| Capacitance | 22nF |
| Tolerance | ±5% |
| Voltage Rating | 450V |
| Description | 22nF Film Capacitor ±5% 450V Through Hole P=7.5mm |
| Mfr. Part # | MPP223J2SB040C050ZR |
| Package | Through Hole,P=7.5mm |
| Model Number | MPP223J2SB040C050ZR |
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Product Specification
| Capacitance | 22nF | Tolerance | ±5% |
| Voltage Rating | 450V | Description | 22nF Film Capacitor ±5% 450V Through Hole P=7.5mm |
| Mfr. Part # | MPP223J2SB040C050ZR | Package | Through Hole,P=7.5mm |
| Model Number | MPP223J2SB040C050ZR |
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure with metallized polypropylene film and a tin-plated copper wire or tin-plated copper-clad steel wire lead. Encased in flame-retardant epoxy resin powder coating, they offer excellent self-healing properties, low loss, and low internal temperature rise. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits.
| Product Code | Capacitance (uF) | Tolerance (%) | Rated Voltage (V.dc) | Dissipation Factor (DF) (1KHz) (%) | Dimensions (mm) (L x W x H) | Pitch (P) (mm) | Lead Diameter (d) (mm) |
|---|---|---|---|---|---|---|---|
| MPP223J2SB040C050ZR | 0.022 | 5% | 450 | 0.1 | 8.7 x 7.4 x 3.7 | 7.5 | 0.6 |
| Parameter | Specification | Standard |
|---|---|---|
| Climatic Category | 40/105/21 | |
| Operating Temperature Range | -40 ~ +105 | |
| Rated Temperature | 85 | |
| Capacitance Range | 0.001F ~ 6.8F | |
| Capacitance Tolerance | 5%(K), 10%(M) | |
| Rated Voltage | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 450Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600Vdc, 2000Vdc | |
| Dissipation Factor (DF) (1kHz, 20) | 0.0010 | |
| Insulation Resistance | 30,000M for C0.33uF (100VDC, 60s) 10000M*uF for C>0.33uF (100VDC, 60s) | |
| Withstand Voltage | 1.6 UR(VDC), 5 seconds |
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Tin Layer | Zinc-tin alloy wire | -/- |
| 3 | Lead Wire | Tin-plated copper-clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame-retardant UL94V-0 |
| 5 | Inner Protection Material | Epoxy resin |
| No. | Item | Characteristic | Test Method |
|---|---|---|---|
| 1 | Terminal Strength | Tensile Strength | No visible mechanical damage. Wire diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds. |
| Bending Strength | Wire diameter: 0.6 & 0.8mm. Force: 5N, 90 x 2 times. | ||
| 2 | Solderability | Tinning rate of leads | 95%. Soldering temperature: 2455. Immersion time: 2.50.5 seconds. |
| 3 | Soldering Heat Resistance | Appearance | No visible damage. Soldering temperature: 2605. Immersion time: 101 seconds. Recovery time: 1-2 hours. |
| Increase in Dissipation Factor | 0.004 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz) | ||
| Capacitance Change | C/C3% | ||
| 4 | Temperature Rapid Change | Appearance | No visible damage. A=-40, B=+105, 5 cycles. Duration: t=30min. |
| Vibration | No visible damage. Amplitude 0.75mm or acceleration 98m/s (whichever is smaller), frequency 10-500Hz. Three directions, mutually perpendicular, 2h per direction, total 6h. | ||
| Shock | No visible damage. 4000 times, acceleration 390m/s, pulse duration 6ms. | ||
| Final Measurement | Appearance | No visible damage. | |
| Capacitance Change | C/C5% | ||
| Increase in Dissipation Factor | 0.004 | ||
| Insulation Resistance | IR/IR50% | ||
| 5 | Climatic Sequence | Appearance | No visible damage. Dry Heat +105, 16 hours. Cyclic Damp Heat, Test Db, first cycle. Cold -40, 2 hours. Low Pressure 8.5kPa, 1 hour. Cyclic Damp Heat, Test Db, remaining cycles. |
| Capacitance Change | C/C5% | ||
| Increase in Dissipation Factor | 0.005 | ||
| Insulation Resistance | IR/IR50% | ||
| 6 | Constant Damp Heat | Appearance | No visible damage. Relative Humidity 90-95%RH, Temperature: 402, No load, Duration: 21 days. Recovery time: 1-2 hours. |
| Capacitance Change | C/C5% | ||
| Increase in Dissipation Factor | 0.002 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz) | ||
| Insulation Resistance | IR/IR50% | ||
| 7 | Endurance | Appearance | No visible damage. T=85, 1000 hours. Applied Voltage: 1.25UR. |
| Capacitance Change | C/C8% | ||
| Increase in Dissipation Factor | 0.004 | ||
| Insulation Resistance | IR/IR50% | ||
| 8 | Characteristics Dependent on Temperature | Capacitance measurement at points b, d, f. | Static method, capacitor is held sequentially at each temperature: a.(202), b.(-403), d.(20 2), f.(1052), g.(202). |
| Characteristics at lower category temperature -40: | 0(Cb-Cd)/Cd+3% | ||
| Characteristics at upper category temperature 105: | -4.0%(Cf-Cd)/Cd0 | ||
| 9 | Charge and Discharge | Capacitance Change | C/C5% |
| Charge/Discharge Cycles | 10,000 | ||
| Charging Time | 0.5 seconds | ||
| Discharging Time | 0.5 seconds | ||
| Charging Voltage | Rated voltage UR | ||
| Charging Resistance | 220/CR () | ||
| Discharging Resistance | 10/CR or 20 (whichever is larger) | ||
| Increase in Dissipation Factor | 0.005 (10KHz, CR1.0uF); 0.005 (1KHz, CR>1.0uF) | ||
| Insulation Resistance | IR/IR50% |
Note: The curve represents typical values tested under conditions of sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.
(Refer to page 13 for diagrams)
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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