Capacitors with compact size and low leakage current KNSCHA 178MU0036 featuring

Product Specification

Product Overview

This series of capacitors utilizes imported high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology. They offer a compact size, low leakage current, and minimal dielectric loss, along with excellent frequency and temperature characteristics, long lifespan, high reliability, and stable performance. These capacitors operate within a wide temperature range and maintain stable performance after prolonged use or storage. They are suitable for advanced applications, computers, automotive, telecommunications, and home appliances. The products comply with the International Electrotechnical Commission IEC 384-15-3 technical specifications and the GB 7215-87 standard.

Product Attributes

• Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
• Technology: Laser printing
• Compliance Standards: IEC 384-15-3, GB 7215-87

Technical Specifications

Table 1: Performance Characteristics

Case Size (mm)

Capacitance Code and Rated Voltage

Marking and Packaging

• Marking: Standard product marking
• Packaging Form: T (Tape/Reel), B (Bulk)

Circuit Design Considerations

• Operating Voltage: Reduce voltage for higher reliability. In low impedance circuits, set operating voltage to 1/3 rated voltage; in other circuits, 2/3 rated voltage. Use a series resistor ( 3/Vs) to limit current to < 300mAs, or use voltage 1/3 rated voltage if a resistor cannot be inserted.
• Reverse Voltage: Tantalum capacitors are polarized; do not apply reverse voltage. In short durations, allowed reverse voltage is 10% Ur or 1V (at 25) and 5% Ur or 0.5V (at 85). Avoid using in AC-only circuits. Do not test polarized capacitors with a multimeter without considering polarity. Discard capacitors subjected to improper reverse voltage.
• Ripple Voltage: Operate within permissible ripple voltage. DC bias + AC peak must not exceed rated voltage. AC negative peak + DC bias must not exceed allowed reverse voltage. Limit ripple current to prevent thermal breakdown.
• Environmental Temperature: Use within specified temperature range. Derate voltage above +85. Confirm circuit characteristics at temperature limits. General derating to < 65% UR is recommended. Design with safety in mind, including protective circuits and redundant systems.
• Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics for high-frequency applications.
• Reliability: Failure rate varies with operating conditions (temperature, voltage, circuit resistance). Select products after thorough analysis of usage conditions.

Capacitor Mounting Precautions

• Avoid excessive mechanical or thermal shock during mounting to prevent electrical characteristic deterioration or short circuits.
• Do not apply excessive external force to the capacitor body or lead terminals.
• Do not reuse dropped or previously mounted capacitors.
• Do not process capacitors or bend terminals after installation.
• Avoid direct contact with lead wires with bare hands to prevent contamination affecting solderability.

Soldering and Cleaning

• Circuit Board Cleaning: Remove flux, acid, and alkali residues promptly. Cleaning temperature should be below 50. Total ultrasonic or steam immersion time should be within 5 minutes.
• Soldering Iron: Tip temperature 350, soldering time 4 seconds. Do not touch the capacitor body with the soldering iron tip.
• Chip Type Soldering: Avoid highly active, strong acidic fluxes. For wave soldering, preheat 160 within 2 minutes, cool slowly after soldering. For other methods, confirm and consult. Ensure proper solder pad size to prevent misalignment.

Environmental Restrictions

• Do not use in environments with direct contact with water, brine, or oil.
• Avoid direct sunlight.
• Avoid high temperature and high humidity leading to condensation.
• Avoid contact with reactive gases, acids, or bases.
• Avoid environments with high-frequency wave induction.
• Avoid environments with excessive vibration or shock.