10GHz.

FAQ

Q: Can the CUSTOM-MP be embedded inside an organic substrate during fabrication?
A: Yes. The coil is compatible with standard substrate lamination temperatures (180–200°C) and pressures (2–4 MPa). Specify gold flash termination for oxidation resistance during the substrate fabrication thermal cycles. The air core's zero-CTE mismatch with any substrate material eliminates the delamination risk associated with ferrite components.

Q: What is the minimum achievable coil volume for my SiP?
A: The smallest standard configuration uses a 0.30mm ID mandrel with 0.03mm wire and 2 turns — approximately 0.02mm³. Contact our application engineering team with your exact Z-height and footprint budget for a feasibility assessment.

Applications

• 5G mmWave AiP (Antenna-in-Package): Embedded bias choke for each antenna element's PA/LNA chain. Sub-0201 footprint enables placement within the antenna element pitch.
• FOWLP (Fan-Out Wafer-Level Packaging): Gold flash micro-stripped leads for direct die-to-inductor wire bonding within the molded wafer.
• Silicon Interposer (2.5D): Cavity-embedded inductor in silicon interposer, eliminating PCB-level bias tee routing.
• Optical Engine Co-Packaging (CPO): Embedded bias choke for EML/SiPh modulator drivers, eliminating external bias tee PCB area.

Contact us with your SiP footprint budget, Z-height constraint, termination metallurgy, and assembly process for a rapid feasibility assessment. Micro-packaging samples ship in 5–7 business days with MOQ starting at 10 pieces.