Polarized Capacitor KNSCHA 178MU0033 with Moisture Proof Flame Retardant Epoxy

Product Specification

Product Overview

This product is an imported, high-quality, moisture-proof, and flame-retardant epoxy resin encapsulated capacitor utilizing laser printing technology. It offers a compact size, low leakage current and dielectric loss, excellent frequency and temperature characteristics, long lifespan, high reliability, and stable performance across a wide operating temperature range. Suitable for advanced , computer, automotive, communication, and home appliance applications, it adheres to IEC 384-15-3 technical specifications and GB 7215-87 standards. These small units provide high stable performance, low current leakage and dissipation factor, and stable frequency and temperature, making them ideal for equipment, computers, telephones, and other electronic products.

Product Attributes

• Encapsulation Material: Imported high-quality moisture-proof, flame-retardant epoxy resin
• Manufacturing Technology: Laser printing
• Standards Compliance: IEC 384-15-3, GB 7215-87
• Polarity: Polarized (Tantalum capacitors are polar capacitors)

Technical Specifications

Usage and Precautions

To ensure stable performance, verify operating conditions and specified performance before use. Adhere to all conditions in the specification sheet.

1.1 Operating Voltage

Capacitor failure is significantly influenced by the ratio of service voltage to rated voltage. In practical circuit design, reduce voltage appropriately based on required reliability. For low impedance circuits, set operating voltage below 1/3 of rated voltage; for other circuits, below 2/3 of rated voltage. Parallel use in low impedance circuits increases the risk of DC surge current failure. Control instantaneous large currents; a series resistor (3/Vs) is recommended to limit current below 300mAs. If a protection resistor cannot be used, operate below 1/3 of rated voltage.

1.2 Reverse Voltage

Tantalum capacitors are polarized; do not apply reverse voltage or use in AC-only circuits. If unavoidable, a small reverse voltage is permissible for short periods: 10% U_R or 1V (whichever is smaller) at 25; 5% U_R or 0.5V (whichever is smaller) at 85. For long-term use in reverse circuits, use non-polar capacitors. Do not test tantalum capacitors with multimeters without regard to polarity. If a capacitor is subjected to improper reverse voltage during measurement, it must be scrapped, even if electrical parameters remain within specifications.

1.3 Ripple Voltage

Use within the specified permissible ripple voltage. The sum of DC bias and AC peak voltage must not exceed the capacitor's rated voltage. The sum of the AC negative peak and DC bias must not exceed the capacitor's allowable reverse voltage. Ripple current causes power loss and increases the risk of thermal breakdown. Limit ripple current and allowable power loss.

1.4 Environmental Temperature

Use within the specified operating temperature range. Derate voltage when operating above +85. Temperature characteristics are crucial; confirm circuit performance at temperature limits. Generally, design capacitors based on a 1000-hour failure rate at +85 under continuous rated voltage. Voltage derating (recommended to below 65% U_R) is necessary to account for peak voltage/current surges, ripple current, and other electrical shocks. For safety-critical equipment, design with protective circuits, devices, and systems, and consider redundant circuits to prevent single-point failures.

1.5 Frequency Dependence

Electrical characteristics change significantly around 10kHz. Confirm circuit characteristics when using in high-frequency circuits.

1.6 Reliability

Failure rates vary with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Thoroughly evaluate usage conditions before selecting a product.

Installation and Handling Precautions

CAPACITOR MOUNING PRECAUTIONS

When mounting on a PCB, avoid excessive mechanical or thermal shock to prevent electrical characteristic deterioration or short circuits. Confirm actual installation conditions before use.

2.1 Processing and Measurement

Avoid applying excessive external force during use to prevent damage to the capacitor body or plating on lead terminals. Do not reuse dropped or previously installed capacitors. Do not process or bend terminals after installation. Avoid direct contact with bare hands on lead wires during measurement and use to prevent contamination from sweat or oil, which can lead to poor solderability.

2.2 Circuit Board Cleaning

When cleaning, quickly remove acids, alkalis, and flux used in soldering. Cleaning temperature should be below 50. Total immersion time for ultrasonic or steam cleaning should not exceed 5 minutes.

2.3 Soldering with Soldering Iron

Use a soldering iron tip temperature below 350 and for a duration within 4 seconds. Ensure the soldering iron tip does not touch the capacitor body.

2.4 Chip Type Soldering

For both manual and reflow soldering, avoid highly active or strong acidic fluxes to prevent penetration, corrosion, and diffusion after cleaning, which can affect reliability. Temperatures applied to components vary based on PCB, component type, size, and packaging. Chip tantalum capacitors can be soldered using jet or reflow methods under specified conditions.

Wave Soldering (Soldering Dip)

Fix the component to the circuit with adhesive and dip directly into the solder pot. Note: High mounting density can reduce solderability; ensure proper venting. Preheating should be below 160 for under 2 minutes. Cool slowly after soldering. For other methods like hot plate or vapor soldering, confirm and consult. If solder pads are significantly larger than terminal faces, solder melt may cause misalignment.

Reflow Method (Atmosphere Heating Method)

Use under specified conditions (details not provided in text).

2.2 Environmental Use

Do not use in environments with direct contact with water, brine, or oil; direct sunlight; high temperature and humidity causing condensation; exposure to reactive gases; acidic or alkaline environments; high-frequency wave induction; or excessive vibration or shock.