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{"title":"High volume pick and place compatible capacitors VISHAY 293D476X9025D2TE3 with","imgUrl":"","attrs":{"Capacitance":"47uF","Current - Leakage":"-","Voltage Rating":"25V","Ripple Current":"-"}}
{"title":"Tantalum Capacitor for High Density Integration Xiangyee CA45-E016M227T Flake","imgUrl":"https:\/\/img.chinax.com\/nimg\/b8\/44\/310c787f27b10c15c4aec0377308-200x200-1\/tantalum_capacitor_for_high_density_integration_xiangyee_ca45_e016m227t_flake_solid_electrolyte_type.jpg","attrs":{"Description":"CASE-E-7343-43(mm) Tantalum Capacitors RoHS","Mfr. Part #":"CA45-E016M227T","Model Number":"CA45-E016M227T","Package":"CASE-E-7343-43(mm)"}}
These are solid tantalum chip capacitors specifically designed and manufactured for surface mount technology. They offer a lower equivalent series resistance (ESR) compared to CA42 resin-encapsulated products and are suitable for automatic surface mounting. Widely used in sophisticated , computer, and mobile phone applications, these capacitors adhere to EIA535BAAC and QC300801, Q/YHC.45-01 technical standards.
2% per 1000h at 85 with 0.1 /V series impedance, 60% confidence level
Case Codes
P, A, B, C, D, E (E1 mentioned in Chinese text)
ESR
Lower than CA42 resin-encapsulated products
Case Codes and Dimensions
Case Code
L (mm)
W (mm)
H (mm)
P (mm)
TW (mm)
P (2012)
2.0 0.2
1.2 0.2
1.2 0.2
0.5 0.2
1.2 0.1
A (3216)
3.2 0.2
1.6 0.2
1.6 0.2
0.8 0.3
1.2 0.1
B (3528)
3.5 0.2
2.8 0.2
1.9 0.2
0.8 0.3
2.2 0.1
C (6032)
6.0 0.3
3.2 0.3
2.5 0.3
1.3 0.3
2.2 0.1
D (7343)
7.3 0.3
4.3 0.3
2.8 0.3
1.3 0.3
2.4 0.1
E (7343H)
7.3 0.3
4.3 0.3
4.0 0.3
1.3 0.3
2.4 0.1
Capacitance and Voltage Combinations (Example Data)
Capacitance (F)
Case Code
Rated Voltage (V)
ESR ()
Max DCL (A)
Capacitance Change (%)
Max D.F (%)
22
C
20
3
44
10
8
22
B
20
2
44
10
8
33
E
20
1.5
66
10
8
33
C
20
3
66
10
9
47
E
20
1.5
94
10
8
47
C
20
2
94
10
12
68
E
20
1.5
136
10
8
100
E
20
2
200
10
12
0.15
A
25
21
5
10
6
0.33
A
25
15
5
10
6
0.47
A
25
14
5
10
6
0.68
A
25
17
5
10
6
1.0
B
25
6.5
5
10
6
1.0
A
25
16
5
10
6
1.5
B
25
6.5
5
10
8
1.5
A
25
16
5
10
8
2.2
C
25
5
5.5
10
8
2.2
B
25
8
5.5
10
8
2.2
A
25
16
5.5
10
9
3.3
C
25
4
8.2
10
8
3.3
B
25
7
8.2
10
8
3.3
A
25
9
8.2
12
9
4.7
C
25
2.5
11.7
10
8
4.7
B
25
6
11.7
10
8
6.8
C
25
3
17
10
8
6.8
B
25
6
17
10
8
10
E
25
1.2
25
10
8
10
C
25
4
25
10
8
10
B
25
6
25
12
8
15
E
25
1.5
37.5
10
8
15
C
25
4
37.5
10
8
22
E
25
1.8
55
10
8
22
C
25
3.5
55
12
9
33
E
25
1.5
82.5
10
8
47
E
25
1.5
117
12
8
68
E
25
2
170
15
8
0.1
A
35
34
5
10
6
0.15
A
35
21
5
10
6
0.22
A
35
18
5
10
6
0.33
A
35
15
5
10
6
0.47
B
35
10
5
10
6
0.47
A
35
18
5
10
6
0.68
B
35
8
5
10
6
0.68
A
35
17
5
10
6
1.0
B
35
6.5
5
10
6
1.0
A
35
16
5
10
6
1.5
C
35
4.5
5
10
6
1.5
B
35
12
5
10
6
Notes on Measurement Conditions
Capacitance and Dissipation Factor: Measurement voltage: U- = 2.2V 1.0V or U- = 1.0V 0.5V (RMS); Test frequency: 120Hz.
DC Leakage Current: Measured at rated voltage, with a charging time not exceeding 5 minutes. For 125 leakage current, category voltage is applied.
Equivalent Series Resistance (ESR): Measurement frequency (120 5) KHz; U- = 2.2V 1.0V or U- = 1.0V 0.5V (RMS).
Important Usage Considerations
Operating Voltage: To ensure reliability, reduce applied voltage in practical circuits, especially in low impedance circuits (recommend 1/3 rated voltage) and other circuits (recommend 2/3 rated voltage).
Reverse Voltage: Tantalum capacitors are polarized. Do not apply reverse voltage or use in AC-only circuits. Limited reverse voltage is permissible for short durations (10% U R or 1V at 25; 5% U R or 0.5V at 85).
Ripple Voltage: Operate within specified ripple voltage limits. The sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the allowable reverse voltage.
Ambient Temperature: Use within the specified operating temperature range. Voltage derating is required above +85.
Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics when used in high-frequency circuits.
Reliability: Failure rate varies with usage conditions (temperature, voltage, circuit resistance, etc.). Select products after thorough evaluation of operating conditions.
Mounting Precautions: Avoid excessive mechanical or thermal shock during mounting. Do not reuse dropped or previously mounted capacitors. Do not process or bend terminals after installation. Avoid direct contact with leads to prevent contamination.
Circuit Board Cleaning: Remove flux and residual acids/alkalis quickly. Cleaning temperature should be below 50. Total immersion time (ultrasonic, steam) should be within 5 minutes.
Soldering (Soldering Iron): Tip temperature below 350, duration within 4 seconds. Avoid touching the capacitor body.
Soldering (Chip Type): Avoid highly active or acidic fluxes. Consider component packaging and board variations for temperature. Use jet or reflection methods under specified conditions. For wave soldering, preheat below 160 for <2 minutes, and cool slowly. For other methods, consult manufacturer.
Reflow Soldering: Use under specified conditions.
Usage Environment: Do not use in environments with direct contact with water, brine, oil, direct sunlight, high temperature/humidity causing condensation, reactive gases, acids/alkalis, high-frequency waves, or excessive vibration/shock.
