| Description | Through Hole,P=7.5mm Film Capacitors RoHS |
| Mfr. Part # | MPP104J2JB060B20NZR |
| Package | Through Hole,P=7.5mm |
| Model Number | MPP104J2JB060B20NZR |
View Detail Information
Explore similar products
interference suppression capacitor CHAMPION MPP475K0160D322818B2815 metallized
Low loss capacitor DGCX PPS682J3FA060C3F0ZR with impregnated type construction
Metallized Polypropylene Film Capacitor KYET KP684J2G1502 Featuring Plastic Case
Metallized polypropylene film capacitor Dersonic CFC2G684JG1I170GBCW1 with flame
Product Specification
| Description | Through Hole,P=7.5mm Film Capacitors RoHS | Mfr. Part # | MPP104J2JB060B20NZR |
| Package | Through Hole,P=7.5mm | Model Number | MPP104J2JB060B20NZR |
The CBB21/MPP series metallized polypropylene film capacitor (impregnated type) is an epoxy encapsulated component designed for electronic equipment. It features a non-inductive winding structure with metallized polypropylene film and tin-plated copper wire or tin-plated copper-clad steel leads. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, and low internal temperature rise, all encapsulated in a flame-retardant epoxy resin powder coating.
| Parameter | Specification | Test Method/Condition |
|---|---|---|
| Product Code | MPP104J2JB060B20NZR | N/A |
| Customer Part Number | N/A | N/A |
| Approval Certificate Number | CX-MPP-251118-01 | N/A |
| Issue Date | 2025-11-18 | N/A |
| Model | CBB21/MPP | N/A |
| Capacitance | 0.1uF 5% | N/A |
| Rated Voltage | 630V.dc | N/A |
| Pitch (P) | 7.5mm | N/A |
| Dimensions (W*H*T) | 9.5*9.1*5.8 mm | N/A |
| Low Noise | Yes | N/A |
| Climate Category | 40/105/21 | GB 10190, IEC60384-16 |
| Operating Temperature Range | -40~+105 | (Voltage derating 1.25% / for +85~+105) |
| Rated Temperature | 85 | N/A |
| Capacitance Range | 0.001F6.8F | N/A |
| Capacitance Tolerance | 5%(J), 10%(K) | N/A |
| Rated Voltage (DC) | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600 Vdc, 2000 Vdc | N/A |
| Dissipation Factor (DF) (1kHz, 20) | 0.0010 | N/A |
| Insulation Resistance | 30,000M for C0.33uF (100VDC, 60s) | N/A |
| Insulation Resistance | 10000M*uF for C>0.33uF (100VDC, 60s) | N/A |
| Dielectric Strength | 1.6UR(VDC), 5 seconds | N/A |
| Maximum Pulse Rise Rate (dV/dt) | See chart in source document (dependent on UR and Pitch) | N/A |
| Lead Strength (Tensile) | No visible mechanical damage | 10N, 10 seconds (for 0.6 & 0.8mm wire diameter) |
| Lead Strength (Bending) | No visible mechanical damage | 5N, 90x2 times (for 0.6 & 0.8mm wire diameter) |
| Solderability | 95% tinning rate on leads | 2455, 2.50.5 seconds |
| Soldering Heat Resistance | Appearance: No visible damage; DF increase 0.004; Capacitance change C/C3% | 2605, 101 seconds, 1-2 hours recovery |
| Rapid Temperature Change | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.004; Insulation Resistance IR/IR50% | 5 cycles of -40 (30min) to +105 (30min) |
| Vibration | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.004; Insulation Resistance IR/IR50% | Amplitude 0.75mm or 98m/s, 10-500Hz, 2h per direction (total 6h) |
| Impact | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.004; Insulation Resistance IR/IR50% | 4000 times, 390m/s, 6ms pulse duration |
| Climatic Sequence | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.005; Insulation Resistance IR/IR50% | Test Db cycles, Dry Heat (+105, 16h), Cold (-40, 2h), Low Pressure (8.5kPa, 1h) |
| Damp Heat (Steady State) | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.002 (C1.0F, 10kHz) or 0.004 (C>1.0F, 1kHz); Insulation Resistance IR/IR50% | 90-95%RH, 402, 21 days, 1-2 hours recovery |
| Endurance | Appearance: No visible damage; Capacitance change C/C8%; DF increase 0.004; Insulation Resistance IR/IR50% | 1000 hours at 85 with 1.25UR applied voltage |
| Characteristics with Temperature | See source document for specific capacitance change percentages at -40 and +105 relative to 20. | Static method, holding at specified temperatures (a, b, d, f, g) |
| Charge/Discharge | Capacitance change C/C5%; DF increase 0.005; Insulation Resistance IR/IR50% | 10,000 cycles (0.5s charge, 0.5s discharge) at UR, specific resistance values |
| Main Material: Metallized Polypropylene Film | MPPZAH | N/A |
| Main Material: Spraying Layer | Zinc-tin alloy wire | N/A |
| Main Material: Leads | Tin-plated copper-clad steel wire | N/A |
| Main Material: Outer Encapsulation | Epoxy resin powder | Flame retardant UL94V-0 |
| Main Material: Inner Protective Material | Epoxy resin | N/A |
| Packaging (Inner Box) | 34.5*23.5*24.5 cm (L*W*H) | N/A |
| Packaging (Outer Box) | 49*36*27 cm (L*W*H) | N/A |
| Storage Conditions | Temperature: Max 35, Relative Humidity: Max 80% | Original packaging, max 12 months from production date |
| Soldering Rules (Wave Soldering) | TP 110, 120s; Ts 120, 45s; For P7.5mm, T4mm: < 4 seconds | N/A |
| Soldering Rules (Soldering Iron) | Tip temperature 350, time 3 seconds | N/A |
| Soldering Rules (Reflow Soldering) | Not suitable for leaded film capacitors | N/A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Get in touch with us
Leave a Message, we will call you back quickly!