| Output Current | 8mA |
| Fall time | 1.5us |
| Operating Temperature | -55℃~+85℃ |
| Load Voltage | 15V |
| Reverse Voltage | 3V |
| Current transfer ratio | 19%;50% |
| Input type | DC |
| Isolation Voltage(Vrms) | 5kV |
| Number of Channels | 1 |
| Description | 8mA 15V 3V DC DIP-8 Transistor, Photovoltaic Output Optoisolators RoHS |
| Mfr. Part # | HCNW136-000E |
| Package | DIP-8 |
| Model Number | HCNW136-000E |
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Product Specification
| Output Current | 8mA | Fall time | 1.5us |
| Operating Temperature | -55℃~+85℃ | Load Voltage | 15V |
| Reverse Voltage | 3V | Current transfer ratio | 19%;50% |
| Input type | DC | Isolation Voltage(Vrms) | 5kV |
| Number of Channels | 1 | Description | 8mA 15V 3V DC DIP-8 Transistor, Photovoltaic Output Optoisolators RoHS |
| Mfr. Part # | HCNW136-000E | Package | DIP-8 |
| Model Number | HCNW136-000E |
These diode-transistor optocouplers provide electrical insulation between input and output using an insulating layer between an LED and an integrated photodetector. Featuring separate connections for photodiode bias and output-transistor collector, they achieve speeds up to a hundred times faster than conventional phototransistor couplers by reducing base-collector capacitance. Available in 8-pin DIP, SO-8, and Widebody package configurations, these single-channel optocouplers are suitable for TTL/CMOS, TTL/LSTTL, wide-bandwidth analog, and high-speed TTL/TTL applications. They offer high speed (1 Mb/s), TTL compatibility, open collector output, and safety approvals including UL Recognition, CSA Approval, and IEC/EN/DIN EN 60747-5-5 approval.
| Model/Part Number | Package Type | Description | Current Transfer Ratio (CTR) Minimum | Speed | UL Recognition | IEC/EN/DIN EN 60747-5-5 VIORM |
|---|---|---|---|---|---|---|
| 6N135, HCPL-0500, HCNW135 | 8-pin DIP, SO-8, Widebody | For TTL/CMOS, TTL/LSTTL or wide-bandwidth analog applications | 7% at IF = 16 mA | 1 Mb/s | 3750 Vrms for 1 minute (UL1577) | N/A (See specific options) |
| 6N136, HCPL-2502, HCPL-0501, HCNW136 | 8-pin DIP, SO-8, Widebody | For high-speed TTL/TTL applications | 19% at IF = 16 mA | 1 Mb/s | 3750 Vrms for 1 minute (UL1577) | N/A (See specific options) |
| HCNW135/6 | 8-pin DIP (400 Mil Widebody) | High speed, high voltage insulation | 19% minimum at IF = 16 mA | 1 Mb/s | 5000 Vrms for 1 minute (UL1577) | 630V peak for DIP 300 mil devices; 1414V peak for DIP 400 mil (widebody) devices |
| HCPL-0500/0501 | SO-8 | High speed, TTL compatible | 7% (HCPL-0500), 19% (HCPL-0501) at IF = 16 mA | 1 Mb/s | 3750 Vrms for 1 minute (UL1577) | 567V peak for SO-8 devices |
| HCPL-2502 | 8-pin DIP (300 Mil) | High speed, TTL compatible | 15% minimum at IF = 16 mA (JEDEC), 19% guaranteed (Avago) | 1 Mb/s | 3750 Vrms for 1 minute (UL1577) | N/A (See specific options) |
| Option 020 (8-Pin DIP) | 8-Pin DIP | High voltage insulation | N/A | N/A | 5000 Vrms for 1 minute (UL1577) | N/A |
| Option 060 (8-Pin DIP/SO-8) | 8-Pin DIP, SO-8 | IEC/EN/DIN EN 60747-5-5 Approved | N/A | N/A | N/A | 630V peak (DIP), 567V peak (SO-8) |
| Option 060 (Widebody) | Widebody DIP | IEC/EN/DIN EN 60747-5-5 Approved | N/A | N/A | N/A | 1414V peak |
Refer to the datasheet for detailed package outline drawings for 8-Pin DIP, 8-Pin DIP with Gull Wing Surface Mount, Small Outline SO-8, and 8-Pin Widebody DIP packages.
| Parameter | Symbol | 8-Pin DIP (300 Mil) Value | SO-8 Value | Widebody (400 Mill) Value | Units | Conditions |
|---|---|---|---|---|---|---|
| Minimum External Air Gap (External Clearance) | L(101) | 7.1 | 4.9 | 9.6 | mm | Measured from input terminals to output terminals, shortest distance through air. |
| Minimum External Tracking (External Creepage) | L(102) | 7.4 | 4.8 | 10.0 | mm | Measured from input terminals to output terminals, shortest distance path along body. |
| Minimum Internal Plastic Gap (Internal Clearance) | 0.08 | 0.08 | 1.0 | mm | Through insulation distance conductor to conductor. | |
| Minimum Internal Tracking (Internal Creepage) | N/A | N/A | 4.0 | mm | Measured from input terminals to output terminals, along internal cavity. | |
| Tracking Resistance (Comparative Tracking Index) | CTI | 200 | 200 | 200 | V | DIN IEC 112/VDE 0303 Part 1 |
| Input-Output Momentary Withstand Voltage | VISO | 3750 | 3750 | 5000 | Vrms | RH < 50%, t = 1 min., TA = 25C (UL 1577) |
| Description | Symbol | 8-Pin DIP/SO-8 Value | Widebody (400 Mill) Value | Units | Conditions |
|---|---|---|---|---|---|
| Maximum Working Insulation Voltage | VIORM | 567 (SO-8), 630 (DIP) | 1414 | Vpeak | Installation Classification per DIN VDE 0110/39 |
| Input to Output Test Voltage, Method ba | VPR | 1063 (SO-8), 1181 (DIP) | 2651 | Vpeak | 100% Production Test with tm = 1s, Partial Discharge < 5 pC |
| Input to Output Test Voltage, Method aa | VPR | 907 (SO-8), 1008 (DIP) | 2262 | Vpeak | Type and Sample Test, tm = 10s, Partial Discharge < 5 pC |
| Highest Allowable Overvoltage (Transient Overvoltage) | VIOTM | 6000 (SO-8), 8000 (DIP) | 8000 | Vpeak | tini = 60s |
| Parameter | Symbol | Device | Min. | Max. | Units | Note |
|---|---|---|---|---|---|---|
| Storage Temperature | TS | All | -55 | 125 | C | a |
| Operating Temperature | TA | 8-Pin DIP, SO-8 | -55 | 100 | C | a |
| Operating Temperature | TA | Widebody | -55 | 85 | C | a |
| Average Forward Input Current | IF(AVG) | All | 25 | mA | b | |
| Peak Forward Input Current (50% duty cycle, 1-ms pulse width) | IF(PEAK) | 8-Pin DIP, SO-8 | 50 | mA | c | |
| Peak Forward Input Current (50% duty cycle, 1-ms pulse width) | IF(PEAK) | Widebody | 40 | mA | c | |
| Reverse LED Input Voltage | VR | 8-Pin DIP, SO-8 | 5 | V | a | |
| Reverse LED Input Voltage | VR | Widebody | 3 | V | a | |
| Input Power Dissipation | PIN | 8-Pin DIP, SO-8 | 45 | mW | d | |
| Input Power Dissipation | PIN | Widebody | 40 | mW | d | |
| Average Output Current | IO(AVG) | All | 8 | mA | ||
| Peak Output Current | IO(PEAK) | All | 16 | mA | ||
| Emitter-Base Reverse Voltage | VEBR | All | 5 | V | ||
| Supply Voltage | VCC | 8-Pin DIP, SO-8 | -0.5 | 30 | V | |
| Output Voltage | VO | 8-Pin DIP, SO-8 | -0.5 | 20 | V | |
| Supply Voltage | VCC | Widebody | -0.5 | 15 | V | a |
| Output Voltage | VO | Widebody | -0.5 | 15 | V | a |
| Base Current | IB | All | 5 | mA | ||
| Output Power Dissipation | PO | All | 100 | mW | e | |
| Lead Solder Temperature (Through-Hole Parts Only) | TLS | 8-Pin DIP, Widebody | 260 | C | 1.6 mm below seating plane, 10s |
| Parameter | Symbol | Device | Min. | Typ. | Max. | Units | Test Conditions | Figure | Note |
|---|---|---|---|---|---|---|---|---|---|
| Current Transfer Ratio | CTR | 6N135, HCPL-0500, HCNW135 | 7 | 18 | 50 | % | TA = 25C, VO = 0.4V, IF = 16 mA, VCC = 4.5V | 1, 2, 4 | c, d |
| Current Transfer Ratio | CTR | 6N136, HCPL-2502, HCPL-0501, HCNW136 | 19 | 24 | 50 | % | TA = 25C, VO = 0.4V, IF = 16 mA, VCC = 4.5V | 1, 2, 4 | c, d |
| Logic Low Output Voltage | VOL | 6N135, HCPL-0500, HCNW135 | 0.1 | 0.4 | V | TA = 25C, IO = 1.1 mA, IF = 16 mA, VCC = 4.5V | |||
| Logic Low Output Voltage | VOL | 6N136, HCPL-2502, HCPL-0501, HCNW136 | 0.1 | 0.4 | V | TA = 25C, IO = 3.0 mA, IF = 16 mA, VCC = 4.5V | |||
| Logic High Output Current | IOH | All | 0.003 | 0.5 | A | TA = 25C, VO = VCC = 5.5V, IF = 0 mA | 7 | ||
| Logic Low Supply Current | ICCL | All | 50 | 200 | A | IF = 16 mA, VO = Open, VCC = 15V | |||
| Logic High Supply Current | ICCH | All | 0.02 | 1 | A | TA = 25C, IF = 0 mA, VO = Open, VCC = 15V | |||
| Input Forward Voltage | VF | 8-Pin DIP | 1.5 | 1.7 | V | TA = 25C, IF = 16 mA | 3 | b | |
| Input Forward Voltage | VF | SO-8 | 1.8 | V | TA = 25C, IF = 16 mA | 3 | b | ||
| Input Forward Voltage | VF | Widebody | 1.45 | 1.68 | 1.85 | V | TA = 25C, IF = 16 mA | 3 | b |
| Input Reverse Breakdown Voltage | BVR | 8-Pin DIP | 5 | V | IR = 10 A | b | |||
| Input Reverse Breakdown Voltage | BVR | SO-8, Widebody | 3 | V | IR = 100 A | b | |||
| Temperature Coefficient of Forward Voltage | VF/TA | 8-Pin DIP | -1.6 | mV/C | IF = 16 mA | ||||
| Input Capacitance | CIN | 8-Pin DIP | 60 | pF | f = 1 MHz, VF = 0V | f | |||
| Input Capacitance | CIN | SO-8, Widebody | 90 | pF | f = 1 MHz, VF = 0V | f |
| Parameter | Symbol | Device | Min. | Typ. | Max. | Units | Test Conditions | Figure | Note |
|---|---|---|---|---|---|---|---|---|---|
| Propagation Delay Time to Logic Low at Output | tPHL | 6N135, HCPL-0500, HCNW135 | 0.2 | 1.5 | s | TA = 25C, RL = 4.1 k | 5, 6, 11 | c, d | |
| Propagation Delay Time to Logic Low at Output | tPHL | 6N136, HCPL-2502, HCPL-0501, HCNW136 | 0.2 | 0.8 | s | TA = 25C, RL = 1.9 k | 5, 6, 11 | c, d | |
| Propagation Delay Time to Logic High at Output | tPLH | 6N135, HCPL-0500, HCNW135 | 1.3 | 1.5 | s | TA = 25C, RL = 4.1 k | 5, 6, 11 | c, d | |
| Propagation Delay Time to Logic High at Output | tPLH | 6N136, HCPL-2502, HCPL-0501, HCNW136 | 0.6 | 0.8 | s | TA = 25C, RL = 1.9 k | 5, 6, 11 | c, d | |
| Common Mode Transient Immunity at Logic High Level Output | |CMH| | 6N135, HCPL-0500, HCNW135 | 1 | kV/s | RL = 4.1 k, IF = 0 mA, TA = 25C, VCM = 10 Vp-p, CL = 15 pF | 12 | c, d, e | ||
| Common Mode Transient Immunity at Logic High Level Output | |CMH| | 6N136, HCPL-2502, HCPL-0501 | 1 | kV/s | RL = 1.9 k, IF = 0 mA, TA = 25C, VCM = 10 Vp-p, CL = 15 pF | 12 | c, d, e | ||
| Common Mode Transient Immunity at Logic Low Level Output | |CML| | 6N135, HCPL-0500, HCNW135 | 1 | kV/s | RL = 4.1 k, IF = 16 mA, TA = 25C, CL = 15 pF | 12 | c, d, e | ||
| Common Mode Transient Immunity at Logic Low Level Output | |CML| | 6N136, HCPL-2502, HCPL-0501 | 1 | kV/s | RL = 1.9 k, IF = 16 mA, TA = 25C, CL = 15 pF | 12 | c, d, e | ||
| Bandwidth | BW | 6N135/6, HCPL-2502, HCPL-0500/1 | 9 | MHz | See Test Circuit 8, 10 | f | |||
| Bandwidth | BW | HCNW135/6 | 11 | MHz | See Test Circuit 8, 10 | f |
| Parameter | Symbol | Device | Min. | Typ. | Max. | Units | Test Conditions | Note |
|---|---|---|---|---|---|---|---|---|
| Input-Output Momentary Withstand Voltage | VISO | 8-Pin DIP, SO-8 | 3750 | Vrms | RH < 50%, t = 1 min., TA = 25C | c, d | ||
| Input-Output Momentary Withstand Voltage | VISO | Widebody | 5000 | Vrms | RH < 50%, t = 1 min., TA = 25C | c, e | ||
| Input-Output Momentary Withstand Voltage | VISO | 8-Pin DIP (Option 020) | 5000 | Vrms | RH < 50%, t = 1 min., TA = 25C | c, e, f | ||
| Input-Output Leakage Current | II-O | 8-Pin DIP | 1 | A | 45% RH, t = 5s, VI-O = 3 kVdc, TA = 25C | c, g | ||
| Input-Output Resistance | RI-O | 8-Pin DIP, SO-8 | 1012 | VI-O = 500 Vdc | c | |||
| Input-Output Resistance | RI-O | Widebody | 1012 | 1013 | TA = 25C | c | ||
| Input-Output Resistance | RI-O | Widebody | 1011 | TA = 100C | c | |||
| Input-Output Capacitance | CI-O | 8-Pin DIP, SO-8 | 0.6 | pF | f = 1 MHz | c | ||
| Input-Output Capacitance | CI-O | Widebody | 0.5 | 0.6 | pF | f = 1 MHz | c |
The datasheet includes figures illustrating:
Normal static precautions should be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
300~500
Ecer Certification:
Verified Supplier
Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. Foun... Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture. Foun...
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