12 Turn Air Wound Inductors Micro Custom Inductors High Precision

Product Specification

HALA1200303R High-Precision 12-Turn Micro AirCore Inductor

Product Overview & Value Proposition
   The HALA1200303R represents an engineeringmilestone in ultra-precision, high-frequency electromagnetic passive component design. This high-reliability 12-turn micro air core inductor is engineered to deliver unmatched Q-factor performance andhigh impedance stability in the 1.5 GHz to 18 GHz microwave and radio-frequency bands.
    Utilizing an incredibly fine, hair-thin 0.03 mm (30 um) enameled copper wire wrapped to a miniature 0.3mm (300 um) inner diameter, the HALA1200303R achieves a nominal inductance of 26 nH  20% whilemaintaining a compact physical footprint. It reliably handles a continuous rated current of up to 200 mA andis ruggedized for critical aerospace, space, and defense temperature ranges from -55°C to +125°c.

    By bypassing the magnetic core, the HALA1200303R provides absolute linearity under high-frequencyoperation with zero hysteresis losses or core saturation. This micro-coil is highly recommended for designengineers and system integrators specializing in:
    •Satellite Communication (SATCOM) L/S/C/X/Ku Band Receivers
    •GaAs & GaN RF Power Amplifier (PA) Gate/Drain Bias Networks
    •High-Resonant Microwave Filters and Impedance Matching Circuits
    •Advanced Electronic Warfare (EW) & Radar Countermeasure Systems
    •High-Speed Broadband Fiber Optic Network Interconnects                   

Product Dimensions

Comprehensive Technical Specifications

The following table details the verified electrical, physical, and environmental parameters for theHALA1200303R micro air core inductor.

Assembly Guidelines

    Because the HALA1200303R utilizes an ultra-fine 0.03 mm (30 um) enameled wire, it requires strictengineering protocols during PCB assembly and tuning to preserve its high-frequency performance andstructural integrity:

5.1 Orthogonal Spatial Alignment
     For proper noise shielding and impedance performance, the main coil body must be positioned strictlyperpendicular to the microstrip RF signal transmission line. Any parallel alignment will cause mutualinductive coupling between the coil and the trace, degrading the S-parameters of the matching network.

5.2 Lead Length Minimization
      The leads on both ends connecting the inductor coil to the microstrip traces must be trimmed to theshortest physical length possible. Excess lead length acts as an accidental stub, adding parasite strayinductance and dropping the self-resonant frequency (SRF) out of the target operating band (1.5 18 GHz).

5.3 Micro-Soldering for 0.03mm Wire
      •The pre-stripped and tinned leads of the HALA1200303R are optimized for advanced micro-soldering:
      •Handling: Due to the microscopic 30 um wire diameter (comparable to a human hair), manual assemblymust be performed under a high-magnification stereomicroscope using anti- static, fine-point ceramictweezers.
      •Thermal Control: Soldering nozzle/tip temperature must not exceed 260°C for a maximum of 3seconds. Excessive thermal stress willimmediately degrade the enameled insulation or melt the ultra-thin copper core.
      •Solder Standard: Lead-free SAC305 or low-temperature Sn63/Pb37 solder is recommended.

5.4 Dielectric Encapsulation & Fixing
       Once the RF tuning is complete and the S-parameters are optimized:

       •Apply a tiny drop of low-dielectric, low-loss RF epoxy (such as Epoxy Technology H20E) or low-losssilicone adhesive.
       •This anchors the coil turns in place, preventing microphonics, detuning from mechanical vibrations, andphysical distortion under Tactical-grade thermal cycling.

Comparison Matrix: Deepening the Product Line

To help RF engineers find the perfect trade -off between inductance, current handling, and physical size,the table below maps Vibratac's precision micro-coil portfolio:

Test Data(10MHz-20GHz)