Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current Rating | 800mA |
| Number of Circuits | 1 |
| DC Resistance(DCR) | 150mΩ |
| Tolerance | ±25% |
| Impedance @ Frequency | 80Ω@100MHz |
| Description | 80Ω@100MHz 1 Line Ferrite Bead 0805 800mA 150mΩ |
| Mfr. Part # | ZECB201209A800-0A800 |
| Package | 0805 |
| Model Number | ZECB201209A800-0A800 |
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Product Specification
| Current Rating | 800mA | Number of Circuits | 1 |
| DC Resistance(DCR) | 150mΩ | Tolerance | ±25% |
| Impedance @ Frequency | 80Ω@100MHz | Description | 80Ω@100MHz 1 Line Ferrite Bead 0805 800mA 150mΩ |
| Mfr. Part # | ZECB201209A800-0A800 | Package | 0805 |
| Model Number | ZECB201209A800-0A800 |
This specification applies to the EBMS-2012 series Ferrite Chip EMI suppressors, designed for suppressing electromagnetic interference.
| PART NO | SPECIFICATION | IMPEDANCE () AT 100 MHz 500mV | DC RESISTANCE Max () | RATED CURRENT Max (mA) | OPERATING TEMP. RANGE | STORAGE TEMP. RANGE | DIMENSION L x W x T (mm) |
| EBMS201209A800 | Ferrite Chip EMI Suppressors | 8025% | 0.15 | 800 | -55 ~ +125 | -10 ~ +40 | 2.00.2 x 1.250.2 x 0.9+0.15/-0.2 |
| ITEM | TEST CONDITIONS | SPECIFICATION |
| Reflow soldering conditions | Preheating: temperature difference between solder and ferrite surface 150 max. Cooling into solvent 100 max. | - |
| Reflow soldering Temperature Profile | A: Slope of temp. rise 1 to 5 /sec B: Heat time 50 to 150 sec C: Heat temperature 120 to 180 D: Time over 230 90~120 sec E: Peak temperature 255~260 Peak hold time 10 max. sec No. of mounting 3 times | - |
| Reworking with soldering iron | Preheating 150, 1 minute Tip temperature 280 max Soldering time 3seconds max. Soldering iron output 30w max. End of soldering iron 3mm max. | Reworking limited to one time. |
| Solder Volume Upper Limit | - | - |
| EQUIPMENT - IMPEDANCE | HP4286A impedance analyzer or equivalent system | - |
| EQUIPMENT - DC RESISTANCE | HP 4338 digital miliohm meter with 4 terminal method | - |
| MECHANICAL CHARACTERISTICS - TERMINAL STRENGTH | Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec | Without deformation cases, impedance shall be satisfied 30%, DC resistance shall be satisfied. |
| MECHANICAL CHARACTERISTICS - Substrate BENDING | Bend the substrate by 3mm hold for 10s and then return. Soldering in accordance with recommended PC board pattern and reflow soldering. | Without deformation cases, impedance shall be satisfied 30%, DC resistance shall be satisfied. |
| MECHANICAL CHARACTERISTICS - RESISTANCE TO SOLDER HEAT | Solder Temp. : 2653, Immersion time : 61 sec, Preheating : 100 to 150, 1 minute. Measurement after 242 hrs at room temp. Solder : Sn-3Ag-0.5Cu | No visible damage. Electrical characteristics and mechanical characteristics shall be satisfied. |
| MECHANICAL CHARACTERISTICS - SOLDERABILITY | Solder temp. : 2405, Immersion time : 31 sec. Solder : Sn-3Ag-0.5Cu | 95% min. coverage of all metabolised area. Consult standard J-STD-002. |
| RELIABILITY AND TEST CONDITIONS - HIGH TEMPERATURE RESISTANCE | Temperature: 1252, Applied current: Rated current, Testing time: 100812hrs. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - HUMIDITY RESISTANCE | Humidity: 90 to 95% RH, Temperature: 602, Applied current: Rated current, Testing time: 100812hours. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - TEMPERATURE CYCLE | -55,+125 stabilized for 30 minutes each, 100 cycles. Measurement: After 24 hours at room ambient. Step1: -55 temp3 303 minutes. Step2: Standard atmospheric conditions 5s. Step3: +125 temp2 303 minutes. Step4: Standard atmospheric conditions 5s. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - LOW TEMPERATURE STORAGE LIFE TEST | Temperature: -552, Testing time: 100812hours. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - THERMAL SHOCK | -55,+125 stabilized for 30 minutes each, 100 cycles. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. |
| RELIABILITY AND TEST CONDITIONS - VIBRATION TEST | Waveform: Sine wave, Frequency: 10~55~10 Hz, Sweep time: 1min, Amplitude: 1.5mm(peak-peak), Direction: X,Y,Z (3 axes), Duration: 2 hrs./axis, total 6 hrs. | Appearance: no mechanical damage. Impedance: 30% of initial. |
| PAPER CARRIER TAPE PACKAGING - Dimensions | - | A: 1.450.05, B: 2.250.05, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.550.05, T: 0.950.05 |
| PAPER CARRIER TAPE PACKAGING - LEADER AND TRAILER TAPE | - | - |
| PAPER CARRIER TAPE PACKAGING - DIRECTION | Seen from the top of cover tape | - |
| REELS PACKING | - | QTY. 4,000 PCS/REEL |
| PEELING STRENGTH OF COVER TAPE | Peel angle: 165~180 vs carrier tape, Peel speed: 300mm/min | Cover tape (10g~100g) |
| PACKAGING | Tape & Reel packaging in composite specification 6/8 | Reel and desiccant in Nylon/plastic bag. Max 5 bags per inner box. Max 6 inner boxes per outer box. |
| Reel Label | - | Indicate (1) Pb Free (2) RoHS Compliant |
| STORAGE | Store at 40 or less and 70% RH or less. Avoid dust, harmful gas, heat, and direct sunlight. | To prevent deterioration of solderability and packaging material deformation. Minimum packages opened just before use. Solderability specified for 6 months from delivery if stored as specified. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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