| Capacitance | 150nF |
| Operating Temperature | -40℃~+100℃ |
| Tolerance | ±5% |
| Voltage Rating | 2kV |
| Description | 150nF Film Capacitor ±5% 2kV Through Hole P=27.5mm |
| Mfr. Part # | MMKP154J3F2701 |
| Package | Through Hole,P=27.5mm |
| Model Number | MMKP154J3F2701 |
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Product Specification
| Capacitance | 150nF | Operating Temperature | -40℃~+100℃ |
| Tolerance | ±5% | Voltage Rating | 2kV |
| Description | 150nF Film Capacitor ±5% 2kV Through Hole P=27.5mm | Mfr. Part # | MMKP154J3F2701 |
| Package | Through Hole,P=27.5mm | Model Number | MMKP154J3F2701 |
The MMKP82 is a double-sided metallized polypropylene film capacitor (box-type) designed for high voltage and high-frequency pulse circuits. It features low loss, small internal temperature rise, a negative temperature coefficient of capacitance, and excellent flame resistance. Applications include electronic ballasts, compact fluorescent lamps, and snubber and SCR commutating circuits.
| Item | Specification | Test Method |
|---|---|---|
| Applicable Temperature Range | -40 — +105℃ | GB/T 10190 (IEC 60384-16) |
| Rated Voltage (UR) | 400VDC / 630VDC / 1000VDC / 1250VDC / 1600VDC / 2000VDC / 3000VDC | |
| Capacitance Range | 0.0022 – 1.8µF | |
| Capacitance Tolerance | ±2% (G), ±3% (H), ±5% (J), ±10% (K) | Ref. item 4.2.2 |
| Dissipation Factor (tgδ) | ≤ 0.0010 (20℃, 1KHz, 0.1V) | Ref. item 4.2.3 |
| Dielectric Strength | 1.6UR, 5s (No breakdown or arcing) | Ref. item 4.2.1 |
| Insulation Resistance (IR) | ≥50000MΩ, C≤0.33µF; IR≥30000, C>0.33µF; (100V, 20℃, 1min) | Ref. item 4.3 |
| Solderability | Good tin plating | Ref. item 4.5 (Soldering bath method Tb, Method 1A) |
| Lead Strength (Tensile) | 0.5 ≤ φd ≤ 0.8mm, 10N; 1.0 ≤ φd ≤ 1.2mm, 20N | Ref. item 4.3 |
| Lead Strength (Bending) | 0.5 ≤ φd ≤ 0.8mm, 5N; 1.0 ≤ φd ≤ 1.2mm, 10N (Two consecutive bends in each direction) | Ref. item 4.3 |
| Resistance to Soldering Heat | No visible damage, clear marking | Ref. item 4.4 (Soldering bath method Tb, Method 1A) |
| Capacitance Change (after soldering heat) | ≤ ±2% of initial measurement | |
| Dissipation Factor Increase (after soldering heat) | ≤ 0.0020 (10kHz, C≤1.0µF) / ≤ 0.0020 (1kHz, C>1µF) | |
| Insulation Resistance (after soldering heat) | ≥ 50% of rated value | |
| Rapid Temperature Cycling | No visible damage, clear marking | Ref. item 4.6 |
| Capacitance Change (after temp. cycling) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after temp. cycling) | ≤ 0.0020 (10kHz, C≤1.0µF) / ≤ 0.0020 (1kHz, C>1µF) | |
| Insulation Resistance (after temp. cycling) | ≥ 50% of rated value | |
| Climatic Sequence (Dry Heat, Damp Heat, Cold) | No visible damage, clear marking | Ref. item 4.10.2, 4.10.3, 4.10.4 |
| Capacitance Change (after climatic sequence) | ≤ ±3% of initial measurement | |
| Dissipation Factor Increase (after climatic sequence) | ≤ 0.0030 (10kHz, C≤1.0µF) / ≤ 0.0030 (1kHz, C>1µF) | |
| Insulation Resistance (after climatic sequence) | ≥ 50% of rated value | |
| Damp Heat (Steady State) | No obvious bulging, clear marking | Ref. item 4.11 |
| Capacitance Change (after damp heat) | ≤ ±2% of initial measurement | |
| Dissipation Factor Increase (after damp heat) | ≤ 0.0010 (1kHz) | |
| Insulation Resistance (after damp heat) | ≥ 90% of rated value | |
| Endurance | No visible damage, clear marking | Ref. item 4.12 |
| Capacitance Change (after endurance) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after endurance) | ≤ 0.0020 (10kHz) | |
| Insulation Resistance (after endurance) | ≥ 50% of rated value | |
| Characteristics Dependent on Temperature | Capacitance measurement at points b, d, f | Ref. item 4.2.6 |
| Charging and Discharging | No cracking or burning | Ref. item 4.13 |
| Capacitance Change (after charge/discharge) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after charge/discharge) | ≤ 0.0030 (10KHz, 0.1V) | |
| Dielectric Strength (after charge/discharge) | 1.6UR | |
| Insulation Resistance (after charge/discharge) | ≥ 50% of rated value | |
| Pulse Voltage | No cracking or burning | |
| Capacitance Change (after pulse voltage) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after pulse voltage) | ≤ 0.0020 (10kHz) | |
| Insulation Resistance (after pulse voltage) | ≥ 50% of rated value | |
| Ripple Current | No cracking or burning | |
| Capacitance Change (after ripple current) | ≤ ±10% of initial measurement | |
| Dissipation Factor Increase (after ripple current) | ≤ 0.0030 (10kHz, 0.1V) / ≤ 0.0030 (1kHz, 1V) | |
| Insulation Resistance (after ripple current) | ≥ 50% of rated value | |
| Flame Retardancy Test | No continued burning for >30S after flame removal, no ignition of cotton paper by dripping | IEC695-2-2 (Needle flame test) |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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